AR006169A1 - Placa conductora y procedimiento para el equipamiento con elementos de construccion electronicos en posicion precisa - Google Patents

Placa conductora y procedimiento para el equipamiento con elementos de construccion electronicos en posicion precisa

Info

Publication number
AR006169A1
AR006169A1 ARP970100940A ARP970100940A AR006169A1 AR 006169 A1 AR006169 A1 AR 006169A1 AR P970100940 A ARP970100940 A AR P970100940A AR P970100940 A ARP970100940 A AR P970100940A AR 006169 A1 AR006169 A1 AR 006169A1
Authority
AR
Argentina
Prior art keywords
conductive plate
construction elements
electronic construction
attachments
electronic
Prior art date
Application number
ARP970100940A
Other languages
English (en)
Original Assignee
Kroth Rogerio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19610586A external-priority patent/DE19610586B4/de
Priority claimed from DE1996111631 external-priority patent/DE19611631C1/de
Priority claimed from DE19620340A external-priority patent/DE19620340C1/de
Application filed by Kroth Rogerio filed Critical Kroth Rogerio
Publication of AR006169A1 publication Critical patent/AR006169A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Fuses (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Welding (AREA)

Abstract

Se refiere a una placa conductora (1) y a un procedimiento para el posicionamiento preciso de los elementos de construcción electrónicos en lasuperficie (12) de la placa conductora (1), en cuyo caso los elementos de construcciónelectr ónicos han de ser unidos de forma eléctricamente conductivay estable en la placa conductora (1), mediante la técnica de soldadura Reflow. Para ello, se emplea una placa conductora (1) que dispone de zonas (2, 3),por lo menos parcialmenteadaptadas a los elementos de construcción electrónicos de la superficie (12) del contorno exterior, para el alojamientode los elementos de construcción electrónicos. Estas zonas que están configuradas como contornos dehendidura (3) o com o ranuras elaboradas (2),aseguran que los elementos de construcción electrónicos colocados quedan sujetados en la posición deseada, después de la aplicación de la pasta desoldar y antes de la propia realización desoldadura. Adicionalmente, se puede empalmar la placa conductora equipada, con una caja consistente en losaditamentos de configuración abovedada de un material por lo menos parcialmente conformable. Los aditamentos, atravesando la placaconductora,se introduc en en las escotaduras (14, 15 o 17) elaboradas en ella y así se consigue una unión contundente en forma y/o fuerza entre la caja y la placaconductora mediante la conformación de los aditamentos (14). Además se puedecolocar un enchufe de prot ección contra sobretensiones para las regletas de latécnica de telecomunicación con un descargador de sobretensión (4), que une las funciones de contacto a tierra y contacto fail-safe en una mismapieza y por lo tanto, sepuede realizar un equipamient o con un montaje con costes y esfuerzos reducidos.
ARP970100940A 1996-03-18 1997-03-10 Placa conductora y procedimiento para el equipamiento con elementos de construccion electronicos en posicion precisa AR006169A1 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19610586A DE19610586B4 (de) 1996-03-18 1996-03-18 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE1996111631 DE19611631C1 (de) 1996-03-25 1996-03-25 Modul mit einem Gehäuse und einer Grundplatte
DE19620340A DE19620340C1 (de) 1996-05-21 1996-05-21 Überspannungs - Schutzstecker

Publications (1)

Publication Number Publication Date
AR006169A1 true AR006169A1 (es) 1999-08-11

Family

ID=27216039

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP970100940A AR006169A1 (es) 1996-03-18 1997-03-10 Placa conductora y procedimiento para el equipamiento con elementos de construccion electronicos en posicion precisa

Country Status (29)

Country Link
US (1) US5999412A (es)
EP (1) EP0797379B1 (es)
JP (1) JPH104250A (es)
KR (1) KR19990008482A (es)
CN (1) CN1168078A (es)
AR (1) AR006169A1 (es)
AT (1) ATE224634T1 (es)
AU (1) AU713077B2 (es)
BG (1) BG62425B1 (es)
BR (1) BR9701324A (es)
CA (1) CA2199898A1 (es)
CO (1) CO4560406A1 (es)
CZ (1) CZ292485B6 (es)
DE (1) DE59708222D1 (es)
DK (1) DK0797379T3 (es)
ES (1) ES2183993T3 (es)
HU (1) HUP9700597A3 (es)
ID (1) ID16239A (es)
IL (1) IL120102A (es)
NO (1) NO970383L (es)
NZ (1) NZ314160A (es)
PL (1) PL182659B1 (es)
PT (1) PT797379E (es)
SG (1) SG52925A1 (es)
SI (1) SI0797379T1 (es)
TR (1) TR199700165A2 (es)
UA (1) UA42784C2 (es)
UY (1) UY24454A1 (es)
YU (1) YU48977B (es)

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DE19836456C1 (de) * 1998-08-12 2000-04-20 Kostal Leopold Gmbh & Co Kg Elektrische Leiterplatte und Verfahren zur Herstellung derselben
US6239977B1 (en) * 1999-05-17 2001-05-29 3Com Corporation Technique for mounting electronic components on printed circuit boards
AU2001292721A1 (en) * 2000-09-18 2002-03-26 Meder Electronic A lead-less surface mount reed relay
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DE102004046394B4 (de) * 2004-08-24 2007-03-01 Dehn + Söhne Gmbh + Co. Kg Steckbare Überspannungsschutz-Anordnung
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US20070047526A1 (en) * 2005-08-26 2007-03-01 Bryan Kennedy Systems and methods for conecting between telecommunications equipment
US7643631B2 (en) * 2005-08-26 2010-01-05 Adc Telecommunications, Inc. Enclosure for broadband service delivery system
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CN101295570B (zh) * 2007-04-25 2011-11-23 聚鼎科技股份有限公司 保护电路板和其过电流保护元件
DE102007050590B4 (de) * 2007-10-23 2017-04-13 Tyco Electronics Services Gmbh Verteileranschlussmodul
US7946863B2 (en) 2008-04-25 2011-05-24 Adc Telecommunications, Inc. Circuit protection block
US8411404B2 (en) * 2008-05-27 2013-04-02 Adc Telecommunications, Inc. Overvoltage protection plug
EP2790477B1 (en) 2013-04-08 2018-06-13 Electrolux Appliances Aktiebolag A fixing device for a capacitor and a cooking oven including a cooling channel with the fixing device
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Also Published As

Publication number Publication date
BG101319A (en) 1997-09-30
UY24454A1 (es) 1997-03-04
SG52925A1 (en) 1998-09-28
DK0797379T3 (da) 2003-01-06
CO4560406A1 (es) 1998-02-10
AU713077B2 (en) 1999-11-25
EP0797379A3 (de) 1998-01-07
ES2183993T3 (es) 2003-04-01
CA2199898A1 (en) 1997-09-18
NO970383D0 (no) 1997-01-29
US5999412A (en) 1999-12-07
PL318893A1 (en) 1997-09-29
DE59708222D1 (de) 2002-10-24
KR19990008482A (ko) 1999-02-05
BR9701324A (pt) 1998-09-08
BG62425B1 (bg) 1999-10-29
MX9701909A (es) 1997-09-30
AU1251397A (en) 1997-09-25
EP0797379A2 (de) 1997-09-24
IL120102A (en) 1997-04-15
TR199700165A2 (xx) 1997-10-21
HUP9700597A3 (en) 2000-04-28
CN1168078A (zh) 1997-12-17
HUP9700597A1 (en) 1997-12-29
ATE224634T1 (de) 2002-10-15
JPH104250A (ja) 1998-01-06
UA42784C2 (uk) 2001-11-15
CZ71697A3 (en) 1997-10-15
PL182659B1 (pl) 2002-02-28
NZ314160A (en) 1998-09-24
HU9700597D0 (en) 1997-05-28
YU9197A (sh) 2000-10-30
ID16239A (id) 1997-09-11
YU48977B (sh) 2003-02-28
SI0797379T1 (en) 2003-04-30
CZ292485B6 (cs) 2003-10-15
NO970383L (no) 1997-09-19
PT797379E (pt) 2003-02-28
EP0797379B1 (de) 2002-09-18

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Legal Events

Date Code Title Description
FA Abandonment or withdrawal