HK1223733A1 - 半導體裝置及半導體裝置的製造方法 - Google Patents
半導體裝置及半導體裝置的製造方法Info
- Publication number
- HK1223733A1 HK1223733A1 HK16111898.2A HK16111898A HK1223733A1 HK 1223733 A1 HK1223733 A1 HK 1223733A1 HK 16111898 A HK16111898 A HK 16111898A HK 1223733 A1 HK1223733 A1 HK 1223733A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- manufacturing
- manufacturing semiconductor
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014265184A JP6357415B2 (ja) | 2014-12-26 | 2014-12-26 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1223733A1 true HK1223733A1 (zh) | 2017-08-04 |
Family
ID=56165112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16111898.2A HK1223733A1 (zh) | 2014-12-26 | 2016-10-14 | 半導體裝置及半導體裝置的製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9548285B2 (zh) |
JP (1) | JP6357415B2 (zh) |
KR (1) | KR20160079652A (zh) |
CN (2) | CN205452275U (zh) |
HK (1) | HK1223733A1 (zh) |
TW (1) | TW201635478A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6357415B2 (ja) * | 2014-12-26 | 2018-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
DE102015100262A1 (de) * | 2015-01-09 | 2016-07-14 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Verfahren zum Herstellen eines Chipgehäuses sowie Verfahren zum Herstellen eines optoelektronischen Bauelements |
WO2017168537A1 (ja) * | 2016-03-29 | 2017-10-05 | 三菱電機株式会社 | 樹脂封止型電力半導体装置の製造方法 |
CN107093595A (zh) * | 2017-05-03 | 2017-08-25 | 广东气派科技有限公司 | 一种引线框单元、引线框架及基于引线框单元的封装器件 |
KR101862191B1 (ko) * | 2017-12-07 | 2018-05-29 | 에스에스오트론 주식회사 | 반도체 제작용 리드와, 이 리드를 이송시키는 지그 |
CN110223967A (zh) * | 2019-05-30 | 2019-09-10 | 无锡红光微电子股份有限公司 | Dfn-6l三基岛封装框架 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56100456A (en) * | 1980-01-16 | 1981-08-12 | Hitachi Ltd | Lead frame |
JPS5890751A (ja) * | 1982-11-15 | 1983-05-30 | Hitachi Ltd | リ−ドフレ−ムの製法 |
JPS63281453A (ja) * | 1987-05-13 | 1988-11-17 | Mitsubishi Electric Corp | 半導体装置のリ−ド加工方法及びその装置 |
JP2724491B2 (ja) * | 1989-02-01 | 1998-03-09 | 株式会社日立製作所 | 成形装置 |
JP2536184B2 (ja) | 1989-09-19 | 1996-09-18 | 日本電気株式会社 | 半導体装置用リ―ドフレ―ム |
JPH05315525A (ja) | 1992-05-12 | 1993-11-26 | Nec Corp | 半導体装置用リードフレーム |
JPH0669406A (ja) * | 1992-05-28 | 1994-03-11 | Nec Corp | 集積回路装置 |
TW276357B (zh) * | 1993-03-22 | 1996-05-21 | Motorola Inc | |
US5920113A (en) * | 1996-08-13 | 1999-07-06 | Motorola, Inc. | Leadframe structure having moveable sub-frame |
JP5155890B2 (ja) * | 2008-06-12 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5479247B2 (ja) * | 2010-07-06 | 2014-04-23 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2013239625A (ja) * | 2012-05-16 | 2013-11-28 | Renesas Electronics Corp | 半導体装置の製造方法及びリードフレーム |
JP6357415B2 (ja) * | 2014-12-26 | 2018-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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2014
- 2014-12-26 JP JP2014265184A patent/JP6357415B2/ja active Active
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2015
- 2015-11-19 TW TW104138294A patent/TW201635478A/zh unknown
- 2015-12-03 CN CN201520995315.4U patent/CN205452275U/zh not_active Withdrawn - After Issue
- 2015-12-03 CN CN201510881338.7A patent/CN105742269B/zh active Active
- 2015-12-09 KR KR1020150174739A patent/KR20160079652A/ko unknown
- 2015-12-18 US US14/973,925 patent/US9548285B2/en active Active
-
2016
- 2016-10-14 HK HK16111898.2A patent/HK1223733A1/zh unknown
Also Published As
Publication number | Publication date |
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CN105742269A (zh) | 2016-07-06 |
KR20160079652A (ko) | 2016-07-06 |
US9548285B2 (en) | 2017-01-17 |
CN205452275U (zh) | 2016-08-10 |
US20160190115A1 (en) | 2016-06-30 |
CN105742269B (zh) | 2019-04-09 |
JP2016127067A (ja) | 2016-07-11 |
TW201635478A (zh) | 2016-10-01 |
JP6357415B2 (ja) | 2018-07-11 |
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