TWI560764B - Pick up device and pick up method of semiconductor die - Google Patents
Pick up device and pick up method of semiconductor dieInfo
- Publication number
- TWI560764B TWI560764B TW104101196A TW104101196A TWI560764B TW I560764 B TWI560764 B TW I560764B TW 104101196 A TW104101196 A TW 104101196A TW 104101196 A TW104101196 A TW 104101196A TW I560764 B TWI560764 B TW I560764B
- Authority
- TW
- Taiwan
- Prior art keywords
- pick
- semiconductor die
- die
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014033351 | 2014-02-24 | ||
JP2014225729A JP6349496B2 (en) | 2014-02-24 | 2014-11-06 | Semiconductor die pickup apparatus and pickup method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201533794A TW201533794A (en) | 2015-09-01 |
TWI560764B true TWI560764B (en) | 2016-12-01 |
Family
ID=53877914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104101196A TWI560764B (en) | 2014-02-24 | 2015-01-14 | Pick up device and pick up method of semiconductor die |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6349496B2 (en) |
KR (1) | KR102043120B1 (en) |
CN (1) | CN105900225B (en) |
SG (1) | SG11201607050YA (en) |
TW (1) | TWI560764B (en) |
WO (1) | WO2015125385A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6707396B2 (en) * | 2016-05-11 | 2020-06-10 | 株式会社ディスコ | Cutting equipment |
JP6621771B2 (en) * | 2017-01-25 | 2019-12-18 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
CN106768991B (en) * | 2017-03-10 | 2020-04-07 | 东莞市凯格精机股份有限公司 | Method for finely detecting working state of suction nozzle |
JP6891281B2 (en) * | 2017-07-04 | 2021-06-18 | 株式会社Fuji | Component mounting device |
KR102037967B1 (en) * | 2018-05-30 | 2019-10-29 | 세메스 주식회사 | Die bonding method |
TWI745710B (en) * | 2018-07-06 | 2021-11-11 | 日商新川股份有限公司 | Pickup system for semiconductor die |
TWI716925B (en) * | 2018-07-06 | 2021-01-21 | 日商新川股份有限公司 | Pickup system for semiconductor die |
JP6627001B1 (en) * | 2019-01-21 | 2019-12-25 | 株式会社東京精密 | Wafer peeling cleaning equipment |
JP7237655B2 (en) * | 2019-03-01 | 2023-03-13 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
JP7135959B2 (en) * | 2019-03-22 | 2022-09-13 | 株式会社デンソー | pickup device |
JP7274902B2 (en) * | 2019-03-25 | 2023-05-17 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
KR102202080B1 (en) * | 2019-07-02 | 2021-01-12 | 세메스 주식회사 | Collet exchange method, die transfer method and die bonding method |
JP7377654B2 (en) | 2019-09-17 | 2023-11-10 | ファスフォードテクノロジ株式会社 | Die bonding equipment, peeling unit, collet and semiconductor device manufacturing method |
KR102570798B1 (en) * | 2021-11-10 | 2023-08-30 | 세메스 주식회사 | Apparatus for picking up semiconductor devices and method of controlling operations of the same |
CN115312430B (en) * | 2022-08-23 | 2024-09-03 | 深圳市易达凯电子有限公司 | Packaging equipment special for insulated gate bipolar transistor chip production |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201001614A (en) * | 2008-06-30 | 2010-01-01 | Shinkawa Kk | Semiconductor die pickup apparatus and semiconductor die pickup method |
TW201001566A (en) * | 2008-06-24 | 2010-01-01 | Powertech Technology Inc | Jig and method for picking up a die |
TW201033100A (en) * | 2009-03-05 | 2010-09-16 | Shinkawa Kk | Apparatus and method for picking up semiconductor die |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4945339A (en) | 1972-09-08 | 1974-04-30 | ||
JPS62210635A (en) * | 1986-03-12 | 1987-09-16 | Hitachi Yonezawa Denshi Kk | Method and apparatus for isolating article |
JP2004226250A (en) * | 2003-01-23 | 2004-08-12 | Mitsubishi Electric Corp | Optical fiber type displacement sensor, and displacement controller using the same |
JP2004228513A (en) * | 2003-01-27 | 2004-08-12 | Matsushita Electric Ind Co Ltd | Conveying device for electronic component |
KR100817068B1 (en) * | 2006-10-24 | 2008-03-27 | 삼성전자주식회사 | Thinn semiconductor chip pick-up apparatus and method |
JP2009064937A (en) * | 2007-09-06 | 2009-03-26 | Shinkawa Ltd | Pickup device of semiconductor die and pickup method |
US20090075459A1 (en) * | 2007-09-06 | 2009-03-19 | Kabushiki Kaisha Shinkawa | Apparatus and method for picking-up semiconductor dies |
KR101394390B1 (en) * | 2008-07-24 | 2014-05-14 | 세메스 주식회사 | Apparatus for picking up a semiconductor device |
US8141612B2 (en) * | 2009-04-02 | 2012-03-27 | Asm Assembly Automation Ltd | Device for thin die detachment and pick-up |
US8092645B2 (en) * | 2010-02-05 | 2012-01-10 | Asm Assembly Automation Ltd | Control and monitoring system for thin die detachment and pick-up |
JP4927979B2 (en) * | 2010-09-28 | 2012-05-09 | 株式会社新川 | Semiconductor die pick-up device and semiconductor die pick-up method using the device |
JP2012156517A (en) * | 2012-03-05 | 2012-08-16 | Renesas Electronics Corp | Manufacturing method of semiconductor integrated circuit device |
-
2014
- 2014-11-06 JP JP2014225729A patent/JP6349496B2/en active Active
- 2014-12-12 KR KR1020157033050A patent/KR102043120B1/en active IP Right Grant
- 2014-12-12 WO PCT/JP2014/082965 patent/WO2015125385A1/en active Application Filing
- 2014-12-12 SG SG11201607050YA patent/SG11201607050YA/en unknown
- 2014-12-12 CN CN201480072889.2A patent/CN105900225B/en active Active
-
2015
- 2015-01-14 TW TW104101196A patent/TWI560764B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201001566A (en) * | 2008-06-24 | 2010-01-01 | Powertech Technology Inc | Jig and method for picking up a die |
TW201001614A (en) * | 2008-06-30 | 2010-01-01 | Shinkawa Kk | Semiconductor die pickup apparatus and semiconductor die pickup method |
TW201033100A (en) * | 2009-03-05 | 2010-09-16 | Shinkawa Kk | Apparatus and method for picking up semiconductor die |
Also Published As
Publication number | Publication date |
---|---|
JP6349496B2 (en) | 2018-07-04 |
WO2015125385A1 (en) | 2015-08-27 |
KR20150145255A (en) | 2015-12-29 |
CN105900225A (en) | 2016-08-24 |
TW201533794A (en) | 2015-09-01 |
JP2015173250A (en) | 2015-10-01 |
CN105900225B (en) | 2019-01-22 |
KR102043120B1 (en) | 2019-11-12 |
SG11201607050YA (en) | 2016-10-28 |
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