TWI683392B - 處理晶圓的方法 - Google Patents

處理晶圓的方法 Download PDF

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Publication number
TWI683392B
TWI683392B TW107116827A TW107116827A TWI683392B TW I683392 B TWI683392 B TW I683392B TW 107116827 A TW107116827 A TW 107116827A TW 107116827 A TW107116827 A TW 107116827A TW I683392 B TWI683392 B TW I683392B
Authority
TW
Taiwan
Prior art keywords
wafer
protective film
sheet
buffer layer
adhesive
Prior art date
Application number
TW107116827A
Other languages
English (en)
Chinese (zh)
Other versions
TW201909333A (zh
Inventor
凱爾Ｈ 普瑞渥瑟
Original Assignee
日商迪思科股份有限公司
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Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201909333A publication Critical patent/TW201909333A/zh
Application granted granted Critical
Publication of TWI683392B publication Critical patent/TWI683392B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW107116827A 2017-05-18 2018-05-17 處理晶圓的方法 TWI683392B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017208405.7A DE102017208405B4 (de) 2017-05-18 2017-05-18 Verfahren zum Bearbeiten eines Wafers und Schutzfolie
DE102017208405.7 2017-05-18

Publications (2)

Publication Number Publication Date
TW201909333A TW201909333A (zh) 2019-03-01
TWI683392B true TWI683392B (zh) 2020-01-21

Family

ID=64272078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116827A TWI683392B (zh) 2017-05-18 2018-05-17 處理晶圓的方法

Country Status (7)

Country Link
US (2) US11637074B2 (https=)
JP (3) JP6888218B2 (https=)
KR (1) KR102105114B1 (https=)
CN (1) CN108933098B (https=)
DE (1) DE102017208405B4 (https=)
SG (1) SG10201803494SA (https=)
TW (1) TWI683392B (https=)

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JP7229844B2 (ja) 2019-04-25 2023-02-28 株式会社ディスコ ウエーハの加工方法
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JP7345973B2 (ja) * 2019-08-07 2023-09-19 株式会社ディスコ ウェーハの加工方法
JP7341606B2 (ja) * 2019-09-11 2023-09-11 株式会社ディスコ ウェーハの加工方法
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JP7430515B2 (ja) * 2019-11-06 2024-02-13 株式会社ディスコ ウエーハの処理方法
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JP7455470B2 (ja) * 2020-03-13 2024-03-26 株式会社ディスコ ウェーハの加工方法
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JP2022041447A (ja) 2020-09-01 2022-03-11 株式会社ディスコ ウェーハの加工方法
CN112157580A (zh) * 2020-09-26 2021-01-01 绍兴自远磨具有限公司 一种硅片研磨盘及其制备方法和用途
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JP7709877B2 (ja) * 2021-09-15 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 端部状態確認装置
JP7845959B2 (ja) * 2022-08-22 2026-04-14 株式会社ディスコ 被加工物の加工方法
JP2024079914A (ja) 2022-12-01 2024-06-13 株式会社ディスコ 樹脂シート
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Also Published As

Publication number Publication date
DE102017208405B4 (de) 2024-05-02
KR102105114B1 (ko) 2020-04-27
DE102017208405A1 (de) 2018-11-22
US20180337141A1 (en) 2018-11-22
JP2018195805A (ja) 2018-12-06
JP2020113778A (ja) 2020-07-27
SG10201803494SA (en) 2018-12-28
US20210151390A1 (en) 2021-05-20
US11637074B2 (en) 2023-04-25
KR20180127230A (ko) 2018-11-28
CN108933098A (zh) 2018-12-04
CN108933098B (zh) 2024-12-24
JP2019169727A (ja) 2019-10-03
TW201909333A (zh) 2019-03-01
US11784138B2 (en) 2023-10-10
JP6740542B2 (ja) 2020-08-19
JP6888218B2 (ja) 2021-06-16

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