HK1251718A1 - 半導體裝置及其製造方法 - Google Patents
半導體裝置及其製造方法Info
- Publication number
- HK1251718A1 HK1251718A1 HK18111007.8A HK18111007A HK1251718A1 HK 1251718 A1 HK1251718 A1 HK 1251718A1 HK 18111007 A HK18111007 A HK 18111007A HK 1251718 A1 HK1251718 A1 HK 1251718A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016256057A JP2018107416A (ja) | 2016-12-28 | 2016-12-28 | 半導体装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1251718A1 true HK1251718A1 (zh) | 2019-02-01 |
Family
ID=60452546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18111007.8A HK1251718A1 (zh) | 2016-12-28 | 2018-08-27 | 半導體裝置及其製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10643930B2 (zh) |
EP (1) | EP3343607A1 (zh) |
JP (1) | JP2018107416A (zh) |
KR (1) | KR20180077015A (zh) |
CN (1) | CN108364939B (zh) |
HK (1) | HK1251718A1 (zh) |
TW (1) | TW201830538A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018137342A (ja) * | 2017-02-22 | 2018-08-30 | 株式会社村田製作所 | 半導体装置及びその製造方法 |
JP7147859B2 (ja) * | 2018-10-05 | 2022-10-05 | 富士電機株式会社 | 半導体装置、半導体モジュールおよび車両 |
US20210043466A1 (en) * | 2019-08-06 | 2021-02-11 | Texas Instruments Incorporated | Universal semiconductor package molds |
US20220278017A1 (en) * | 2021-02-26 | 2022-09-01 | Infineon Technologies Austria Ag | Power Electronics Carrier |
WO2024038736A1 (ja) * | 2022-08-19 | 2024-02-22 | ローム株式会社 | 半導体装置 |
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JP3646970B2 (ja) * | 1998-05-27 | 2005-05-11 | 松下電器産業株式会社 | 半導体集積回路及び半導体集積回路装置 |
JP2002299540A (ja) * | 2001-04-04 | 2002-10-11 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP4471600B2 (ja) * | 2003-08-20 | 2010-06-02 | 三洋電機株式会社 | 回路装置 |
JP4744320B2 (ja) | 2005-04-04 | 2011-08-10 | パナソニック株式会社 | リードフレーム |
JP2008135606A (ja) * | 2006-11-29 | 2008-06-12 | Renesas Technology Corp | 半導体装置 |
JP5618873B2 (ja) * | 2011-03-15 | 2014-11-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5865220B2 (ja) * | 2012-09-24 | 2016-02-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2014220439A (ja) * | 2013-05-10 | 2014-11-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
JP2015043398A (ja) | 2013-08-26 | 2015-03-05 | ルネサスエレクトロニクス株式会社 | 半導体装置、設計方法及び、設計支援プログラム |
JP6420617B2 (ja) * | 2014-09-30 | 2018-11-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6791621B2 (ja) * | 2015-09-11 | 2020-11-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9806043B2 (en) * | 2016-03-03 | 2017-10-31 | Infineon Technologies Ag | Method of manufacturing molded semiconductor packages having an optical inspection feature |
JP6603169B2 (ja) * | 2016-04-22 | 2019-11-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
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TW201830538A (zh) | 2018-08-16 |
CN108364939B (zh) | 2023-01-06 |
US20180182692A1 (en) | 2018-06-28 |
KR20180077015A (ko) | 2018-07-06 |
EP3343607A1 (en) | 2018-07-04 |
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