SG10201911502WA - Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method - Google Patents

Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method

Info

Publication number
SG10201911502WA
SG10201911502WA SG10201911502WA SG10201911502WA SG10201911502WA SG 10201911502W A SG10201911502W A SG 10201911502WA SG 10201911502W A SG10201911502W A SG 10201911502WA SG 10201911502W A SG10201911502W A SG 10201911502WA SG 10201911502W A SG10201911502W A SG 10201911502WA
Authority
SG
Singapore
Prior art keywords
coated substrate
film coated
reflective mask
reflective
semiconductor device
Prior art date
Application number
SG10201911502WA
Inventor
Kazuhiro Hamamoto
Yoichi Usui
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG10201911502WA publication Critical patent/SG10201911502WA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/7065Defects, e.g. optical inspection of patterned layer for defects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/416Reflective
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00Optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
SG10201911502WA 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method SG10201911502WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013202494 2013-09-27

Publications (1)

Publication Number Publication Date
SG10201911502WA true SG10201911502WA (en) 2020-02-27

Family

ID=52743232

Family Applications (3)

Application Number Title Priority Date Filing Date
SG11201509897WA SG11201509897WA (en) 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method
SG10201911502WA SG10201911502WA (en) 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method
SG10201805079YA SG10201805079YA (en) 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201509897WA SG11201509897WA (en) 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201805079YA SG10201805079YA (en) 2013-09-27 2014-09-22 Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method

Country Status (6)

Country Link
US (3) US9746762B2 (en)
JP (3) JP5729847B2 (en)
KR (3) KR102107799B1 (en)
SG (3) SG11201509897WA (en)
TW (3) TWI530754B (en)
WO (1) WO2015046095A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6314019B2 (en) * 2014-03-31 2018-04-18 ニッタ・ハース株式会社 Semiconductor substrate polishing method
JP6069609B2 (en) * 2015-03-26 2017-02-01 株式会社リガク Double-curved X-ray condensing element and its constituent, double-curved X-ray spectroscopic element and method for producing the constituent
JP6815995B2 (en) * 2015-06-17 2021-01-20 Hoya株式会社 Method for manufacturing a substrate with a conductive film, a substrate with a multilayer reflective film, a reflective mask blank, a reflective mask, and a semiconductor device.
JP6873758B2 (en) * 2016-03-28 2021-05-19 Hoya株式会社 A method for manufacturing a substrate, a method for manufacturing a substrate with a multilayer reflective film, a method for manufacturing a mask blank, and a method for manufacturing a transfer mask.
KR102393311B1 (en) * 2016-03-31 2022-05-02 호야 가부시키가이샤 Method for manufacturing a reflective mask blank, a reflective mask blank, a method for manufacturing a reflective mask, a reflective mask, and a method for manufacturing a semiconductor device
US9870612B2 (en) * 2016-06-06 2018-01-16 Taiwan Semiconductor Manufacturing Co., Ltd. Method for repairing a mask
WO2018135467A1 (en) * 2017-01-17 2018-07-26 Hoya株式会社 Reflective mask blank, reflective mask, method for producing same, and method for producing semiconductor device
CN110383167B (en) * 2017-02-27 2022-08-23 Hoya株式会社 Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device
US11067886B2 (en) * 2017-07-05 2021-07-20 Toppan Printing Co., Ltd. Reflective photomask blank and reflective photomask
JP7361027B2 (en) 2018-05-25 2023-10-13 Hoya株式会社 Reflective mask blank, reflective mask and method for manufacturing the same, and method for manufacturing semiconductor devices
JP7492456B2 (en) * 2018-11-07 2024-05-29 Hoya株式会社 Substrate with multilayer reflective film, reflective mask blank, method for manufacturing reflective mask, and method for manufacturing semiconductor device
JP7250511B2 (en) * 2018-12-27 2023-04-03 Hoya株式会社 Reflective mask blank, reflective mask, and method for manufacturing semiconductor device
DE102019100839A1 (en) * 2019-01-14 2020-07-16 Advanced Mask Technology Center Gmbh & Co. Kg PHOTOMASK ARRANGEMENT WITH REFLECTIVE PHOTOMASK AND METHOD FOR PRODUCING A REFLECTIVE PHOTOMASK
JP7263872B2 (en) 2019-03-25 2023-04-25 株式会社デンソー Drill manufacturing method
JP7271760B2 (en) * 2020-03-27 2023-05-11 Hoya株式会社 Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method for manufacturing semiconductor device
KR102464780B1 (en) * 2020-09-02 2022-11-09 주식회사 에스앤에스텍 Blankmask with Backside Conductive Layer, and Photomask manufactured with the same

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JPH0785463A (en) 1993-09-20 1995-03-31 A G Technol Kk Magnetic disk
JP2002288823A (en) * 2002-03-14 2002-10-04 Nippon Sheet Glass Co Ltd Manufacturing method of substrate for information record medium
JP2004199846A (en) 2002-10-23 2004-07-15 Nippon Sheet Glass Co Ltd Glass substrate for magnetic recording medium, and its manufacturing method
JP2007272995A (en) 2006-03-31 2007-10-18 Hoya Corp Method for determining whether or not magnetic disk device and non-magnetic substrate are good, magnetic disk, and magnetic disk device
JP4978626B2 (en) 2006-12-15 2012-07-18 旭硝子株式会社 Reflective mask blank for EUV lithography, and functional film substrate for the mask blank
CN102077279B (en) 2008-06-30 2012-06-20 Hoya株式会社 Substrate for magnetic disc and magnetic disc
JP5481299B2 (en) 2010-07-22 2014-04-23 矢崎総業株式会社 Operation control structure of continuity inspection jig
JP5533395B2 (en) * 2010-07-26 2014-06-25 旭硝子株式会社 Method for manufacturing a reflective mask blank for EUV lithography
WO2012105698A1 (en) 2011-02-04 2012-08-09 旭硝子株式会社 Substrate with conductive film, substrate with multilayer reflection film, and reflective mask blank for euv lithography
JP6125772B2 (en) 2011-09-28 2017-05-10 Hoya株式会社 Reflective mask blank, reflective mask, and method of manufacturing reflective mask
JP5950535B2 (en) * 2011-10-25 2016-07-13 凸版印刷株式会社 Reflective mask blank and reflective mask
WO2013062104A1 (en) 2011-10-28 2013-05-02 旭硝子株式会社 Manufacturing method of reflective mask blank for euv lithography
US9348217B2 (en) 2012-03-30 2016-05-24 Hoya Corporation Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication method

Also Published As

Publication number Publication date
US9746762B2 (en) 2017-08-29
TW201826009A (en) 2018-07-16
JP5729847B2 (en) 2015-06-03
US10209614B2 (en) 2019-02-19
SG10201805079YA (en) 2018-07-30
US10527927B2 (en) 2020-01-07
US20190155141A1 (en) 2019-05-23
JP2015156034A (en) 2015-08-27
TW201617728A (en) 2016-05-16
JP2015088742A (en) 2015-05-07
KR20200047800A (en) 2020-05-07
TWI652542B (en) 2019-03-01
KR102107799B1 (en) 2020-05-07
KR101877896B1 (en) 2018-07-12
US20160124298A1 (en) 2016-05-05
SG11201509897WA (en) 2016-04-28
TWI626503B (en) 2018-06-11
US20170315439A1 (en) 2017-11-02
KR20170120718A (en) 2017-10-31
WO2015046095A1 (en) 2015-04-02
KR20160061913A (en) 2016-06-01
JP6465720B2 (en) 2019-02-06
JP6630005B2 (en) 2020-01-15
TW201516556A (en) 2015-05-01
KR102127907B1 (en) 2020-06-29
JP2019056939A (en) 2019-04-11
TWI530754B (en) 2016-04-21

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