SG124420A1 - Coating and developing system and coating and developing method - Google Patents

Coating and developing system and coating and developing method

Info

Publication number
SG124420A1
SG124420A1 SG200600834A SG200600834A SG124420A1 SG 124420 A1 SG124420 A1 SG 124420A1 SG 200600834 A SG200600834 A SG 200600834A SG 200600834 A SG200600834 A SG 200600834A SG 124420 A1 SG124420 A1 SG 124420A1
Authority
SG
Singapore
Prior art keywords
coating
developing
developing method
developing system
Prior art date
Application number
SG200600834A
Other languages
English (en)
Inventor
Masami Akimoto
Shinichi Hayashi
Yasushi Hayashida
Nobuaki Matsuoka
Yoshio Kimura
Issei Ueda
Hikaru Ito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG124420A1 publication Critical patent/SG124420A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200600834A 2005-01-21 2006-01-20 Coating and developing system and coating and developing method SG124420A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005014716 2005-01-21
JP2005294579A JP4955977B2 (ja) 2005-01-21 2005-10-07 塗布、現像装置及びその方法

Publications (1)

Publication Number Publication Date
SG124420A1 true SG124420A1 (en) 2006-08-30

Family

ID=35708755

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200600834A SG124420A1 (en) 2005-01-21 2006-01-20 Coating and developing system and coating and developing method

Country Status (6)

Country Link
US (1) US7281869B2 (https=)
EP (1) EP1684333B1 (https=)
JP (1) JP4955977B2 (https=)
KR (1) KR101121794B1 (https=)
SG (1) SG124420A1 (https=)
TW (1) TW200643639A (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
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JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Sokudo 基板処理装置
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4654120B2 (ja) * 2005-12-08 2011-03-16 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びにコンピュータプログラム
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2008072016A (ja) * 2006-09-15 2008-03-27 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP5149513B2 (ja) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2009004478A (ja) * 2007-06-20 2009-01-08 Toshiba Corp パターン形成方法及び半導体装置の製造方法
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010118557A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法
JP4760919B2 (ja) * 2009-01-23 2011-08-31 東京エレクトロン株式会社 塗布、現像装置
US20100192844A1 (en) * 2009-01-30 2010-08-05 Semes Co., Ltd. Apparatus and method for treating substrate
JP2010192623A (ja) * 2009-02-17 2010-09-02 Renesas Electronics Corp 半導体装置の製造装置、その制御方法、及びその制御プログラム
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5562759B2 (ja) * 2009-11-04 2014-07-30 東京エレクトロン株式会社 基板処理装置
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JP2014038929A (ja) * 2012-08-15 2014-02-27 Disco Abrasive Syst Ltd インラインシステム
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP5664701B2 (ja) * 2013-06-05 2015-02-04 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5590201B2 (ja) * 2013-08-13 2014-09-17 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5644916B2 (ja) * 2013-08-13 2014-12-24 東京エレクトロン株式会社 塗布、現像装置
JP2013243406A (ja) * 2013-08-13 2013-12-05 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5926752B2 (ja) * 2014-02-20 2016-05-25 東京エレクトロン株式会社 半導体装置の製造方法及び半導体製造装置
JP6262634B2 (ja) * 2014-10-31 2018-01-17 東京エレクトロン株式会社 基板処理装置
JP6426223B2 (ja) * 2017-03-31 2018-11-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7251673B2 (ja) * 2017-06-16 2023-04-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN111650813B (zh) * 2019-03-04 2024-04-16 东京毅力科创株式会社 基板处理装置、基板检查装置及方法、以及记录介质
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7486378B2 (ja) * 2020-08-07 2024-05-17 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
JP7546617B2 (ja) * 2022-03-22 2024-09-06 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム及び基板搬送方法
CN117019567A (zh) * 2023-10-10 2023-11-10 常州捷佳创智能装备有限公司 一种硅片上料涂覆机构、涂布平台、硅片涂布机

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JP3445937B2 (ja) * 1998-06-24 2003-09-16 東京エレクトロン株式会社 多段スピン型基板処理システム
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JP4307132B2 (ja) * 2003-04-16 2009-08-05 大日本スクリーン製造株式会社 基板処理装置
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JP4129215B2 (ja) * 2003-09-17 2008-08-06 大日本スクリーン製造株式会社 基板処理装置
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JP3993549B2 (ja) * 2003-09-30 2007-10-17 株式会社東芝 レジストパターン形成方法
JP4401879B2 (ja) * 2004-07-07 2010-01-20 東京エレクトロン株式会社 基板の回収方法及び基板処理装置
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense

Also Published As

Publication number Publication date
JP4955977B2 (ja) 2012-06-20
US20060165409A1 (en) 2006-07-27
EP1684333B1 (en) 2012-09-12
EP1684333A2 (en) 2006-07-26
KR101121794B1 (ko) 2012-03-20
TW200643639A (en) 2006-12-16
JP2006229184A (ja) 2006-08-31
US7281869B2 (en) 2007-10-16
EP1684333A3 (en) 2011-06-15
KR20060085190A (ko) 2006-07-26
TWI367397B (https=) 2012-07-01

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