SG144152A1 - Plasma doping method - Google Patents

Plasma doping method

Info

Publication number
SG144152A1
SG144152A1 SG200804532-0A SG2008045320A SG144152A1 SG 144152 A1 SG144152 A1 SG 144152A1 SG 2008045320 A SG2008045320 A SG 2008045320A SG 144152 A1 SG144152 A1 SG 144152A1
Authority
SG
Singapore
Prior art keywords
dose
time
doping method
substantially uniform
made substantially
Prior art date
Application number
SG200804532-0A
Other languages
English (en)
Inventor
Yuichiro Sasaki
Katsumi Okashita
Hiroyuki Ito
Bunji Mizuno
Tomohiro Okumura
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG144152A1 publication Critical patent/SG144152A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412Plasma immersion ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Thin Film Transistor (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Drying Of Semiconductors (AREA)
SG200804532-0A 2004-12-13 2005-12-12 Plasma doping method SG144152A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004360122 2004-12-13
JP2005128301 2005-04-26

Publications (1)

Publication Number Publication Date
SG144152A1 true SG144152A1 (en) 2008-07-29

Family

ID=36587827

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200804532-0A SG144152A1 (en) 2004-12-13 2005-12-12 Plasma doping method

Country Status (8)

Country Link
US (3) US7407874B2 (de)
EP (1) EP1826814B8 (de)
JP (1) JP5102495B2 (de)
KR (1) KR101123788B1 (de)
DE (1) DE602005025015D1 (de)
SG (1) SG144152A1 (de)
TW (1) TWI390610B (de)
WO (1) WO2006064772A1 (de)

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US20080194086A1 (en) * 2004-06-04 2008-08-14 Yuichiro Sasaki Method of Introducing Impurity
WO2006064772A1 (ja) * 2004-12-13 2006-06-22 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法
EP1865537A1 (de) 2005-03-30 2007-12-12 Matsushita Electric Industrial Co., Ltd. Vorrichtung zur einführung von unreinheiten und verfahren zum einführen von unreinheiten
EP1865544A4 (de) * 2005-03-31 2010-12-22 Panasonic Corp Plasma-dotierungsverfahren und -vorrichtung
US7588990B2 (en) * 2006-08-31 2009-09-15 Applied Materials, Inc. Dynamic surface annealing of implanted dopants with low temperature HDPCVD process for depositing a high extinction coefficient optical absorber layer
US20080075880A1 (en) * 2006-09-26 2008-03-27 Anthony Renau Non-doping implantation process utilizing a plasma ion implantation system
CN101356625B (zh) * 2006-10-03 2012-05-23 松下电器产业株式会社 等离子体掺杂方法以及装置
JP5237820B2 (ja) * 2006-11-15 2013-07-17 パナソニック株式会社 プラズマドーピング方法
CN101601138B (zh) * 2007-01-22 2012-07-25 松下电器产业株式会社 半导体装置及其制造方法
US7820533B2 (en) * 2007-02-16 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Multi-step plasma doping with improved dose control
WO2008156040A1 (en) * 2007-06-20 2008-12-24 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US8063437B2 (en) 2007-07-27 2011-11-22 Panasonic Corporation Semiconductor device and method for producing the same
US8004045B2 (en) 2007-07-27 2011-08-23 Panasonic Corporation Semiconductor device and method for producing the same
JP4814960B2 (ja) 2007-07-27 2011-11-16 パナソニック株式会社 半導体装置の製造方法
US20090104719A1 (en) * 2007-10-23 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System with In-Situ Chamber Condition Monitoring
KR100908820B1 (ko) * 2007-11-01 2009-07-21 주식회사 하이닉스반도체 플라즈마 도핑 방법 및 그를 이용한 반도체 소자의제조방법
WO2009084130A1 (ja) 2007-12-28 2009-07-09 Panasonic Corporation 半導体装置の製造方法
EP2311072B1 (de) * 2008-07-06 2013-09-04 Imec Verfahren zum dotieren von halbleiterstrukturen
WO2010018797A1 (ja) 2008-08-15 2010-02-18 株式会社アルバック プラズマドーピング方法及び半導体装置の製造方法
JP5457045B2 (ja) 2009-02-12 2014-04-02 パナソニック株式会社 半導体装置及びその製造方法
US7994016B2 (en) * 2009-11-11 2011-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for obtaining quality ultra-shallow doped regions and device having same
JP2011129678A (ja) 2009-12-17 2011-06-30 Panasonic Corp 半導体装置及びその製造方法
JP2013051221A (ja) 2009-12-28 2013-03-14 Panasonic Corp 半導体装置の製造方法及びプラズマドーピング装置
US8796124B2 (en) 2011-10-25 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Doping method in 3D semiconductor device
US8574995B2 (en) 2011-11-10 2013-11-05 Taiwan Semiconductor Manufacturing Company, Ltd. Source/drain doping method in 3D devices
GB201202128D0 (en) * 2012-02-08 2012-03-21 Univ Leeds Novel material
US9224644B2 (en) 2012-12-26 2015-12-29 Intermolecular, Inc. Method to control depth profiles of dopants using a remote plasma source
US9558946B2 (en) * 2014-10-03 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. FinFETs and methods of forming FinFETs

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US20020187614A1 (en) * 2001-04-16 2002-12-12 Downey Daniel F. Methods for forming ultrashallow junctions with low sheet resistance
US7135423B2 (en) * 2002-05-09 2006-11-14 Varian Semiconductor Equipment Associates, Inc Methods for forming low resistivity, ultrashallow junctions with low damage
JP4749713B2 (ja) * 2002-06-26 2011-08-17 セムエキップ インコーポレイテッド 水素化ホウ素クラスターイオンの注入によるイオン注入方法及び半導体製造方法
JP4013674B2 (ja) 2002-07-11 2007-11-28 松下電器産業株式会社 プラズマドーピング方法及び装置
US7238597B2 (en) * 2002-09-27 2007-07-03 Brontek Delta Corporation Boron ion delivery system
FR2847383B1 (fr) * 2002-11-14 2005-04-15 St Microelectronics Sa Procede de fabrication d'un transistor mos de longueur de grille reduite, et circuit integre comportant un tel transistor
JP4544447B2 (ja) * 2002-11-29 2010-09-15 パナソニック株式会社 プラズマドーピング方法
US20040147070A1 (en) * 2003-01-24 2004-07-29 National Chiao-Tung University Ultra-shallow junction formation for nano MOS devices using amorphous-si capping layer
TW200423185A (en) * 2003-02-19 2004-11-01 Matsushita Electric Ind Co Ltd Method of introducing impurity
JP2005005328A (ja) 2003-06-09 2005-01-06 Matsushita Electric Ind Co Ltd 不純物導入方法、不純物導入装置およびこれを用いて形成された半導体装置
JP4619951B2 (ja) * 2003-08-25 2011-01-26 パナソニック株式会社 不純物導入層の形成方法
US20050045507A1 (en) * 2003-08-29 2005-03-03 Meyer Scott Edward Storage box for HotWheelsR or MatchboxR die-cast model vehicles
KR101076516B1 (ko) * 2003-09-08 2011-10-24 파나소닉 주식회사 플라즈마 처리방법 및 장치
JP4303662B2 (ja) 2003-09-08 2009-07-29 パナソニック株式会社 プラズマ処理方法
WO2006064772A1 (ja) * 2004-12-13 2006-06-22 Matsushita Electric Industrial Co., Ltd. プラズマドーピング方法
CN101203933B (zh) * 2005-03-15 2010-05-19 瓦里安半导体设备公司 等离子体离子植入中的轮廓调整
US7601404B2 (en) * 2005-06-09 2009-10-13 United Microelectronics Corp. Method for switching decoupled plasma nitridation processes of different doses
US7879701B2 (en) * 2005-06-30 2011-02-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
EP1826814A4 (de) 2008-07-02
US7348264B2 (en) 2008-03-25
TW200633025A (en) 2006-09-16
KR101123788B1 (ko) 2012-03-12
KR20070086048A (ko) 2007-08-27
EP1826814A1 (de) 2007-08-29
US20070190759A1 (en) 2007-08-16
US7407874B2 (en) 2008-08-05
EP1826814B1 (de) 2010-11-24
WO2006064772A1 (ja) 2006-06-22
TWI390610B (zh) 2013-03-21
US20080318399A1 (en) 2008-12-25
DE602005025015D1 (de) 2011-01-05
EP1826814B8 (de) 2011-04-13
JPWO2006064772A1 (ja) 2008-06-12
US20070166846A1 (en) 2007-07-19
JP5102495B2 (ja) 2012-12-19

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