SG11201501594UA - Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition - Google Patents
Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said compositionInfo
- Publication number
- SG11201501594UA SG11201501594UA SG11201501594UA SG11201501594UA SG11201501594UA SG 11201501594U A SG11201501594U A SG 11201501594UA SG 11201501594U A SG11201501594U A SG 11201501594UA SG 11201501594U A SG11201501594U A SG 11201501594UA SG 11201501594U A SG11201501594U A SG 11201501594UA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- semiconductor device
- photosensitive resin
- cured film
- device containing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012210691 | 2012-09-25 | ||
| PCT/JP2013/074523 WO2014050558A1 (ja) | 2012-09-25 | 2013-09-11 | ポジ型感光性樹脂組成物、それを用いた硬化膜を含む半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201501594UA true SG11201501594UA (en) | 2015-05-28 |
Family
ID=50387965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201501594UA SG11201501594UA (en) | 2012-09-25 | 2013-09-11 | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9454078B2 (zh) |
| EP (1) | EP2902847B1 (zh) |
| JP (1) | JP6252174B2 (zh) |
| KR (1) | KR102091496B1 (zh) |
| CN (1) | CN104662475B (zh) |
| PT (1) | PT2902847T (zh) |
| SG (1) | SG11201501594UA (zh) |
| TW (1) | TWI589999B (zh) |
| WO (1) | WO2014050558A1 (zh) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150038942A (ko) * | 2013-10-01 | 2015-04-09 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| JP2016027085A (ja) * | 2014-06-26 | 2016-02-18 | デクセリアルズ株式会社 | ポリイミド、ポリアミド酸、及びそれらの製造方法、並びに感光性樹脂組成物 |
| TWI704418B (zh) | 2015-06-30 | 2020-09-11 | 日商富士軟片股份有限公司 | 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件 |
| WO2017043375A1 (ja) * | 2015-09-08 | 2017-03-16 | 東レ株式会社 | 感光性樹脂組成物、感光性シート、半導体装置および半導体装置の製造方法 |
| JP6973070B2 (ja) * | 2016-03-24 | 2021-11-24 | 東レ株式会社 | エッチング用マスクレジスト組成物、それを用いた基板の製造方法および発光素子の製造方法 |
| KR102301534B1 (ko) * | 2016-03-28 | 2021-09-10 | 니폰 제온 가부시키가이샤 | 감방사선 수지 조성물 및 전자 부품 |
| KR102314567B1 (ko) * | 2016-03-28 | 2021-10-19 | 도레이 카부시키가이샤 | 감광성 필름 |
| KR102341494B1 (ko) * | 2016-11-02 | 2021-12-23 | 도레이 카부시키가이샤 | 수지 조성물, 수지 시트, 경화막, 유기 el 표시 장치, 반도체 전자 부품, 반도체 장치 및 유기 el 표시 장치의 제조 방법 |
| JP6988094B2 (ja) * | 2017-01-27 | 2022-01-05 | 富士フイルムビジネスイノベーション株式会社 | ポリイミド前駆体組成物、及びポリイミド成形体の製造方法 |
| KR102134377B1 (ko) * | 2017-09-15 | 2020-07-15 | 주식회사 엘지화학 | 감광성 수지 조성물 및 이를 포함한 경화막 |
| KR102429886B1 (ko) * | 2017-11-30 | 2022-08-04 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| JP6810677B2 (ja) * | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品 |
| CN109991813B (zh) | 2017-12-29 | 2022-06-21 | 财团法人工业技术研究院 | 感光型复合材料及使用其形成复合薄膜的方法 |
| KR102570572B1 (ko) * | 2020-01-08 | 2023-08-23 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 디스플레이 장치 |
| CN114836033B (zh) * | 2022-04-12 | 2023-08-22 | 吉林奥来德光电材料股份有限公司 | 一种树脂前体组合物及其树脂膜和制备方法与应用 |
| CN115010924B (zh) * | 2022-06-21 | 2023-10-13 | 吉林奥来德光电材料股份有限公司 | 光敏聚酰亚胺树脂组合物及包含其的聚酰亚胺树脂膜与应用 |
| CN115343914B (zh) * | 2022-10-20 | 2023-03-31 | 上海八亿时空先进材料有限公司 | 碱溶性树脂、感光性树脂组合物和感光性固化膜 |
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| US6316109B1 (en) * | 2000-09-21 | 2001-11-13 | Ppg Industries Ohio, Inc. | Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| JP4438227B2 (ja) | 2001-01-09 | 2010-03-24 | 日立電線株式会社 | 感光性ポリイミド樹脂組成物およびその製造方法 |
| KR100905682B1 (ko) * | 2001-09-26 | 2009-07-03 | 닛산 가가쿠 고교 가부시키 가이샤 | 포지티브형 감광성 폴리이미드 수지 조성물 |
| JP4374840B2 (ja) * | 2002-08-30 | 2009-12-02 | 東レ株式会社 | ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置 |
| JP2006206756A (ja) * | 2005-01-28 | 2006-08-10 | Sony Chem Corp | ポリイミド化合物及びフレキシブル配線板 |
| JP4918968B2 (ja) | 2005-05-09 | 2012-04-18 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| US7851121B2 (en) * | 2006-02-10 | 2010-12-14 | Central Glass Co., Ltd. | Photosensitive polyimide composition and polyimide precursor composition |
| JP5114776B2 (ja) * | 2007-02-09 | 2013-01-09 | デクセリアルズ株式会社 | 感光性ポリイミド樹脂組成物 |
| JP4957583B2 (ja) * | 2007-02-22 | 2012-06-20 | 新日本理化株式会社 | 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス |
| JP5386781B2 (ja) | 2007-03-12 | 2014-01-15 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| JP5010357B2 (ja) * | 2007-06-13 | 2012-08-29 | 三井化学株式会社 | 新規ポリアミド酸、ポリイミド並びにその用途 |
| KR101275474B1 (ko) | 2007-10-29 | 2013-06-14 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품 |
| KR101588364B1 (ko) * | 2007-12-14 | 2016-01-25 | 닛산 가가쿠 고교 가부시키 가이샤 | 폴리히드록시이미드의 제조방법 및 그 제조방법으로부터 얻어진 폴리히드록시이미드를 함유하는 포지티브형 감광성 수지 조성물 |
| US8071273B2 (en) * | 2008-03-31 | 2011-12-06 | Dai Nippon Printing Co., Ltd. | Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition |
| JP2009270023A (ja) * | 2008-05-08 | 2009-11-19 | Kaneka Corp | ポリイミド前駆体の製造方法およびその製造方法を用いて得られるポリイミド |
| JP5343494B2 (ja) * | 2008-09-30 | 2013-11-13 | デクセリアルズ株式会社 | 感光性シロキサンポリイミド樹脂組成物 |
| JP5201155B2 (ja) * | 2009-01-27 | 2013-06-05 | 新日本理化株式会社 | ポリ（アミド酸―イミド）樹脂 |
| US8257901B2 (en) * | 2009-03-10 | 2012-09-04 | Lg Chem, Ltd. | Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same |
| TWI445765B (zh) * | 2009-06-09 | 2014-07-21 | Asahi Kasei E Materials Corp | A resin composition, a cured product, and a circuit substrate using the same |
| WO2011008036A2 (ko) | 2009-07-15 | 2011-01-20 | 주식회사 엘지화학 | 감광성 폴리이미드 및 그를 포함하는 감광성 수지 조성물 |
| JP5538779B2 (ja) | 2009-08-31 | 2014-07-02 | 国立大学法人横浜国立大学 | 感光性樹脂組成物および該組成物を使用した反応現像画像形成方法 |
| JP2011053458A (ja) | 2009-09-02 | 2011-03-17 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| JP2011095355A (ja) | 2009-10-28 | 2011-05-12 | Toray Ind Inc | 感光性樹脂組成物 |
| CN102597061B (zh) | 2009-11-16 | 2014-06-04 | 旭化成电子材料株式会社 | 聚酰亚胺前体和包含该聚酰亚胺前体的感光性树脂组合物 |
| CN102640054B (zh) | 2009-12-04 | 2013-07-24 | 东丽株式会社 | 感光性树脂组合物、使用该感光性树脂组合物的层积体和固态摄像装置 |
| KR101304590B1 (ko) * | 2010-03-11 | 2013-09-05 | 주식회사 엘지화학 | Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물 |
| JP2011227133A (ja) * | 2010-04-15 | 2011-11-10 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
| JP5742376B2 (ja) * | 2011-03-30 | 2015-07-01 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| JP5736993B2 (ja) | 2011-06-15 | 2015-06-17 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品 |
| KR101990168B1 (ko) * | 2012-01-31 | 2019-06-17 | 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 | 리튬 이온 전지 정극용 수지 조성물 |
| EP2902846B1 (en) | 2012-09-24 | 2019-11-20 | Toray Industries, Inc. | Positive photosensitive resin composition |
-
2013
- 2013-09-11 CN CN201380049169.XA patent/CN104662475B/zh active Active
- 2013-09-11 WO PCT/JP2013/074523 patent/WO2014050558A1/ja active Application Filing
- 2013-09-11 EP EP13840268.0A patent/EP2902847B1/en not_active Not-in-force
- 2013-09-11 JP JP2013542271A patent/JP6252174B2/ja active Active
- 2013-09-11 SG SG11201501594UA patent/SG11201501594UA/en unknown
- 2013-09-11 PT PT13840268T patent/PT2902847T/pt unknown
- 2013-09-11 US US14/422,664 patent/US9454078B2/en active Active
- 2013-09-11 KR KR1020157009234A patent/KR102091496B1/ko active IP Right Grant
- 2013-09-24 TW TW102134213A patent/TWI589999B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102091496B1 (ko) | 2020-03-20 |
| KR20150063425A (ko) | 2015-06-09 |
| US20150212412A1 (en) | 2015-07-30 |
| PT2902847T (pt) | 2019-08-06 |
| CN104662475A (zh) | 2015-05-27 |
| TWI589999B (zh) | 2017-07-01 |
| WO2014050558A1 (ja) | 2014-04-03 |
| EP2902847A1 (en) | 2015-08-05 |
| EP2902847B1 (en) | 2019-05-08 |
| JP6252174B2 (ja) | 2017-12-27 |
| CN104662475B (zh) | 2019-03-29 |
| EP2902847A4 (en) | 2016-04-27 |
| US9454078B2 (en) | 2016-09-27 |
| JPWO2014050558A1 (ja) | 2016-08-22 |
| TW201418889A (zh) | 2014-05-16 |
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