HK1256151A1 - 曝光裝置及曝光方法、以及器件製造方法 - Google Patents

曝光裝置及曝光方法、以及器件製造方法

Info

Publication number
HK1256151A1
HK1256151A1 HK18115232.6A HK18115232A HK1256151A1 HK 1256151 A1 HK1256151 A1 HK 1256151A1 HK 18115232 A HK18115232 A HK 18115232A HK 1256151 A1 HK1256151 A1 HK 1256151A1
Authority
HK
Hong Kong
Prior art keywords
exposure
manufacturing
exposure device
exposure method
Prior art date
Application number
HK18115232.6A
Other languages
English (en)
Inventor
柴崎祐一
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1256151A1 publication Critical patent/HK1256151A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
HK18115232.6A 2012-10-02 2018-11-28 曝光裝置及曝光方法、以及器件製造方法 HK1256151A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012219952 2012-10-02

Publications (1)

Publication Number Publication Date
HK1256151A1 true HK1256151A1 (zh) 2019-09-13

Family

ID=50435011

Family Applications (2)

Application Number Title Priority Date Filing Date
HK15111739.6A HK1211135A1 (zh) 2012-10-02 2015-11-27 曝光裝置及曝光方法、以及器件製造方法
HK18115232.6A HK1256151A1 (zh) 2012-10-02 2018-11-28 曝光裝置及曝光方法、以及器件製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK15111739.6A HK1211135A1 (zh) 2012-10-02 2015-11-27 曝光裝置及曝光方法、以及器件製造方法

Country Status (7)

Country Link
US (7) US9678433B2 (zh)
EP (2) EP3723111B1 (zh)
JP (6) JP6075657B2 (zh)
KR (2) KR102203305B1 (zh)
CN (2) CN108613638B (zh)
HK (2) HK1211135A1 (zh)
WO (1) WO2014054690A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR102203305B1 (ko) 2012-10-02 2021-01-14 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
EP3680717A1 (en) 2015-02-23 2020-07-15 Nikon Corporation Substrate processing system and substrate processing method, and device manufacturing method
KR102552792B1 (ko) * 2015-02-23 2023-07-06 가부시키가이샤 니콘 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법
TWI768342B (zh) 2015-02-23 2022-06-21 日商尼康股份有限公司 測量裝置、微影系統及曝光裝置、測量方法及曝光方法
WO2017057539A1 (ja) * 2015-09-30 2017-04-06 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法
KR20180059814A (ko) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
CN108139694B (zh) * 2015-09-30 2021-08-03 株式会社尼康 曝光装置、曝光方法以及平面显示器制造方法
CN108139683B (zh) * 2015-09-30 2021-11-05 株式会社尼康 曝光装置及曝光方法、以及平面显示器制造方法
JP6958354B2 (ja) * 2015-09-30 2021-11-02 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN113267964B (zh) * 2015-09-30 2023-05-23 株式会社尼康 曝光装置及曝光方法、以及平面显示器制造方法
US10782619B2 (en) * 2016-09-30 2020-09-22 Nikon Corporation Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
JP6787404B2 (ja) * 2016-09-30 2020-11-18 株式会社ニコン 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法
KR102296327B1 (ko) * 2016-09-30 2021-09-01 가부시키가이샤 니콘 이동체 장치, 이동 방법, 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 그리고 디바이스 제조 방법
US10593586B2 (en) * 2017-03-17 2020-03-17 Lam Research Corporation Systems and methods for controlling substrate approach toward a target horizontal plane
US11209373B2 (en) * 2019-06-21 2021-12-28 Kla Corporation Six degree of freedom workpiece stage
CN112864071B (zh) * 2021-01-18 2022-04-01 长鑫存储技术有限公司 校正半导体制造机台中晶圆位置的工具和方法
CN115790398B (zh) * 2023-01-06 2023-05-12 中国科学院长春光学精密机械与物理研究所 一种基于任意交叉二维光栅的多自由度测量装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
US5196745A (en) 1991-08-16 1993-03-23 Massachusetts Institute Of Technology Magnetic positioning device
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JPH06317431A (ja) * 1993-05-10 1994-11-15 Mitsubishi Heavy Ind Ltd エンコーダの校正方法
JP3448991B2 (ja) * 1994-11-29 2003-09-22 株式会社ニコン ステージ移動制御装置、投影型露光装置およびステージ駆動方法ならびに露光方法。
KR100819239B1 (ko) 1998-03-11 2008-04-03 가부시키가이샤 니콘 자외 레이저 장치, 레이저 장치, 노광 장치와 노광 방법, 디바이스 제조 방법, 자외광 조사 장치, 물체 패턴 검출 장치, 자외광 조사 방법 및 물체 패턴 검출 방법
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
US6771350B2 (en) 2000-02-25 2004-08-03 Nikon Corporation Exposure apparatus and exposure method capable of controlling illumination distribution
DE10011130A1 (de) 2000-03-10 2001-09-13 Mannesmann Vdo Ag Entlüftungseinrichtung für einen Kraftstoffbehälter
JP4714403B2 (ja) 2001-02-27 2011-06-29 エーエスエムエル ユーエス，インコーポレイテッド デュアルレチクルイメージを露光する方法および装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
WO2004053955A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP2004235354A (ja) * 2003-01-29 2004-08-19 Canon Inc 露光装置
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US20080068568A1 (en) 2004-09-30 2008-03-20 Nikon Corporation Projection Optical Device And Exposure Apparatus
US20060139595A1 (en) * 2004-12-27 2006-06-29 Asml Netherlands B.V. Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN2881536Y (zh) * 2005-09-13 2007-03-21 张天兴 一种测量络筒直径的装置
TWI538012B (zh) 2006-01-19 2016-06-11 尼康股份有限公司 移動體驅動方法及移動體驅動系統、圖案形成方法及圖案形成裝置、曝光方法及曝光裝置、以及元件製造方法
JP5195417B2 (ja) 2006-02-21 2013-05-08 株式会社ニコン パターン形成装置、露光装置、露光方法及びデバイス製造方法
EP3418807A1 (en) 2006-08-31 2018-12-26 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US7561280B2 (en) 2007-03-15 2009-07-14 Agilent Technologies, Inc. Displacement measurement sensor head and system having measurement sub-beams comprising zeroth order and first order diffraction components
US7545507B2 (en) * 2007-03-15 2009-06-09 Agilent Technologies, Inc. Displacement measurement system
US9304412B2 (en) 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
NL1036618A1 (nl) * 2008-03-24 2009-09-25 Asml Netherlands Bv Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system.
JP5057235B2 (ja) * 2008-04-04 2012-10-24 株式会社ニコン 較正方法、露光方法及びデバイス製造方法、並びに露光装置
JP2010062210A (ja) * 2008-09-01 2010-03-18 Nikon Corp 露光装置、露光方法、及びデバイス製造方法
US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8446569B2 (en) * 2009-06-19 2013-05-21 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
WO2011016254A1 (ja) 2009-08-07 2011-02-10 株式会社ニコン 移動体装置、露光装置及び露光方法、並びにデバイス製造方法
US8493547B2 (en) * 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
JP2011054694A (ja) 2009-08-31 2011-03-17 Canon Inc 計測装置、露光装置およびデバイス製造方法
NL2005545A (en) * 2009-11-17 2011-05-18 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
KR102203305B1 (ko) * 2012-10-02 2021-01-14 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법

Also Published As

Publication number Publication date
JP6807039B2 (ja) 2021-01-06
JP2022109261A (ja) 2022-07-27
CN108613638A (zh) 2018-10-02
US11256175B2 (en) 2022-02-22
US9891531B2 (en) 2018-02-13
CN108613638B (zh) 2020-09-18
JP7069535B2 (ja) 2022-05-18
KR102203305B1 (ko) 2021-01-14
KR102311833B1 (ko) 2021-10-12
EP2905805B1 (en) 2020-07-22
JPWO2014054690A1 (ja) 2016-08-25
CN104838469B (zh) 2018-04-24
JP2021036345A (ja) 2021-03-04
JP6575829B2 (ja) 2019-09-18
US20230143407A1 (en) 2023-05-11
US20210041789A1 (en) 2021-02-11
US11579532B2 (en) 2023-02-14
US11747736B2 (en) 2023-09-05
EP3723111B1 (en) 2021-09-08
HK1211135A1 (zh) 2016-05-13
US20180136566A1 (en) 2018-05-17
EP2905805A1 (en) 2015-08-12
US10409166B2 (en) 2019-09-10
JP6075657B2 (ja) 2017-02-08
US20150286147A1 (en) 2015-10-08
JP2019194738A (ja) 2019-11-07
JP7288248B2 (ja) 2023-06-07
US20220121125A1 (en) 2022-04-21
US20170235231A1 (en) 2017-08-17
WO2014054690A1 (ja) 2014-04-10
JP2018142020A (ja) 2018-09-13
US9678433B2 (en) 2017-06-13
KR20150064186A (ko) 2015-06-10
US10852639B2 (en) 2020-12-01
EP2905805A4 (en) 2015-11-18
JP2017083886A (ja) 2017-05-18
EP3723111A1 (en) 2020-10-14
JP6344624B2 (ja) 2018-06-20
JP2023101546A (ja) 2023-07-21
CN104838469A (zh) 2015-08-12
KR20210006523A (ko) 2021-01-18
US20190346770A1 (en) 2019-11-14

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