SG11201903019XA - Method for dissolving a buried oxide in a silicon-on-insulator wafer - Google Patents

Method for dissolving a buried oxide in a silicon-on-insulator wafer

Info

Publication number
SG11201903019XA
SG11201903019XA SG11201903019XA SG11201903019XA SG11201903019XA SG 11201903019X A SG11201903019X A SG 11201903019XA SG 11201903019X A SG11201903019X A SG 11201903019XA SG 11201903019X A SG11201903019X A SG 11201903019XA SG 11201903019X A SG11201903019X A SG 11201903019XA
Authority
SG
Singapore
Prior art keywords
silicon
international
buried oxide
insulator wafer
dissolving
Prior art date
Application number
SG11201903019XA
Other languages
English (en)
Inventor
Frédéric Allibert
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201903019XA publication Critical patent/SG11201903019XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76825—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Formation Of Insulating Films (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG11201903019XA 2016-10-13 2017-09-29 Method for dissolving a buried oxide in a silicon-on-insulator wafer SG11201903019XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1659917A FR3057705B1 (fr) 2016-10-13 2016-10-13 Procede de dissolution d'un oxyde enterre dans une plaquette de silicium sur isolant
PCT/EP2017/074823 WO2018069067A1 (en) 2016-10-13 2017-09-29 Method for dissolving a buried oxide in a silicon-on-insulator wafer

Publications (1)

Publication Number Publication Date
SG11201903019XA true SG11201903019XA (en) 2019-05-30

Family

ID=57583305

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903019XA SG11201903019XA (en) 2016-10-13 2017-09-29 Method for dissolving a buried oxide in a silicon-on-insulator wafer

Country Status (9)

Country Link
US (1) US10847370B2 (zh)
JP (1) JP6801154B2 (zh)
KR (1) KR102217707B1 (zh)
CN (1) CN109844911B (zh)
DE (1) DE112017005180T5 (zh)
FR (1) FR3057705B1 (zh)
SG (1) SG11201903019XA (zh)
TW (1) TWI641040B (zh)
WO (1) WO2018069067A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11069560B2 (en) * 2016-11-01 2021-07-20 Shin-Etsu Chemical Co., Ltd. Method of transferring device layer to transfer substrate and highly thermal conductive substrate

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078116A (ja) * 2001-08-31 2003-03-14 Canon Inc 半導体部材の製造方法及び半導体装置の製造方法
US6784072B2 (en) * 2002-07-22 2004-08-31 International Business Machines Corporation Control of buried oxide in SIMOX
US6664598B1 (en) * 2002-09-05 2003-12-16 International Business Machines Corporation Polysilicon back-gated SOI MOSFET for dynamic threshold voltage control
US20050170570A1 (en) * 2004-01-30 2005-08-04 International Business Machines Corporation High electrical quality buried oxide in simox
US8138061B2 (en) * 2005-01-07 2012-03-20 International Business Machines Corporation Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide
US7867906B2 (en) * 2005-06-22 2011-01-11 Nec Corporation Semiconductor device and method for manufacturing same
JP2007180416A (ja) * 2005-12-28 2007-07-12 Siltronic Ag Ｓｏｉウェーハの製造方法
FR2936356B1 (fr) * 2008-09-23 2010-10-22 Soitec Silicon On Insulator Procede de dissolution locale de la couche d'oxyde dans une structure de type semi-conducteur sur isolant
FR2937794A1 (fr) * 2008-10-28 2010-04-30 Soitec Silicon On Insulator Procede de traitement d'une structure de type semi-conducteur sur isolant par dissolution selective de sa couche d'oxyde
FR2938118B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de fabrication d'un empilement de couches minces semi-conductrices
FR2941324B1 (fr) * 2009-01-22 2011-04-29 Soitec Silicon On Insulator Procede de dissolution de la couche d'oxyde dans la couronne d'une structure de type semi-conducteur sur isolant.
US20100244206A1 (en) 2009-03-31 2010-09-30 International Business Machines Corporation Method and structure for threshold voltage control and drive current improvement for high-k metal gate transistors
EP2381470B1 (en) * 2010-04-22 2012-08-22 Soitec Semiconductor device comprising a field-effect transistor in a silicon-on-insulator structure
US8796116B2 (en) * 2011-01-31 2014-08-05 Sunedison Semiconductor Limited Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods
JP2012204501A (ja) * 2011-03-24 2012-10-22 Sony Corp 半導体装置、電子デバイス、及び、半導体装置の製造方法
FR2980916B1 (fr) * 2011-10-03 2014-03-28 Soitec Silicon On Insulator Procede de fabrication d'une structure de type silicium sur isolant
US8637381B2 (en) * 2011-10-17 2014-01-28 International Business Machines Corporation High-k dielectric and silicon nitride box region
JP2013157586A (ja) 2012-01-27 2013-08-15 Mtec:Kk 化合物半導体
US8633118B2 (en) 2012-02-01 2014-01-21 Tokyo Electron Limited Method of forming thin metal and semi-metal layers by thermal remote oxygen scavenging
FR3003684B1 (fr) * 2013-03-25 2015-03-27 Soitec Silicon On Insulator Procede de dissolution d'une couche de dioxyde de silicium.
KR102336517B1 (ko) 2015-09-24 2021-12-07 에스케이텔레콤 주식회사 심볼 입력 방법 및 그 장치

Also Published As

Publication number Publication date
US20190259617A1 (en) 2019-08-22
KR20190047083A (ko) 2019-05-07
KR102217707B1 (ko) 2021-02-19
CN109844911A (zh) 2019-06-04
US10847370B2 (en) 2020-11-24
FR3057705B1 (fr) 2019-04-12
TWI641040B (zh) 2018-11-11
JP6801154B2 (ja) 2020-12-16
JP2019535144A (ja) 2019-12-05
WO2018069067A1 (en) 2018-04-19
FR3057705A1 (fr) 2018-04-20
CN109844911B (zh) 2023-03-24
DE112017005180T5 (de) 2019-07-04
TW201814785A (zh) 2018-04-16

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