SG160407A1 - Epoxy resin composition and semiconductor device - Google Patents

Epoxy resin composition and semiconductor device

Info

Publication number
SG160407A1
SG160407A1 SG201001821-6A SG2010018216A SG160407A1 SG 160407 A1 SG160407 A1 SG 160407A1 SG 2010018216 A SG2010018216 A SG 2010018216A SG 160407 A1 SG160407 A1 SG 160407A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin composition
semiconductor device
butadiene
carboxyl group
Prior art date
Application number
SG201001821-6A
Other languages
English (en)
Inventor
Yasuhiro Mizuno
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG160407A1 publication Critical patent/SG160407A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG201001821-6A 2005-03-16 2006-03-13 Epoxy resin composition and semiconductor device SG160407A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005075843 2005-03-16

Publications (1)

Publication Number Publication Date
SG160407A1 true SG160407A1 (en) 2010-04-29

Family

ID=36991769

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001821-6A SG160407A1 (en) 2005-03-16 2006-03-13 Epoxy resin composition and semiconductor device

Country Status (8)

Country Link
US (2) US7629398B2 (ja)
JP (1) JP5487540B2 (ja)
KR (1) KR101205606B1 (ja)
CN (1) CN101137716B (ja)
MY (2) MY144436A (ja)
SG (1) SG160407A1 (ja)
TW (1) TWI388618B (ja)
WO (1) WO2006098425A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4565503B2 (ja) * 2005-03-16 2010-10-20 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP5162833B2 (ja) * 2006-02-24 2013-03-13 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5162835B2 (ja) * 2006-02-28 2013-03-13 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP4953930B2 (ja) * 2007-06-13 2012-06-13 キヤノン株式会社 インクジェット記録ヘッド及びその製造方法
JP2009144107A (ja) * 2007-12-18 2009-07-02 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP5228496B2 (ja) * 2008-01-16 2013-07-03 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US7911067B2 (en) * 2008-09-22 2011-03-22 Stats Chippac Ltd. Semiconductor package system with die support pad
CN102197339B (zh) * 2008-11-07 2015-03-04 住友电木株式会社 感光性树脂组合物、感光性粘接膜以及光接收装置
US8067484B2 (en) * 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
KR101309820B1 (ko) * 2010-12-29 2013-09-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
JP2013028746A (ja) 2011-07-29 2013-02-07 Sumitomo Chemical Co Ltd 液晶ポリエステルの製造方法
CN102731798B (zh) * 2012-07-05 2013-09-11 中国海洋石油总公司 一种自乳化型水性环氧树脂乳液及其制备方法
US9093383B1 (en) 2012-10-15 2015-07-28 Freescale Semiconductor, Inc. Encapsulant for a semiconductor device
US8853867B2 (en) 2012-10-15 2014-10-07 Freescale Semiconductor, Inc. Encapsulant for a semiconductor device
US9963588B2 (en) * 2014-05-12 2018-05-08 Diversified Chemical Technologies, Inc. Sprayable, carbon fiber-epoxy material and process
TWI723211B (zh) * 2016-09-23 2021-04-01 日商住友電木股份有限公司 熱硬化性樹脂組成物、樹脂密封基板及電子裝置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287952A (ja) * 1985-06-15 1986-12-18 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JPS6320319A (ja) * 1986-07-15 1988-01-28 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPS63230725A (ja) * 1987-03-20 1988-09-27 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPS63275625A (ja) * 1987-05-08 1988-11-14 Ube Ind Ltd 半導体封止用エポキシ樹脂組成物
JPS63286420A (ja) * 1987-05-20 1988-11-24 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
JPS649214A (en) * 1987-06-30 1989-01-12 Ube Industries Epoxy resin composition for sealing semiconductor
JPS6475556A (en) * 1987-09-18 1989-03-22 Fujitsu Ltd Epoxy resin composition for sealing semiconductor
JPH0256941A (ja) * 1988-08-20 1990-02-26 Matsushita Electric Works Ltd 半導体素子の封止方法
JPH07268079A (ja) * 1994-03-31 1995-10-17 Somar Corp エポキシ樹脂組成物
JPH093161A (ja) 1995-06-20 1997-01-07 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JPH09153570A (ja) * 1995-11-30 1997-06-10 Namitsukusu Kk 半導体封止用流動性樹脂組成物
JP3622937B2 (ja) 1995-12-28 2005-02-23 住友ベークライト株式会社 半導体封止用樹脂組成物
JPH10287794A (ja) 1997-04-16 1998-10-27 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JP3911088B2 (ja) * 1997-04-28 2007-05-09 日東電工株式会社 半導体装置
JPH11140274A (ja) * 1997-11-05 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JPH11140277A (ja) 1997-11-10 1999-05-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びこれを用いた半導体装置
JP2000044774A (ja) * 1998-07-28 2000-02-15 Toray Ind Inc 半導体封止用エポキシ樹脂組成物および半導体装置
JP2001089638A (ja) * 1999-09-22 2001-04-03 Toshiba Chem Corp 液状封止用樹脂組成物
JP2001310930A (ja) 2000-04-27 2001-11-06 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
JP4411760B2 (ja) 2000-09-06 2010-02-10 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2002097344A (ja) 2000-09-25 2002-04-02 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
JP3891550B2 (ja) * 2001-10-29 2007-03-14 住友ベークライト株式会社 液状樹脂組成物、半導体装置の製造方法及び半導体装置
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4296820B2 (ja) * 2003-03-31 2009-07-15 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR101055113B1 (ko) * 2003-10-20 2011-08-08 스미토모 베이클라이트 가부시키가이샤 에폭시 수지조성물 및 반도체장치

Also Published As

Publication number Publication date
CN101137716A (zh) 2008-03-05
CN101137716B (zh) 2011-04-20
US20060210805A1 (en) 2006-09-21
US7977412B2 (en) 2011-07-12
TW200643099A (en) 2006-12-16
JPWO2006098425A1 (ja) 2008-08-28
KR101205606B1 (ko) 2012-11-27
JP5487540B2 (ja) 2014-05-07
US20100016497A1 (en) 2010-01-21
TWI388618B (zh) 2013-03-11
KR20070118090A (ko) 2007-12-13
WO2006098425A1 (ja) 2006-09-21
MY157414A (en) 2016-06-15
US7629398B2 (en) 2009-12-08
MY144436A (en) 2011-09-15

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