SG90205A1 - Process for producing semiconductor device - Google Patents
Process for producing semiconductor deviceInfo
- Publication number
- SG90205A1 SG90205A1 SG200006870A SG200006870A SG90205A1 SG 90205 A1 SG90205 A1 SG 90205A1 SG 200006870 A SG200006870 A SG 200006870A SG 200006870 A SG200006870 A SG 200006870A SG 90205 A1 SG90205 A1 SG 90205A1
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- adhesive layer
- dicing
- die bond
- individual chips
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 7
- 238000005336 cracking Methods 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/014—Solder alloys
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- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34033499A JP4409014B2 (ja) | 1999-11-30 | 1999-11-30 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG90205A1 true SG90205A1 (en) | 2002-07-23 |
Family
ID=18335954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200006870A SG90205A1 (en) | 1999-11-30 | 2000-11-28 | Process for producing semiconductor device |
Country Status (10)
Country | Link |
---|---|
US (1) | US6656819B1 (ko) |
EP (1) | EP1107299B1 (ko) |
JP (1) | JP4409014B2 (ko) |
KR (1) | KR100655035B1 (ko) |
CN (1) | CN1168132C (ko) |
DE (1) | DE60028912T2 (ko) |
HK (1) | HK1035261A1 (ko) |
MY (1) | MY125340A (ko) |
SG (1) | SG90205A1 (ko) |
TW (1) | TW487981B (ko) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4649745B2 (ja) | 2001-02-01 | 2011-03-16 | ソニー株式会社 | 発光素子の転写方法 |
JP4669162B2 (ja) * | 2001-06-28 | 2011-04-13 | 株式会社ディスコ | 半導体ウェーハの分割システム及び分割方法 |
US6686225B2 (en) * | 2001-07-27 | 2004-02-03 | Texas Instruments Incorporated | Method of separating semiconductor dies from a wafer |
JP2003045901A (ja) * | 2001-08-01 | 2003-02-14 | Sony Corp | 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法 |
JP2003077940A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法 |
JP3892703B2 (ja) | 2001-10-19 | 2007-03-14 | 富士通株式会社 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
TWI241674B (en) | 2001-11-30 | 2005-10-11 | Disco Corp | Manufacturing method of semiconductor chip |
JP4055405B2 (ja) * | 2001-12-03 | 2008-03-05 | ソニー株式会社 | 電子部品及びその製造方法 |
US7042072B1 (en) * | 2002-08-02 | 2006-05-09 | Amkor Technology, Inc. | Semiconductor package and method of manufacturing the same which reduces warpage |
JP4307825B2 (ja) * | 2002-08-28 | 2009-08-05 | リンテック株式会社 | 半導体ウエハの保護構造、半導体ウエハの保護方法、これらに用いる積層保護シートおよび半導体ウエハの加工方法 |
KR20050075280A (ko) * | 2002-11-19 | 2005-07-20 | 가부시키가이샤 이시카와 세이사쿠쇼 | 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판 |
JP4599075B2 (ja) * | 2003-03-26 | 2010-12-15 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
JP2004311576A (ja) * | 2003-04-03 | 2004-11-04 | Toshiba Corp | 半導体装置の製造方法 |
JP2004319045A (ja) * | 2003-04-18 | 2004-11-11 | Lintec Corp | 光ディスク製造用シートおよび光ディスク |
JP4234630B2 (ja) * | 2003-05-29 | 2009-03-04 | 古河電気工業株式会社 | 貫通構造を有する薄膜化回路基板の製造方法と保護用粘着テープ |
MY142246A (en) * | 2003-06-10 | 2010-11-15 | Hitachi Chemical Co Ltd | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device |
JP2005019571A (ja) * | 2003-06-24 | 2005-01-20 | Canon Inc | チップの実装方法及び実装基板の製造装置 |
GB2404280B (en) | 2003-07-03 | 2006-09-27 | Xsil Technology Ltd | Die bonding |
US20050023682A1 (en) * | 2003-07-31 | 2005-02-03 | Morio Nakao | High reliability chip scale package |
US7183137B2 (en) * | 2003-12-01 | 2007-02-27 | Taiwan Semiconductor Manufacturing Company | Method for dicing semiconductor wafers |
TWI320583B (en) * | 2003-12-26 | 2010-02-11 | Advanced Semiconductor Eng | Process for backside grinding a bumped wafer |
JP4165467B2 (ja) * | 2004-07-12 | 2008-10-15 | セイコーエプソン株式会社 | ダイシングシート、半導体装置の製造方法 |
JP4690697B2 (ja) * | 2004-11-01 | 2011-06-01 | 古河電気工業株式会社 | 半導体チップの製造方法 |
US7518217B2 (en) * | 2004-11-11 | 2009-04-14 | Yamaha Corporation | Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
US8124455B2 (en) * | 2005-04-02 | 2012-02-28 | Stats Chippac Ltd. | Wafer strength reinforcement system for ultra thin wafer thinning |
TWI267133B (en) * | 2005-06-03 | 2006-11-21 | Touch Micro System Tech | Method of segmenting a wafer |
CN100382281C (zh) * | 2005-06-14 | 2008-04-16 | 探微科技股份有限公司 | 晶片切割的方法 |
JP4791843B2 (ja) * | 2006-02-14 | 2011-10-12 | 株式会社ディスコ | 接着フィルム付きデバイスの製造方法 |
JP4874769B2 (ja) * | 2006-11-14 | 2012-02-15 | 株式会社東芝 | 表面保護テープ及びこの表面保護テープを用いた半導体装置の製造方法 |
SG148884A1 (en) * | 2007-06-15 | 2009-01-29 | Micron Technology Inc | Method and system for removing tape from substrates |
JP2009231779A (ja) * | 2008-03-25 | 2009-10-08 | Lintec Corp | 半導体装置の製造方法 |
JP4640498B2 (ja) * | 2008-12-11 | 2011-03-02 | ソニー株式会社 | 素子の転写方法、素子配置基板、並びにデバイス及びその製造方法 |
JP5426314B2 (ja) * | 2009-10-19 | 2014-02-26 | 株式会社ディスコ | 半導体デバイスの製造方法 |
KR101221871B1 (ko) * | 2009-12-07 | 2013-01-15 | 한국전자통신연구원 | 반도체 소자의 제조방법 |
CN102244039B (zh) * | 2010-05-11 | 2014-02-05 | 扬州杰利半导体有限公司 | 一种半导体晶片的裂片方法 |
JP5158896B2 (ja) * | 2010-08-09 | 2013-03-06 | 古河電気工業株式会社 | 半導体チップの製造方法 |
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Also Published As
Publication number | Publication date |
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TW487981B (en) | 2002-05-21 |
EP1107299A3 (en) | 2004-06-16 |
MY125340A (en) | 2006-07-31 |
EP1107299B1 (en) | 2006-06-21 |
JP2001156027A (ja) | 2001-06-08 |
KR20010051970A (ko) | 2001-06-25 |
DE60028912D1 (de) | 2006-08-03 |
US6656819B1 (en) | 2003-12-02 |
EP1107299A2 (en) | 2001-06-13 |
DE60028912T2 (de) | 2007-02-15 |
CN1298204A (zh) | 2001-06-06 |
CN1168132C (zh) | 2004-09-22 |
KR100655035B1 (ko) | 2006-12-07 |
JP4409014B2 (ja) | 2010-02-03 |
HK1035261A1 (en) | 2001-11-16 |
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