SG11201509897WA - Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method - Google Patents
Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA
- Authority
- SG
- Singapore
- Prior art keywords
- coated substrate
- reflectivemask
- reflectivefilm
- multilayer
- semiconductor device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013202494 | 2013-09-27 | ||
PCT/JP2014/074993 WO2015046095A1 (en) | 2013-09-27 | 2014-09-22 | Substrate provided with conductive film, substrate provided with multi-layer reflection film, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201509897WA true SG11201509897WA (en) | 2016-04-28 |
Family
ID=52743232
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201509897WA SG11201509897WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
Country Status (6)
Country | Link |
---|---|
US (3) | US9746762B2 (en) |
JP (3) | JP5729847B2 (en) |
KR (3) | KR102127907B1 (en) |
SG (3) | SG11201509897WA (en) |
TW (3) | TWI626503B (en) |
WO (1) | WO2015046095A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6314019B2 (en) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | Semiconductor substrate polishing method |
JP6069609B2 (en) * | 2015-03-26 | 2017-02-01 | 株式会社リガク | Double-curved X-ray condensing element and its constituent, double-curved X-ray spectroscopic element and method for producing the constituent |
JP6815995B2 (en) | 2015-06-17 | 2021-01-20 | Hoya株式会社 | Method for manufacturing a substrate with a conductive film, a substrate with a multilayer reflective film, a reflective mask blank, a reflective mask, and a semiconductor device. |
JP6873758B2 (en) * | 2016-03-28 | 2021-05-19 | Hoya株式会社 | A method for manufacturing a substrate, a method for manufacturing a substrate with a multilayer reflective film, a method for manufacturing a mask blank, and a method for manufacturing a transfer mask. |
US11048159B2 (en) * | 2016-03-31 | 2021-06-29 | Hoya Corporation | Method for manufacturing reflective mask blank, reflective mask blank, method for manufacturing reflective mask, reflective mask, and method for manufacturing semiconductor device |
US9870612B2 (en) * | 2016-06-06 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for repairing a mask |
US11249385B2 (en) | 2017-01-17 | 2022-02-15 | Hoya Corporation | Reflective mask blank, reflective mask, method of manufacturing same, and method of manufacturing semiconductor device |
KR102429244B1 (en) * | 2017-02-27 | 2022-08-05 | 호야 가부시키가이샤 | Mask blank and manufacturing method of imprint mold |
CN110785704A (en) * | 2017-07-05 | 2020-02-11 | 凸版印刷株式会社 | Reflective photomask blank and reflective photomask |
KR20210014619A (en) | 2018-05-25 | 2021-02-09 | 호야 가부시키가이샤 | Reflective mask blank, reflective mask and its manufacturing method, and semiconductor device manufacturing method |
TWI829797B (en) * | 2018-11-07 | 2024-01-21 | 日商Hoya股份有限公司 | Multi-layer reflective film substrate, reflective mask substrate, reflective mask manufacturing method and semiconductor device manufacturing method |
JP7250511B2 (en) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | Reflective mask blank, reflective mask, and method for manufacturing semiconductor device |
DE102019100839A1 (en) * | 2019-01-14 | 2020-07-16 | Advanced Mask Technology Center Gmbh & Co. Kg | PHOTOMASK ARRANGEMENT WITH REFLECTIVE PHOTOMASK AND METHOD FOR PRODUCING A REFLECTIVE PHOTOMASK |
JP7263872B2 (en) | 2019-03-25 | 2023-04-25 | 株式会社デンソー | Drill manufacturing method |
JP7271760B2 (en) * | 2020-03-27 | 2023-05-11 | Hoya株式会社 | Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method for manufacturing semiconductor device |
KR102464780B1 (en) * | 2020-09-02 | 2022-11-09 | 주식회사 에스앤에스텍 | Blankmask with Backside Conductive Layer, and Photomask manufactured with the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0785463A (en) | 1993-09-20 | 1995-03-31 | A G Technol Kk | Magnetic disk |
JP2002288823A (en) | 2002-03-14 | 2002-10-04 | Nippon Sheet Glass Co Ltd | Manufacturing method of substrate for information record medium |
JP2004199846A (en) * | 2002-10-23 | 2004-07-15 | Nippon Sheet Glass Co Ltd | Glass substrate for magnetic recording medium, and its manufacturing method |
JP2007272995A (en) * | 2006-03-31 | 2007-10-18 | Hoya Corp | Method for determining whether or not magnetic disk device and non-magnetic substrate are good, magnetic disk, and magnetic disk device |
WO2008072706A1 (en) * | 2006-12-15 | 2008-06-19 | Asahi Glass Company, Limited | Reflective mask blank for euv lithography, and substrate with function film for the mask blank |
US8734967B2 (en) | 2008-06-30 | 2014-05-27 | Hoya Corporation | Substrate for magnetic disk and magnetic disk |
JP5481299B2 (en) | 2010-07-22 | 2014-04-23 | 矢崎総業株式会社 | Operation control structure of continuity inspection jig |
JP5533395B2 (en) * | 2010-07-26 | 2014-06-25 | 旭硝子株式会社 | Method for manufacturing a reflective mask blank for EUV lithography |
WO2012105698A1 (en) | 2011-02-04 | 2012-08-09 | 旭硝子株式会社 | Substrate with conductive film, substrate with multilayer reflection film, and reflective mask blank for euv lithography |
JP6125772B2 (en) | 2011-09-28 | 2017-05-10 | Hoya株式会社 | Reflective mask blank, reflective mask, and method of manufacturing reflective mask |
JP5950535B2 (en) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | Reflective mask blank and reflective mask |
JP5949777B2 (en) | 2011-10-28 | 2016-07-13 | 旭硝子株式会社 | Method for manufacturing a reflective mask blank for EUV lithography |
JP5538637B2 (en) | 2012-03-30 | 2014-07-02 | Hoya株式会社 | Mask blank substrate, substrate with multilayer reflective film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and method for manufacturing semiconductor device |
-
2014
- 2014-09-22 SG SG11201509897WA patent/SG11201509897WA/en unknown
- 2014-09-22 WO PCT/JP2014/074993 patent/WO2015046095A1/en active Application Filing
- 2014-09-22 KR KR1020207012491A patent/KR102127907B1/en active IP Right Grant
- 2014-09-22 KR KR1020177030201A patent/KR102107799B1/en active IP Right Grant
- 2014-09-22 SG SG10201805079YA patent/SG10201805079YA/en unknown
- 2014-09-22 US US14/896,411 patent/US9746762B2/en active Active
- 2014-09-22 SG SG10201911502WA patent/SG10201911502WA/en unknown
- 2014-09-22 KR KR1020157035761A patent/KR101877896B1/en active IP Right Grant
- 2014-09-25 JP JP2014194957A patent/JP5729847B2/en active Active
- 2014-09-26 TW TW105103579A patent/TWI626503B/en active
- 2014-09-26 TW TW107112766A patent/TWI652542B/en active
- 2014-09-26 TW TW103133627A patent/TWI530754B/en active
-
2015
- 2015-04-03 JP JP2015076651A patent/JP6465720B2/en active Active
-
2017
- 2017-07-21 US US15/655,932 patent/US10209614B2/en active Active
-
2018
- 2018-12-28 US US16/235,334 patent/US10527927B2/en active Active
-
2019
- 2019-01-08 JP JP2019001198A patent/JP6630005B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015088742A (en) | 2015-05-07 |
KR101877896B1 (en) | 2018-07-12 |
US20170315439A1 (en) | 2017-11-02 |
TWI626503B (en) | 2018-06-11 |
KR20170120718A (en) | 2017-10-31 |
TW201516556A (en) | 2015-05-01 |
KR102127907B1 (en) | 2020-06-29 |
TW201826009A (en) | 2018-07-16 |
JP6630005B2 (en) | 2020-01-15 |
JP5729847B2 (en) | 2015-06-03 |
TW201617728A (en) | 2016-05-16 |
TWI530754B (en) | 2016-04-21 |
KR20200047800A (en) | 2020-05-07 |
SG10201805079YA (en) | 2018-07-30 |
US20160124298A1 (en) | 2016-05-05 |
JP2019056939A (en) | 2019-04-11 |
US9746762B2 (en) | 2017-08-29 |
KR102107799B1 (en) | 2020-05-07 |
SG10201911502WA (en) | 2020-02-27 |
US10209614B2 (en) | 2019-02-19 |
JP6465720B2 (en) | 2019-02-06 |
TWI652542B (en) | 2019-03-01 |
KR20160061913A (en) | 2016-06-01 |
US20190155141A1 (en) | 2019-05-23 |
WO2015046095A1 (en) | 2015-04-02 |
US10527927B2 (en) | 2020-01-07 |
JP2015156034A (en) | 2015-08-27 |
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