SG129385A1 - Packaging for high speed integrated circuits - Google Patents
Packaging for high speed integrated circuitsInfo
- Publication number
- SG129385A1 SG129385A1 SG200604689A SG200604689A SG129385A1 SG 129385 A1 SG129385 A1 SG 129385A1 SG 200604689 A SG200604689 A SG 200604689A SG 200604689 A SG200604689 A SG 200604689A SG 129385 A1 SG129385 A1 SG 129385A1
- Authority
- SG
- Singapore
- Prior art keywords
- lead
- pad
- adjacent
- packaging
- high speed
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2924/151—Die mounting substrate
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70170105P | 2005-07-22 | 2005-07-22 | |
US72227205P | 2005-09-30 | 2005-09-30 | |
US11/248,985 US20070018292A1 (en) | 2005-07-22 | 2005-10-12 | Packaging for high speed integrated circuits |
US11/472,904 US7884451B2 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/472,697 US20070096277A1 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/472,953 US20070018289A1 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/473,702 US7638870B2 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
US11/474,198 US20070018294A1 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
US11/473,631 US20070018293A1 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
SG129385A1 true SG129385A1 (en) | 2007-02-26 |
Family
ID=37398828
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200604688A SG129384A1 (en) | 2005-07-22 | 2006-07-13 | Packaging for high speed integrated circuits |
SG200604689A SG129385A1 (en) | 2005-07-22 | 2006-07-13 | Packaging for high speed integrated circuits |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200604688A SG129384A1 (en) | 2005-07-22 | 2006-07-13 | Packaging for high speed integrated circuits |
Country Status (3)
Country | Link |
---|---|
EP (3) | EP1746648A3 (ja) |
JP (3) | JP5110814B2 (ja) |
SG (2) | SG129384A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8446735B2 (en) | 2008-12-26 | 2013-05-21 | International Business Machines Corporation | Semiconductor package |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008218776A (ja) * | 2007-03-06 | 2008-09-18 | Renesas Technology Corp | 半導体装置 |
US9200973B2 (en) * | 2012-06-28 | 2015-12-01 | Intel Corporation | Semiconductor package with air pressure sensor |
JP6190295B2 (ja) | 2014-03-12 | 2017-08-30 | 株式会社東芝 | 半導体チップ、および半導体パッケージ |
CN115085706A (zh) * | 2021-03-11 | 2022-09-20 | 台达电子企业管理(上海)有限公司 | 开关模块 |
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US3110339A (en) | 1962-01-02 | 1963-11-12 | Lawrence K Fickel | Ventilated pneumatic tire structure and method of fabricating the tire |
US3627901A (en) * | 1969-12-19 | 1971-12-14 | Texas Instruments Inc | Composite electronic device package-connector unit |
JPS5754354A (ja) * | 1980-09-18 | 1982-03-31 | Matsushita Electronics Corp | Handotaishusekikairosochi |
JPS6018944A (ja) | 1983-07-12 | 1985-01-31 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置のリ−ドフレ−ム |
JPS61127635U (ja) * | 1985-01-26 | 1986-08-11 | ||
JPS62140446A (ja) * | 1985-12-16 | 1987-06-24 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS63102233U (ja) * | 1986-12-22 | 1988-07-02 | ||
JPH03261152A (ja) * | 1990-03-10 | 1991-11-21 | Nec Corp | 半導体集積回路装置 |
JP2654291B2 (ja) * | 1991-12-18 | 1997-09-17 | 川崎製鉄株式会社 | 半導体装置用パッケージのリード配線 |
JPH05235245A (ja) * | 1992-02-26 | 1993-09-10 | Hitachi Ltd | 半導体集積回路装置 |
JPH05243472A (ja) * | 1992-02-27 | 1993-09-21 | Nec Ic Microcomput Syst Ltd | 半導体集積回路 |
JP2985479B2 (ja) * | 1992-03-04 | 1999-11-29 | 株式会社日立製作所 | 半導体メモリおよび半導体メモリモジュール |
US5214845A (en) * | 1992-05-11 | 1993-06-01 | Micron Technology, Inc. | Method for producing high speed integrated circuits |
JPH0645504A (ja) * | 1992-07-21 | 1994-02-18 | Miyazaki Oki Electric Co Ltd | 半導体装置 |
JPH06204390A (ja) * | 1993-01-07 | 1994-07-22 | Fujitsu Ltd | 半導体装置 |
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-
2006
- 2006-07-06 EP EP06014061A patent/EP1746648A3/en not_active Withdrawn
- 2006-07-10 EP EP06014260A patent/EP1746650A3/en not_active Withdrawn
- 2006-07-10 EP EP06014259A patent/EP1746649A3/en not_active Withdrawn
- 2006-07-13 SG SG200604688A patent/SG129384A1/en unknown
- 2006-07-13 SG SG200604689A patent/SG129385A1/en unknown
- 2006-07-14 JP JP2006194503A patent/JP5110814B2/ja not_active Expired - Fee Related
- 2006-07-14 JP JP2006194500A patent/JP4764277B2/ja not_active Expired - Fee Related
- 2006-07-14 JP JP2006194499A patent/JP5149493B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8446735B2 (en) | 2008-12-26 | 2013-05-21 | International Business Machines Corporation | Semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
EP1746650A2 (en) | 2007-01-24 |
EP1746648A3 (en) | 2008-09-03 |
JP5110814B2 (ja) | 2012-12-26 |
JP2007043146A (ja) | 2007-02-15 |
JP5149493B2 (ja) | 2013-02-20 |
JP2007059884A (ja) | 2007-03-08 |
SG129384A1 (en) | 2007-02-26 |
EP1746649A3 (en) | 2008-09-10 |
EP1746648A2 (en) | 2007-01-24 |
EP1746649A2 (en) | 2007-01-24 |
JP2007059885A (ja) | 2007-03-08 |
JP4764277B2 (ja) | 2011-08-31 |
EP1746650A3 (en) | 2008-09-10 |
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