HK1223192A1 - 半導體器件及其製造方法 - Google Patents

半導體器件及其製造方法

Info

Publication number
HK1223192A1
HK1223192A1 HK16110877.9A HK16110877A HK1223192A1 HK 1223192 A1 HK1223192 A1 HK 1223192A1 HK 16110877 A HK16110877 A HK 16110877A HK 1223192 A1 HK1223192 A1 HK 1223192A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
HK16110877.9A
Other languages
English (en)
Inventor
武藤晃
板東晃司
佐藤幸弘
禦田村和宏
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1223192A1 publication Critical patent/HK1223192A1/zh

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    • B60L15/007—Physical arrangements or structures of drive train converters specially adapted for the propulsion motors of electric vehicles
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
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    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
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JP6619119B1 (ja) * 2018-03-01 2019-12-11 新電元工業株式会社 半導体装置
JP6437701B1 (ja) * 2018-05-29 2018-12-12 新電元工業株式会社 半導体モジュール
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CN111370382A (zh) * 2018-12-25 2020-07-03 恩智浦美国有限公司 用于具有改进的爬电距离的半导体管芯封装的混合引线框架
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