SG158917A1 - Method of retaining a substrate to a wafer chuck - Google Patents

Method of retaining a substrate to a wafer chuck

Info

Publication number
SG158917A1
SG158917A1 SG201000531-2A SG2010005312A SG158917A1 SG 158917 A1 SG158917 A1 SG 158917A1 SG 2010005312 A SG2010005312 A SG 2010005312A SG 158917 A1 SG158917 A1 SG 158917A1
Authority
SG
Singapore
Prior art keywords
substrate
wafer chuck
retaining
velocity
chuck
Prior art date
Application number
SG201000531-2A
Other languages
English (en)
Inventor
Byung-Jin Choi
Anshuman Cherala
Yeong-Jun Choi
Mario J Meissl
Sidlgata V Sreenivasan
Norman E Schumaker
Xiaoming Lu
Ian M Mcmackin
Daniel A Babbs
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of SG158917A1 publication Critical patent/SG158917A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manipulator (AREA)
SG201000531-2A 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck SG158917A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate

Publications (1)

Publication Number Publication Date
SG158917A1 true SG158917A1 (en) 2010-02-26

Family

ID=39730623

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201000535-3A SG159498A1 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing
SG201000531-2A SG158917A1 (en) 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG201000535-3A SG159498A1 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing

Country Status (4)

Country Link
US (1) US7636999B2 (zh)
JP (3) JP5247153B2 (zh)
SG (2) SG159498A1 (zh)
TW (1) TWI327351B (zh)

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US7636999B2 (en) 2009-12-29
US20060172553A1 (en) 2006-08-03
JP2008529826A (ja) 2008-08-07
JP4648408B2 (ja) 2011-03-09
JP2008532263A (ja) 2008-08-14
JP5247153B2 (ja) 2013-07-24
TWI327351B (en) 2010-07-11
SG159498A1 (en) 2010-03-30
JP2008537513A (ja) 2008-09-18

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