SG10201803494SA - Method of Processing Wafer - Google Patents
Method of Processing WaferInfo
- Publication number
- SG10201803494SA SG10201803494SA SG10201803494SA SG10201803494SA SG10201803494SA SG 10201803494S A SG10201803494S A SG 10201803494SA SG 10201803494S A SG10201803494S A SG 10201803494SA SG 10201803494S A SG10201803494S A SG 10201803494SA SG 10201803494S A SG10201803494S A SG 10201803494SA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- protective film
- processing
- processing wafer
- onto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017208405.7A DE102017208405B4 (de) | 2017-05-18 | 2017-05-18 | Verfahren zum Bearbeiten eines Wafers und Schutzfolie |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201803494SA true SG10201803494SA (en) | 2018-12-28 |
Family
ID=64272078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201803494SA SG10201803494SA (en) | 2017-05-18 | 2018-04-26 | Method of Processing Wafer |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11637074B2 (https=) |
| JP (3) | JP6888218B2 (https=) |
| KR (1) | KR102105114B1 (https=) |
| CN (1) | CN108933098B (https=) |
| DE (1) | DE102017208405B4 (https=) |
| SG (1) | SG10201803494SA (https=) |
| TW (1) | TWI683392B (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110663106B (zh) * | 2017-05-18 | 2023-09-22 | 株式会社迪思科 | 在加工晶圆中使用的保护片、用于晶圆的处理系统以及晶圆与保护片的组合体 |
| US12312512B2 (en) | 2019-02-26 | 2025-05-27 | Disco Corporation | Adhesive sheet for backgrinding and production method for semiconductor wafer |
| US12243766B2 (en) | 2019-02-26 | 2025-03-04 | Disco Corporation | Back grinding adhesive sheet, and method for manufacturing semiconductor wafer |
| JP7277019B2 (ja) * | 2019-03-05 | 2023-05-18 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7333192B2 (ja) * | 2019-04-23 | 2023-08-24 | 株式会社ディスコ | 移設方法 |
| JP7229844B2 (ja) | 2019-04-25 | 2023-02-28 | 株式会社ディスコ | ウエーハの加工方法 |
| JP7330616B2 (ja) * | 2019-05-10 | 2023-08-22 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7330615B2 (ja) * | 2019-05-10 | 2023-08-22 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7286245B2 (ja) * | 2019-06-07 | 2023-06-05 | 株式会社ディスコ | ウェーハの加工方法 |
| DE102019211540A1 (de) * | 2019-08-01 | 2021-02-04 | Disco Corporation | Verfahren zum bearbeiten eines substrats |
| JP7345973B2 (ja) * | 2019-08-07 | 2023-09-19 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7341606B2 (ja) * | 2019-09-11 | 2023-09-11 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2021064627A (ja) * | 2019-10-10 | 2021-04-22 | 株式会社ディスコ | ウェーハの加工方法 |
| US11508606B2 (en) * | 2019-11-05 | 2022-11-22 | Nxp B.V. | Technique for handling diced wafers of integrated circuits |
| JP7430515B2 (ja) * | 2019-11-06 | 2024-02-13 | 株式会社ディスコ | ウエーハの処理方法 |
| JP2021077720A (ja) * | 2019-11-07 | 2021-05-20 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7455470B2 (ja) * | 2020-03-13 | 2024-03-26 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7536393B2 (ja) * | 2020-06-02 | 2024-08-20 | 株式会社ディスコ | ウェーハの加工方法、保護部材貼着装置、及び、加工装置 |
| JP2022041447A (ja) | 2020-09-01 | 2022-03-11 | 株式会社ディスコ | ウェーハの加工方法 |
| CN112157580A (zh) * | 2020-09-26 | 2021-01-01 | 绍兴自远磨具有限公司 | 一种硅片研磨盘及其制备方法和用途 |
| US11587809B2 (en) * | 2020-09-30 | 2023-02-21 | Advanced Semiconductor Engineering, Inc. | Wafer supporting mechanism and method for wafer dicing |
| JP7709877B2 (ja) * | 2021-09-15 | 2025-07-17 | 株式会社Ｓｃｒｅｅｎホールディングス | 端部状態確認装置 |
| JP7845959B2 (ja) * | 2022-08-22 | 2026-04-14 | 株式会社ディスコ | 被加工物の加工方法 |
| JP2024079914A (ja) | 2022-12-01 | 2024-06-13 | 株式会社ディスコ | 樹脂シート |
| DE102023203941A1 (de) * | 2023-04-27 | 2024-10-31 | Carl Zeiss Smt Gmbh | Verfahren zur Nachbearbeitung und zur Handhabung von MEMS-Chips |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS57173135A (en) * | 1981-04-17 | 1982-10-25 | Toshio Kunugi | Manufacture of super-strong film |
| JPS58153352A (ja) | 1982-03-09 | 1983-09-12 | Toshiba Corp | 半導体素子の製造方法 |
| JP2000100558A (ja) * | 1998-09-18 | 2000-04-07 | Matsushita Electric Ind Co Ltd | 発光装置 |
| JP4780828B2 (ja) * | 2000-11-22 | 2011-09-28 | 三井化学株式会社 | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
| JP2003037155A (ja) * | 2001-07-25 | 2003-02-07 | Mitsubishi Gas Chem Co Inc | 薄葉化ウェハーの製造法 |
| JP2002203821A (ja) | 2000-12-28 | 2002-07-19 | Mitsubishi Gas Chem Co Inc | 接着および剥離法 |
| DE10121556A1 (de) * | 2001-05-03 | 2002-11-14 | Infineon Technologies Ag | Verfahren zum Rückseitenschleifen von Wafern |
| US6777267B2 (en) * | 2002-11-01 | 2004-08-17 | Agilent Technologies, Inc. | Die singulation using deep silicon etching |
| JP2005191297A (ja) | 2003-12-25 | 2005-07-14 | Jsr Corp | ダイシングフィルム及び半導体ウェハの切断方法 |
| JP2005191296A (ja) | 2003-12-25 | 2005-07-14 | Jsr Corp | バックグラインドテープ及び半導体ウェハの研磨方法 |
| US20050244631A1 (en) * | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
| JP2006210401A (ja) * | 2005-01-25 | 2006-08-10 | Disco Abrasive Syst Ltd | ウェーハの分割方法 |
| JP4930679B2 (ja) | 2005-12-14 | 2012-05-16 | 日本ゼオン株式会社 | 半導体素子の製造方法 |
| JP5151104B2 (ja) | 2006-09-22 | 2013-02-27 | パナソニック株式会社 | 電子部品の製造方法 |
| JP5064985B2 (ja) * | 2006-12-05 | 2012-10-31 | 古河電気工業株式会社 | 半導体ウェハの処理方法 |
| TWI324802B (en) * | 2007-02-16 | 2010-05-11 | Advanced Semiconductor Eng | Method of thinning wafer |
| JP4934620B2 (ja) | 2008-03-25 | 2012-05-16 | 古河電気工業株式会社 | ウエハ加工用テープ |
| JP2010027685A (ja) | 2008-07-15 | 2010-02-04 | Lintec Corp | 半導体ウエハの研削方法 |
| JP2011054827A (ja) | 2009-09-03 | 2011-03-17 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法及び表面保護テープ |
| US8252665B2 (en) * | 2009-09-14 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protection layer for adhesive material at wafer edge |
| JP5545640B2 (ja) * | 2010-05-11 | 2014-07-09 | 株式会社ディスコ | 研削方法 |
| KR20120023258A (ko) | 2010-09-01 | 2012-03-13 | 주식회사 이오테크닉스 | 웨이퍼 가공방법 및 웨이퍼 가공장치 |
| WO2013095344A1 (en) * | 2011-12-19 | 2013-06-27 | Intel Corporation | Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate |
| JP6009217B2 (ja) | 2012-05-18 | 2016-10-19 | 株式会社ディスコ | 保護部材の貼着方法 |
| JP6061590B2 (ja) * | 2012-09-27 | 2017-01-18 | 株式会社ディスコ | 表面保護部材および加工方法 |
| KR102061695B1 (ko) * | 2012-10-17 | 2020-01-02 | 삼성전자주식회사 | 웨이퍼 가공 방법 |
| JP6004100B2 (ja) * | 2013-05-24 | 2016-10-05 | 富士電機株式会社 | 半導体装置の製造方法 |
| JP5666659B2 (ja) * | 2013-07-17 | 2015-02-12 | リンテック株式会社 | ウェハ加工用シート |
| US9184083B2 (en) * | 2013-07-29 | 2015-11-10 | 3M Innovative Properties Company | Apparatus, hybrid laminated body, method and materials for temporary substrate support |
| US20160176169A1 (en) * | 2013-08-01 | 2016-06-23 | Lintec Corporation | Protective Film Formation-Use Composite Sheet |
| JP2016001677A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | ウエーハの加工方法 |
| US9786643B2 (en) * | 2014-07-08 | 2017-10-10 | Micron Technology, Inc. | Semiconductor devices comprising protected side surfaces and related methods |
| US11437275B2 (en) | 2015-08-31 | 2022-09-06 | Disco Corporation | Method of processing wafer and protective sheeting for use in this method |
| DE102015216619B4 (de) | 2015-08-31 | 2017-08-10 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
| DE102018200656A1 (de) * | 2018-01-16 | 2019-07-18 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
| DE102018202254A1 (de) * | 2018-02-14 | 2019-08-14 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
-
2017
- 2017-05-18 DE DE102017208405.7A patent/DE102017208405B4/de active Active
-
2018
- 2018-04-20 JP JP2018081510A patent/JP6888218B2/ja active Active
- 2018-04-26 SG SG10201803494SA patent/SG10201803494SA/en unknown
- 2018-05-14 US US15/978,869 patent/US11637074B2/en active Active
- 2018-05-17 KR KR1020180056642A patent/KR102105114B1/ko active Active
- 2018-05-17 TW TW107116827A patent/TWI683392B/zh active
- 2018-05-18 CN CN201810477901.8A patent/CN108933098B/zh active Active
-
2019
- 2019-05-27 JP JP2019098689A patent/JP6740542B2/ja active Active
-
2020
- 2020-03-11 JP JP2020042019A patent/JP2020113778A/ja active Pending
-
2021
- 2021-01-26 US US17/158,604 patent/US11784138B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE102017208405B4 (de) | 2024-05-02 |
| KR102105114B1 (ko) | 2020-04-27 |
| DE102017208405A1 (de) | 2018-11-22 |
| TWI683392B (zh) | 2020-01-21 |
| US20180337141A1 (en) | 2018-11-22 |
| JP2018195805A (ja) | 2018-12-06 |
| JP2020113778A (ja) | 2020-07-27 |
| US20210151390A1 (en) | 2021-05-20 |
| US11637074B2 (en) | 2023-04-25 |
| KR20180127230A (ko) | 2018-11-28 |
| CN108933098A (zh) | 2018-12-04 |
| CN108933098B (zh) | 2024-12-24 |
| JP2019169727A (ja) | 2019-10-03 |
| TW201909333A (zh) | 2019-03-01 |
| US11784138B2 (en) | 2023-10-10 |
| JP6740542B2 (ja) | 2020-08-19 |
| JP6888218B2 (ja) | 2021-06-16 |
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