SG11201802520YA - Wafer inspection method and wafer inspection device - Google Patents
Wafer inspection method and wafer inspection deviceInfo
- Publication number
- SG11201802520YA SG11201802520YA SG11201802520YA SG11201802520YA SG11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer inspection
- inspection device
- inspection method
- wafer
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
- G01R31/287—Procedures; Software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015194390A JP6515007B2 (ja) | 2015-09-30 | 2015-09-30 | ウエハ検査方法及びウエハ検査装置 |
| PCT/JP2016/070923 WO2017056643A1 (ja) | 2015-09-30 | 2016-07-11 | ウエハ検査方法及びウエハ検査装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201802520YA true SG11201802520YA (en) | 2018-04-27 |
Family
ID=58423417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201802520YA SG11201802520YA (en) | 2015-09-30 | 2016-07-11 | Wafer inspection method and wafer inspection device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10416229B2 (zh) |
| JP (1) | JP6515007B2 (zh) |
| KR (1) | KR102012608B1 (zh) |
| CN (1) | CN108140590B (zh) |
| SG (1) | SG11201802520YA (zh) |
| TW (1) | TWI720019B (zh) |
| WO (1) | WO2017056643A1 (zh) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3052869B1 (fr) * | 2016-06-17 | 2018-06-22 | Unity Semiconductor | Dispositif de positionnement d'une plaquette de circuit integre, et appareil d'inspection d'une plaquette de circuit integre comprenant un tel dispositif de positionnement |
| US10840121B2 (en) | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
| WO2018235411A1 (ja) * | 2017-06-21 | 2018-12-27 | 東京エレクトロン株式会社 | 検査システム |
| JP7174316B2 (ja) * | 2018-02-26 | 2022-11-17 | 株式会社東京精密 | 荷重分散板 |
| JP2020047860A (ja) * | 2018-09-20 | 2020-03-26 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
| JP7101577B2 (ja) * | 2018-09-21 | 2022-07-15 | 株式会社日本マイクロニクス | 検査方法及び検査システム |
| JP7257880B2 (ja) * | 2019-05-23 | 2023-04-14 | 東京エレクトロン株式会社 | 試験用ウエハおよび試験方法 |
| JP7267111B2 (ja) * | 2019-05-31 | 2023-05-01 | 東京エレクトロン株式会社 | 位置決め機構及び位置決め方法 |
| JP6906128B2 (ja) * | 2019-06-26 | 2021-07-21 | 末晴 宮川 | ウエハー試験装置 |
| JP7281981B2 (ja) | 2019-06-27 | 2023-05-26 | 東京エレクトロン株式会社 | プローバおよびプローブカードのプリヒート方法 |
| JP7458161B2 (ja) * | 2019-09-24 | 2024-03-29 | 東京エレクトロン株式会社 | 検査装置の制御方法および検査装置 |
| JP7412208B2 (ja) * | 2020-02-17 | 2024-01-12 | 東京エレクトロン株式会社 | 搬送装置、処理システム及び搬送方法 |
| KR20210115439A (ko) | 2020-03-13 | 2021-09-27 | 손서용 | 셔틀콕 자동 수거 및 적재 장치 |
| JP7437991B2 (ja) * | 2020-03-25 | 2024-02-26 | 東京エレクトロン株式会社 | 検査装置、及び、チャックトップの位置調整方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3219844B2 (ja) * | 1992-06-01 | 2001-10-15 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH0621166A (ja) * | 1992-06-30 | 1994-01-28 | Mitsubishi Electric Corp | ウエハプローバ |
| JPH11251379A (ja) | 1998-02-27 | 1999-09-17 | Toshiba Microelectronics Corp | ウエハプロービング装置 |
| DE10296944T5 (de) * | 2001-06-18 | 2004-04-29 | Advantest Corp. | Prüfkontaktsystem, das eine Planaritätseinstellmechanismus besitzt |
| JP2006258687A (ja) * | 2005-03-18 | 2006-09-28 | Koyo Technos:Kk | 検査装置 |
| US7764076B2 (en) * | 2007-02-20 | 2010-07-27 | Centipede Systems, Inc. | Method and apparatus for aligning and/or leveling a test head |
| JP5295588B2 (ja) * | 2008-02-28 | 2013-09-18 | 東京エレクトロン株式会社 | プローブカードの傾き調整方法、プローブカードの傾き検出方法及びプローブカードの傾き検出方法を記録したプログラム記録媒体 |
| JP5889581B2 (ja) * | 2010-09-13 | 2016-03-22 | 東京エレクトロン株式会社 | ウエハ検査装置 |
| JP2013175572A (ja) * | 2012-02-24 | 2013-09-05 | Tokyo Electron Ltd | プローブ装置及びプローブカードの平行調整機構 |
| JP6031292B2 (ja) * | 2012-07-31 | 2016-11-24 | 東京エレクトロン株式会社 | プローブカードへの基板当接方法 |
| JP6099347B2 (ja) | 2012-10-03 | 2017-03-22 | 東京エレクトロン株式会社 | ウエハ取り付け方法及びウエハ検査装置 |
| JP2014115115A (ja) * | 2012-12-06 | 2014-06-26 | Advantest Corp | 補正装置、プローブ装置、および試験装置 |
| CN104280651B (zh) * | 2013-07-10 | 2018-08-17 | 晶豪科技股份有限公司 | 测试系统以及半导体元件 |
| JP5737536B2 (ja) * | 2013-11-21 | 2015-06-17 | 株式会社東京精密 | プローバ |
| JP6423660B2 (ja) * | 2014-09-09 | 2018-11-14 | 東京エレクトロン株式会社 | ウエハ検査装置における検査用圧力設定値決定方法 |
| JP5747428B2 (ja) * | 2015-02-06 | 2015-07-15 | 株式会社東京精密 | 位置決め固定装置 |
| US9927463B2 (en) * | 2015-10-20 | 2018-03-27 | International Business Machines Corporation | Wafer probe alignment |
-
2015
- 2015-09-30 JP JP2015194390A patent/JP6515007B2/ja active Active
-
2016
- 2016-07-11 SG SG11201802520YA patent/SG11201802520YA/en unknown
- 2016-07-11 US US15/763,312 patent/US10416229B2/en active Active
- 2016-07-11 KR KR1020187008271A patent/KR102012608B1/ko active IP Right Grant
- 2016-07-11 CN CN201680058149.2A patent/CN108140590B/zh active Active
- 2016-07-11 WO PCT/JP2016/070923 patent/WO2017056643A1/ja active Application Filing
- 2016-09-23 TW TW105130840A patent/TWI720019B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20180275192A1 (en) | 2018-09-27 |
| CN108140590B (zh) | 2022-05-17 |
| CN108140590A (zh) | 2018-06-08 |
| JP2017069428A (ja) | 2017-04-06 |
| JP6515007B2 (ja) | 2019-05-15 |
| US10416229B2 (en) | 2019-09-17 |
| KR20180043814A (ko) | 2018-04-30 |
| WO2017056643A1 (ja) | 2017-04-06 |
| KR102012608B1 (ko) | 2019-08-20 |
| TW201727242A (zh) | 2017-08-01 |
| TWI720019B (zh) | 2021-03-01 |
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