SG144152A1 - Plasma doping method - Google Patents

Plasma doping method

Info

Publication number
SG144152A1
SG144152A1 SG200804532-0A SG2008045320A SG144152A1 SG 144152 A1 SG144152 A1 SG 144152A1 SG 2008045320 A SG2008045320 A SG 2008045320A SG 144152 A1 SG144152 A1 SG 144152A1
Authority
SG
Singapore
Prior art keywords
dose
time
doping method
substantially uniform
made substantially
Prior art date
Application number
SG200804532-0A
Other languages
English (en)
Inventor
Yuichiro Sasaki
Katsumi Okashita
Hiroyuki Ito
Bunji Mizuno
Tomohiro Okumura
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG144152A1 publication Critical patent/SG144152A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412Plasma immersion ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma Technology (AREA)
  • Thin Film Transistor (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Drying Of Semiconductors (AREA)
SG200804532-0A 2004-12-13 2005-12-12 Plasma doping method SG144152A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004360122 2004-12-13
JP2005128301 2005-04-26

Publications (1)

Publication Number Publication Date
SG144152A1 true SG144152A1 (en) 2008-07-29

Family

ID=36587827

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200804532-0A SG144152A1 (en) 2004-12-13 2005-12-12 Plasma doping method

Country Status (8)

Country Link
US (3) US7407874B2 (ja)
EP (1) EP1826814B8 (ja)
JP (1) JP5102495B2 (ja)
KR (1) KR101123788B1 (ja)
DE (1) DE602005025015D1 (ja)
SG (1) SG144152A1 (ja)
TW (1) TWI390610B (ja)
WO (1) WO2006064772A1 (ja)

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SG144152A1 (en) * 2004-12-13 2008-07-29 Matsushita Electric Ind Co Ltd Plasma doping method
EP1865537A1 (en) 2005-03-30 2007-12-12 Matsushita Electric Industrial Co., Ltd. Impurity introduction apparatus and method of impurity introduction
KR20070115907A (ko) * 2005-03-31 2007-12-06 마쯔시다덴기산교 가부시키가이샤 플라즈마 도핑 방법 및 장치
US7588990B2 (en) * 2006-08-31 2009-09-15 Applied Materials, Inc. Dynamic surface annealing of implanted dopants with low temperature HDPCVD process for depositing a high extinction coefficient optical absorber layer
US20080075880A1 (en) * 2006-09-26 2008-03-27 Anthony Renau Non-doping implantation process utilizing a plasma ion implantation system
WO2008041702A1 (fr) * 2006-10-03 2008-04-10 Panasonic Corporation Procédé et appareil de dopage de plasma
WO2008059827A1 (fr) * 2006-11-15 2008-05-22 Panasonic Corporation Procédé de dopage de plasma
WO2008090771A1 (ja) * 2007-01-22 2008-07-31 Panasonic Corporation 半導体装置及びその製造方法
US7820533B2 (en) * 2007-02-16 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Multi-step plasma doping with improved dose control
CN101681843B (zh) * 2007-06-20 2012-05-09 株式会社半导体能源研究所 半导体装置的制造方法
US8004045B2 (en) 2007-07-27 2011-08-23 Panasonic Corporation Semiconductor device and method for producing the same
US8063437B2 (en) 2007-07-27 2011-11-22 Panasonic Corporation Semiconductor device and method for producing the same
KR20100048954A (ko) 2007-07-27 2010-05-11 파나소닉 주식회사 반도체장치 및 그 제조방법
US20090104719A1 (en) * 2007-10-23 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System with In-Situ Chamber Condition Monitoring
KR100908820B1 (ko) * 2007-11-01 2009-07-21 주식회사 하이닉스반도체 플라즈마 도핑 방법 및 그를 이용한 반도체 소자의제조방법
US8030187B2 (en) 2007-12-28 2011-10-04 Panasonic Corporation Method for manufacturing semiconductor device
EP2311072B1 (en) 2008-07-06 2013-09-04 Imec Method for doping semiconductor structures
CN102124543B (zh) * 2008-08-15 2013-03-13 株式会社爱发科 等离子体掺杂方法及半导体装置的制造方法
JP5457045B2 (ja) 2009-02-12 2014-04-02 パナソニック株式会社 半導体装置及びその製造方法
US7994016B2 (en) * 2009-11-11 2011-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for obtaining quality ultra-shallow doped regions and device having same
JP2011129678A (ja) 2009-12-17 2011-06-30 Panasonic Corp 半導体装置及びその製造方法
JP2013051221A (ja) 2009-12-28 2013-03-14 Panasonic Corp 半導体装置の製造方法及びプラズマドーピング装置
US8796124B2 (en) 2011-10-25 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Doping method in 3D semiconductor device
US8574995B2 (en) 2011-11-10 2013-11-05 Taiwan Semiconductor Manufacturing Company, Ltd. Source/drain doping method in 3D devices
GB201202128D0 (en) * 2012-02-08 2012-03-21 Univ Leeds Novel material
US9224644B2 (en) 2012-12-26 2015-12-29 Intermolecular, Inc. Method to control depth profiles of dopants using a remote plasma source
US9558946B2 (en) * 2014-10-03 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. FinFETs and methods of forming FinFETs

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Also Published As

Publication number Publication date
TWI390610B (zh) 2013-03-21
TW200633025A (en) 2006-09-16
EP1826814B8 (en) 2011-04-13
US7348264B2 (en) 2008-03-25
EP1826814B1 (en) 2010-11-24
EP1826814A4 (en) 2008-07-02
JPWO2006064772A1 (ja) 2008-06-12
EP1826814A1 (en) 2007-08-29
KR20070086048A (ko) 2007-08-27
DE602005025015D1 (de) 2011-01-05
WO2006064772A1 (ja) 2006-06-22
KR101123788B1 (ko) 2012-03-12
US20070190759A1 (en) 2007-08-16
US20080318399A1 (en) 2008-12-25
US20070166846A1 (en) 2007-07-19
JP5102495B2 (ja) 2012-12-19
US7407874B2 (en) 2008-08-05

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