SG11201509897WA - Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method - Google Patents
Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA
- Authority
- SG
- Singapore
- Prior art keywords
- coated substrate
- reflectivemask
- reflectivefilm
- multilayer
- semiconductor device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013202494 | 2013-09-27 | ||
| PCT/JP2014/074993 WO2015046095A1 (ja) | 2013-09-27 | 2014-09-22 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201509897WA true SG11201509897WA (en) | 2016-04-28 |
Family
ID=52743232
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201509897WA SG11201509897WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9746762B2 (https=) |
| JP (3) | JP5729847B2 (https=) |
| KR (3) | KR102107799B1 (https=) |
| SG (3) | SG11201509897WA (https=) |
| TW (3) | TWI530754B (https=) |
| WO (1) | WO2015046095A1 (https=) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6069609B2 (ja) * | 2015-03-26 | 2017-02-01 | 株式会社リガク | 二重湾曲ｘ線集光素子およびその構成体、二重湾曲ｘ線分光素子およびその構成体の製造方法 |
| WO2016204051A1 (ja) * | 2015-06-17 | 2016-12-22 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
| JP6873758B2 (ja) * | 2016-03-28 | 2021-05-19 | Hoya株式会社 | 基板の製造方法、多層反射膜付き基板の製造方法、マスクブランクの製造方法、及び転写用マスクの製造方法 |
| US11048159B2 (en) * | 2016-03-31 | 2021-06-29 | Hoya Corporation | Method for manufacturing reflective mask blank, reflective mask blank, method for manufacturing reflective mask, reflective mask, and method for manufacturing semiconductor device |
| US9870612B2 (en) * | 2016-06-06 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for repairing a mask |
| US11187972B2 (en) * | 2016-10-21 | 2021-11-30 | Hoya Corporation | Reflective mask blank, method of manufacturing reflective mask and method of manufacturing semiconductor device |
| KR20190100251A (ko) * | 2017-01-17 | 2019-08-28 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 및 반도체 장치의 제조 방법 |
| KR102429244B1 (ko) * | 2017-02-27 | 2022-08-05 | 호야 가부시키가이샤 | 마스크 블랭크 및 임프린트 몰드의 제조 방법 |
| SG11201913862WA (en) * | 2017-07-05 | 2020-01-30 | Toppan Printing Co Ltd | Reflective photomask blank and reflective photomask |
| KR102937232B1 (ko) | 2018-05-25 | 2026-03-10 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크, 그리고, 반사형 마스크 및 반도체 장치의 제조 방법 |
| JP7492456B2 (ja) * | 2018-11-07 | 2024-05-29 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法 |
| JP7250511B2 (ja) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| DE102019100839B4 (de) * | 2019-01-14 | 2024-11-14 | Advanced Mask Technology Center Gmbh & Co. Kg | Fotomaskenanordnung mit reflektierender fotomaske und verfahren zum herstellen einer reflektierenden fotomaske |
| JP7263872B2 (ja) | 2019-03-25 | 2023-04-25 | 株式会社デンソー | ドリルの製造方法 |
| JP7350571B2 (ja) * | 2019-08-30 | 2023-09-26 | Hoya株式会社 | 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法 |
| CN114424119A (zh) * | 2019-09-26 | 2022-04-29 | Hoya株式会社 | 带多层反射膜的基板、反射型掩模坯料、反射型掩模、以及半导体装置的制造方法 |
| JP7271760B2 (ja) * | 2020-03-27 | 2023-05-11 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| KR102464780B1 (ko) * | 2020-09-02 | 2022-11-09 | 주식회사 에스앤에스텍 | 도전막을 구비하는 블랭크마스크 및 이를 이용하여 제작된 포토마스크 |
| JP7420027B2 (ja) * | 2020-09-10 | 2024-01-23 | 信越化学工業株式会社 | Ｅｕｖマスクブランク用多層反射膜付き基板、その製造方法及びｅｕｖマスクブランク |
| US20220137500A1 (en) * | 2020-10-30 | 2022-05-05 | AGC Inc. | Glass substrate for euvl, and mask blank for euvl |
| KR20220058424A (ko) * | 2020-10-30 | 2022-05-09 | 에이지씨 가부시키가이샤 | Euvl용 유리 기판, 및 euvl용 마스크 블랭크 |
| JP7260078B2 (ja) * | 2021-02-16 | 2023-04-18 | Ａｇｃ株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、ｅｕｖリソグラフィ用反射型マスク、およびそれらの製造方法 |
| JP7589633B2 (ja) * | 2021-04-19 | 2024-11-26 | Ａｇｃ株式会社 | 多層反射膜付き基板の検査方法、及び反射型マスクブランクの製造方法 |
| EP4392827A4 (en) * | 2022-03-25 | 2025-09-17 | Photronics Inc | SYSTEM, METHOD AND PROGRAM PRODUCT FOR PHOTOMASK SURFACE PROCESSING |
| TW202431008A (zh) * | 2022-11-22 | 2024-08-01 | 韓商Ｓ＆Ｓ技術股份有限公司 | 具有高反射率相偏移膜之極紫外光微影空白遮罩及光罩 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0696434A (ja) * | 1992-07-31 | 1994-04-08 | Sony Corp | 磁気記録媒体及び磁気記録媒体の評価方法 |
| JPH0785463A (ja) | 1993-09-20 | 1995-03-31 | A G Technol Kk | 磁気ディスク |
| JPH10283626A (ja) * | 1997-02-09 | 1998-10-23 | Hoya Corp | 磁気記録媒体及びその製造方法 |
| JP2002288823A (ja) | 2002-03-14 | 2002-10-04 | Nippon Sheet Glass Co Ltd | 情報記録媒体用基板の製造方法 |
| JP2004199846A (ja) * | 2002-10-23 | 2004-07-15 | Nippon Sheet Glass Co Ltd | 磁気記録媒体用ガラス基板及びその製造方法 |
| US7678511B2 (en) * | 2006-01-12 | 2010-03-16 | Asahi Glass Company, Limited | Reflective-type mask blank for EUV lithography |
| JP2007272995A (ja) * | 2006-03-31 | 2007-10-18 | Hoya Corp | 磁気ディスク装置および非磁性基板の良否判定方法、磁気ディスク、並びに磁気ディスク装置 |
| JP4978626B2 (ja) | 2006-12-15 | 2012-07-18 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板 |
| WO2010001843A1 (ja) * | 2008-06-30 | 2010-01-07 | Hoya株式会社 | 磁気ディスク用基板及び磁気ディスク |
| JP5481299B2 (ja) | 2010-07-22 | 2014-04-23 | 矢崎総業株式会社 | 導通検査治具の動作制御構造 |
| JP5533395B2 (ja) * | 2010-07-26 | 2014-06-25 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| WO2012105698A1 (ja) | 2011-02-04 | 2012-08-09 | 旭硝子株式会社 | 導電膜付基板、多層反射膜付基板、およびｅｕｖリソグラフィ用反射型マスクブランク |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| JP6125772B2 (ja) | 2011-09-28 | 2017-05-10 | Hoya株式会社 | 反射型マスクブランク、反射型マスクおよび反射型マスクの製造方法 |
| WO2013062104A1 (ja) | 2011-10-28 | 2013-05-02 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| KR102064643B1 (ko) | 2012-03-30 | 2020-01-08 | 호야 가부시키가이샤 | 마스크 블랭크용 기판, 다층 반사막 부착 기판, 투과형 마스크 블랭크, 반사형 마스크 블랭크, 투과형 마스크, 반사형 마스크 및 반도체 장치의 제조 방법 |
-
2014
- 2014-09-22 WO PCT/JP2014/074993 patent/WO2015046095A1/ja not_active Ceased
- 2014-09-22 KR KR1020177030201A patent/KR102107799B1/ko active Active
- 2014-09-22 US US14/896,411 patent/US9746762B2/en active Active
- 2014-09-22 SG SG11201509897WA patent/SG11201509897WA/en unknown
- 2014-09-22 SG SG10201911502WA patent/SG10201911502WA/en unknown
- 2014-09-22 KR KR1020207012491A patent/KR102127907B1/ko active Active
- 2014-09-22 KR KR1020157035761A patent/KR101877896B1/ko active Active
- 2014-09-22 SG SG10201805079YA patent/SG10201805079YA/en unknown
- 2014-09-25 JP JP2014194957A patent/JP5729847B2/ja active Active
- 2014-09-26 TW TW103133627A patent/TWI530754B/zh active
- 2014-09-26 TW TW105103579A patent/TWI626503B/zh active
- 2014-09-26 TW TW107112766A patent/TWI652542B/zh active
-
2015
- 2015-04-03 JP JP2015076651A patent/JP6465720B2/ja active Active
-
2017
- 2017-07-21 US US15/655,932 patent/US10209614B2/en active Active
-
2018
- 2018-12-28 US US16/235,334 patent/US10527927B2/en active Active
-
2019
- 2019-01-08 JP JP2019001198A patent/JP6630005B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10209614B2 (en) | 2019-02-19 |
| JP2015156034A (ja) | 2015-08-27 |
| US10527927B2 (en) | 2020-01-07 |
| KR20200047800A (ko) | 2020-05-07 |
| US20160124298A1 (en) | 2016-05-05 |
| KR101877896B1 (ko) | 2018-07-12 |
| WO2015046095A1 (ja) | 2015-04-02 |
| TWI530754B (zh) | 2016-04-21 |
| JP2019056939A (ja) | 2019-04-11 |
| SG10201805079YA (en) | 2018-07-30 |
| JP5729847B2 (ja) | 2015-06-03 |
| US20190155141A1 (en) | 2019-05-23 |
| TW201516556A (zh) | 2015-05-01 |
| KR102127907B1 (ko) | 2020-06-29 |
| TWI626503B (zh) | 2018-06-11 |
| JP6465720B2 (ja) | 2019-02-06 |
| KR20170120718A (ko) | 2017-10-31 |
| KR20160061913A (ko) | 2016-06-01 |
| US20170315439A1 (en) | 2017-11-02 |
| US9746762B2 (en) | 2017-08-29 |
| TW201826009A (zh) | 2018-07-16 |
| JP2015088742A (ja) | 2015-05-07 |
| KR102107799B1 (ko) | 2020-05-07 |
| SG10201911502WA (en) | 2020-02-27 |
| TW201617728A (zh) | 2016-05-16 |
| JP6630005B2 (ja) | 2020-01-15 |
| TWI652542B (zh) | 2019-03-01 |
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