SG11201707365YA - Adhesive composition sheet, process for producing same, and semiconductor device - Google Patents

Adhesive composition sheet, process for producing same, and semiconductor device

Info

Publication number
SG11201707365YA
SG11201707365YA SG11201707365YA SG11201707365YA SG11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA
Authority
SG
Singapore
Prior art keywords
semiconductor device
adhesive composition
producing same
composition sheet
sheet
Prior art date
Application number
SG11201707365YA
Other languages
English (en)
Inventor
Yoichi Shinba
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201707365YA publication Critical patent/SG11201707365YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11201707365YA 2015-03-27 2016-03-09 Adhesive composition sheet, process for producing same, and semiconductor device SG11201707365YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015066030 2015-03-27
PCT/JP2016/057400 WO2016158268A1 (ja) 2015-03-27 2016-03-09 接着組成物シートおよびその製造方法ならびに半導体装置

Publications (1)

Publication Number Publication Date
SG11201707365YA true SG11201707365YA (en) 2017-10-30

Family

ID=57006693

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707365YA SG11201707365YA (en) 2015-03-27 2016-03-09 Adhesive composition sheet, process for producing same, and semiconductor device

Country Status (8)

Country Link
US (1) US10563095B2 (zh)
EP (1) EP3275956B1 (zh)
JP (1) JP6809220B2 (zh)
KR (1) KR102454630B1 (zh)
CN (1) CN107406728B (zh)
SG (1) SG11201707365YA (zh)
TW (1) TWI683880B (zh)
WO (1) WO2016158268A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019150548A1 (ja) * 2018-02-02 2019-08-08 新電元工業株式会社 半導体不純物液体ソース、半導体不純物液体ソースの製造方法および半導体装置の製造方法
US11610829B2 (en) 2018-02-14 2023-03-21 Sekisui Polymatech Co., Ltd. Heat-conductive sheet
JP7135364B2 (ja) * 2018-03-23 2022-09-13 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
JP2019172936A (ja) * 2018-03-29 2019-10-10 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器
CN115397103A (zh) * 2021-05-24 2022-11-25 庆鼎精密电子（淮安）有限公司 具散热功能的线路板的制备方法
TW202341186A (zh) * 2022-01-12 2023-10-16 日商力森諾科股份有限公司 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001315244A (ja) 2000-05-01 2001-11-13 Jsr Corp 熱伝導性シート、その製造方法およびその熱伝導性シートを用いた放熱構造
US6517744B1 (en) 1999-11-16 2003-02-11 Jsr Corporation Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
JP4890063B2 (ja) 2006-03-20 2012-03-07 新日鐵化学株式会社 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
JP2008007590A (ja) 2006-06-28 2008-01-17 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP4922220B2 (ja) 2007-12-14 2012-04-25 積水化学工業株式会社 絶縁シート及び積層構造体
KR101174971B1 (ko) * 2007-09-05 2012-08-17 세키스이가가쿠 고교가부시키가이샤 절연 시트 및 적층 구조체
JP5353379B2 (ja) 2009-03-31 2013-11-27 三菱化学株式会社 異方性形状の窒化アルミニウムフィラーを含有する熱硬化性樹脂組成物
JP2011054611A (ja) 2009-08-31 2011-03-17 Dainippon Printing Co Ltd 熱伝導性シート及びその製造方法
JP2011070930A (ja) * 2009-09-25 2011-04-07 Sekisui Chem Co Ltd 多層絶縁シート及び積層構造体
TW201131716A (en) * 2010-01-29 2011-09-16 Nitto Denko Corp Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
JP5651344B2 (ja) * 2010-02-04 2015-01-14 日東電工株式会社 熱伝導性両面粘着シート
JP5516034B2 (ja) 2010-04-30 2014-06-11 日立化成株式会社 絶縁性の高い熱伝導シート及びこれを用いた放熱装置
JP2011241355A (ja) * 2010-05-21 2011-12-01 Nitto Denko Corp 粘着テープ
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
KR101957532B1 (ko) * 2010-12-01 2019-03-12 도레이 카부시키가이샤 접착제 조성물, 접착제 시트 및 이들을 사용한 반도체 장치
US20130302602A1 (en) * 2011-02-18 2013-11-14 Nitto Denko Corporation Adhesive sheet
JP2012213899A (ja) 2011-03-31 2012-11-08 Nippon Steel Chem Co Ltd 熱伝導性ポリイミド−金属基板
JP2013119595A (ja) 2011-12-07 2013-06-17 Nippon Rika Seishi Kk 熱伝導性粘着シート
JP5837839B2 (ja) 2012-02-08 2015-12-24 積水化学工業株式会社 積層構造体
KR20140126692A (ko) * 2012-02-14 2014-10-31 닛토덴코 가부시키가이샤 열전도성 점착 시트
KR102030180B1 (ko) * 2012-10-04 2019-10-08 도레이첨단소재 주식회사 고효율 방열접착재료 및 그의 제조방법
CN105339168B (zh) 2013-03-28 2018-05-29 琳得科株式会社 保护膜形成用复合片、带有保护膜的芯片、以及带有保护膜的芯片的制造方法
CN104212368B (zh) * 2013-05-31 2019-08-16 日东电工株式会社 导热性粘合片

Also Published As

Publication number Publication date
US10563095B2 (en) 2020-02-18
CN107406728A (zh) 2017-11-28
EP3275956A1 (en) 2018-01-31
EP3275956B1 (en) 2019-07-24
JPWO2016158268A1 (ja) 2018-01-18
TW201704396A (zh) 2017-02-01
JP6809220B2 (ja) 2021-01-06
TWI683880B (zh) 2020-02-01
EP3275956A4 (en) 2018-08-22
KR20170131475A (ko) 2017-11-29
KR102454630B1 (ko) 2022-10-17
WO2016158268A1 (ja) 2016-10-06
CN107406728B (zh) 2020-12-01
US20180016470A1 (en) 2018-01-18

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