DE602005025015D1 - Plasma-dotierungsverfahren - Google Patents

Plasma-dotierungsverfahren

Info

Publication number
DE602005025015D1
DE602005025015D1 DE602005025015T DE602005025015T DE602005025015D1 DE 602005025015 D1 DE602005025015 D1 DE 602005025015D1 DE 602005025015 T DE602005025015 T DE 602005025015T DE 602005025015 T DE602005025015 T DE 602005025015T DE 602005025015 D1 DE602005025015 D1 DE 602005025015D1
Authority
DE
Germany
Prior art keywords
doping method
plasma doping
plasma
doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005025015T
Other languages
English (en)
Inventor
Yuichiro Sasaki
Katsumi Okashita
Hiroyuki Ito
Bunji Mizuno
T Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of DE602005025015D1 publication Critical patent/DE602005025015D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412Plasma immersion ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Thin Film Transistor (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE602005025015T 2004-12-13 2005-12-12 Plasma-dotierungsverfahren Active DE602005025015D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004360122 2004-12-13
JP2005128301 2005-04-26
PCT/JP2005/022799 WO2006064772A1 (ja) 2004-12-13 2005-12-12 プラズマドーピング方法

Publications (1)

Publication Number Publication Date
DE602005025015D1 true DE602005025015D1 (de) 2011-01-05

Family

ID=36587827

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005025015T Active DE602005025015D1 (de) 2004-12-13 2005-12-12 Plasma-dotierungsverfahren

Country Status (8)

Country Link
US (3) US7407874B2 (de)
EP (1) EP1826814B8 (de)
JP (1) JP5102495B2 (de)
KR (1) KR101123788B1 (de)
DE (1) DE602005025015D1 (de)
SG (1) SG144152A1 (de)
TW (1) TWI390610B (de)
WO (1) WO2006064772A1 (de)

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JPWO2005119745A1 (ja) * 2004-06-04 2008-04-03 松下電器産業株式会社 不純物導入方法
KR101123788B1 (ko) * 2004-12-13 2012-03-12 파나소닉 주식회사 플라즈마 도핑 방법
SG163544A1 (en) 2005-03-30 2010-08-30 Panasonic Corp Impurity introducing apparatus and impurity introducing method
KR20070115907A (ko) * 2005-03-31 2007-12-06 마쯔시다덴기산교 가부시키가이샤 플라즈마 도핑 방법 및 장치
US7588990B2 (en) * 2006-08-31 2009-09-15 Applied Materials, Inc. Dynamic surface annealing of implanted dopants with low temperature HDPCVD process for depositing a high extinction coefficient optical absorber layer
US20080075880A1 (en) * 2006-09-26 2008-03-27 Anthony Renau Non-doping implantation process utilizing a plasma ion implantation system
WO2008041702A1 (fr) * 2006-10-03 2008-04-10 Panasonic Corporation Procédé et appareil de dopage de plasma
WO2008059827A1 (fr) * 2006-11-15 2008-05-22 Panasonic Corporation Procédé de dopage de plasma
JP4866918B2 (ja) 2007-01-22 2012-02-01 パナソニック株式会社 半導体装置
US7820533B2 (en) * 2007-02-16 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Multi-step plasma doping with improved dose control
WO2008156040A1 (en) * 2007-06-20 2008-12-24 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US8063437B2 (en) 2007-07-27 2011-11-22 Panasonic Corporation Semiconductor device and method for producing the same
KR20100048954A (ko) 2007-07-27 2010-05-11 파나소닉 주식회사 반도체장치 및 그 제조방법
US8004045B2 (en) 2007-07-27 2011-08-23 Panasonic Corporation Semiconductor device and method for producing the same
US20090104719A1 (en) * 2007-10-23 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System with In-Situ Chamber Condition Monitoring
KR100908820B1 (ko) * 2007-11-01 2009-07-21 주식회사 하이닉스반도체 플라즈마 도핑 방법 및 그를 이용한 반도체 소자의제조방법
US8030187B2 (en) 2007-12-28 2011-10-04 Panasonic Corporation Method for manufacturing semiconductor device
JP2011527124A (ja) * 2008-07-06 2011-10-20 アイメック 半導体構造のドープ方法およびその半導体デバイス
CN102124543B (zh) * 2008-08-15 2013-03-13 株式会社爱发科 等离子体掺杂方法及半导体装置的制造方法
JP5457045B2 (ja) 2009-02-12 2014-04-02 パナソニック株式会社 半導体装置及びその製造方法
US7994016B2 (en) * 2009-11-11 2011-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for obtaining quality ultra-shallow doped regions and device having same
JP2011129678A (ja) 2009-12-17 2011-06-30 Panasonic Corp 半導体装置及びその製造方法
JP2013051221A (ja) 2009-12-28 2013-03-14 Panasonic Corp 半導体装置の製造方法及びプラズマドーピング装置
US8796124B2 (en) 2011-10-25 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Doping method in 3D semiconductor device
US8574995B2 (en) 2011-11-10 2013-11-05 Taiwan Semiconductor Manufacturing Company, Ltd. Source/drain doping method in 3D devices
GB201202128D0 (en) * 2012-02-08 2012-03-21 Univ Leeds Novel material
US9224644B2 (en) 2012-12-26 2015-12-29 Intermolecular, Inc. Method to control depth profiles of dopants using a remote plasma source
US9558946B2 (en) * 2014-10-03 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. FinFETs and methods of forming FinFETs

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CN1509494A (zh) * 2001-04-09 2004-06-30 ���µ�����ҵ��ʽ���� 表面处理方法和半导体装置的制造装置
US20020187614A1 (en) * 2001-04-16 2002-12-12 Downey Daniel F. Methods for forming ultrashallow junctions with low sheet resistance
US7135423B2 (en) * 2002-05-09 2006-11-14 Varian Semiconductor Equipment Associates, Inc Methods for forming low resistivity, ultrashallow junctions with low damage
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FR2847383B1 (fr) * 2002-11-14 2005-04-15 St Microelectronics Sa Procede de fabrication d'un transistor mos de longueur de grille reduite, et circuit integre comportant un tel transistor
JP4544447B2 (ja) * 2002-11-29 2010-09-15 パナソニック株式会社 プラズマドーピング方法
US20040147070A1 (en) * 2003-01-24 2004-07-29 National Chiao-Tung University Ultra-shallow junction formation for nano MOS devices using amorphous-si capping layer
TW200423185A (en) * 2003-02-19 2004-11-01 Matsushita Electric Ind Co Ltd Method of introducing impurity
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JP4303662B2 (ja) 2003-09-08 2009-07-29 パナソニック株式会社 プラズマ処理方法
KR101123788B1 (ko) * 2004-12-13 2012-03-12 파나소닉 주식회사 플라즈마 도핑 방법
CN101203933B (zh) * 2005-03-15 2010-05-19 瓦里安半导体设备公司 等离子体离子植入中的轮廓调整
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Also Published As

Publication number Publication date
EP1826814A1 (de) 2007-08-29
EP1826814A4 (de) 2008-07-02
JP5102495B2 (ja) 2012-12-19
KR20070086048A (ko) 2007-08-27
WO2006064772A1 (ja) 2006-06-22
US20080318399A1 (en) 2008-12-25
US7348264B2 (en) 2008-03-25
US20070190759A1 (en) 2007-08-16
US7407874B2 (en) 2008-08-05
TW200633025A (en) 2006-09-16
SG144152A1 (en) 2008-07-29
KR101123788B1 (ko) 2012-03-12
US20070166846A1 (en) 2007-07-19
EP1826814B1 (de) 2010-11-24
JPWO2006064772A1 (ja) 2008-06-12
EP1826814B8 (de) 2011-04-13
TWI390610B (zh) 2013-03-21

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