SG10201801373RA - Substrate polisher and polishing method - Google Patents

Substrate polisher and polishing method

Info

Publication number
SG10201801373RA
SG10201801373RA SG10201801373RA SG10201801373RA SG10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA
Authority
SG
Singapore
Prior art keywords
substrate
polisher
polishing
polishing member
polishing method
Prior art date
Application number
SG10201801373RA
Other languages
English (en)
Inventor
Yasuda Hozumi
Kobata Itsuki
Takahashi Nobuyuki
SAKUGAWA Suguru
Takada Nobuyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201801373RA publication Critical patent/SG10201801373RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
SG10201801373RA 2017-02-22 2018-02-20 Substrate polisher and polishing method SG10201801373RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017031243A JP2018134710A (ja) 2017-02-22 2017-02-22 基板の研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
SG10201801373RA true SG10201801373RA (en) 2018-09-27

Family

ID=63166818

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201801373RA SG10201801373RA (en) 2017-02-22 2018-02-20 Substrate polisher and polishing method

Country Status (6)

Country Link
US (1) US20180236630A1 (enExample)
JP (1) JP2018134710A (enExample)
KR (1) KR20180097136A (enExample)
CN (1) CN108453618A (enExample)
SG (1) SG10201801373RA (enExample)
TW (1) TW201900338A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
CN109227388A (zh) * 2018-09-19 2019-01-18 大连理工大学 一种环抛机盘面修整系统及其工作方法
JP7145084B2 (ja) 2019-01-11 2022-09-30 株式会社荏原製作所 基板処理装置および基板処理装置において部分研磨されるべき領域を特定する方法
US11235454B2 (en) * 2019-01-14 2022-02-01 Dynabrade, Inc. Spring loaded adjustable head
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
TWI771668B (zh) * 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
TWI826280B (zh) 2019-11-22 2023-12-11 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
JP7442314B2 (ja) * 2019-12-24 2024-03-04 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
JP7341918B2 (ja) * 2020-02-06 2023-09-11 株式会社荏原製作所 基板処理装置および基板処理方法
CN111482891A (zh) * 2020-04-20 2020-08-04 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
JP7530237B2 (ja) * 2020-08-17 2024-08-07 キオクシア株式会社 研磨装置および研磨方法
WO2022187259A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Roller for location-specific wafer polishing
JP7733487B2 (ja) * 2021-07-07 2025-09-03 株式会社荏原製作所 研磨装置および研磨方法
JP7764215B2 (ja) * 2021-11-22 2025-11-05 株式会社ディスコ クリープフィード研削装置
CN114012605B (zh) * 2022-01-05 2022-05-17 杭州众硅电子科技有限公司 一种抛光垫修整装置
KR20250038724A (ko) * 2022-07-14 2025-03-19 어플라이드 머티어리얼스, 인코포레이티드 페이스-업 연마에서의 두께 모니터링
CN116460667B (zh) * 2022-12-30 2023-11-07 北京创思工贸有限公司 氟化钙光学零件的加工方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943666A (en) * 1974-07-31 1976-03-16 Dysan Corporation Method and apparatus for burnishing flexible recording material
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
JPS59173555U (ja) * 1984-01-17 1984-11-20 株式会社ノリタケカンパニーリミテド 研削砥石を傾斜させた研削装置に用いられる傾斜フランジ
US4958463A (en) * 1988-06-06 1990-09-25 United Technologies Corporation Optical surface quality improving arrangement
JPH033765A (ja) * 1989-05-29 1991-01-09 Sony Corp 剛性基板の表面処理方法
JPH04322964A (ja) * 1991-04-22 1992-11-12 Amada Washino Co Ltd 研削制御装置
JPH074750B2 (ja) * 1992-12-03 1995-01-25 株式会社松田精機 フイルム研磨材を用いた平面研磨装置
JP3020800B2 (ja) * 1994-05-16 2000-03-15 株式会社ノリタケカンパニーリミテド 疵取り用研削装置
JPH0811042A (ja) * 1994-06-30 1996-01-16 Nippondenso Co Ltd 平面研削加工方法
JPH0947947A (ja) * 1994-08-30 1997-02-18 Seiko Seiki Co Ltd 研削装置、並びに研削方法、並びに半導体装置及び半導体基板の製造方法
JPH08108360A (ja) * 1994-10-11 1996-04-30 Fuji Photo Film Co Ltd ガラス基板の研磨装置
JPH10329015A (ja) * 1997-03-24 1998-12-15 Canon Inc 研磨装置および研磨方法
JPH11285978A (ja) * 1998-04-03 1999-10-19 Ebara Corp 砥石の保持構造及び研磨装置
JP3652163B2 (ja) * 1999-03-15 2005-05-25 キヤノン株式会社 研磨方法
JP2001353659A (ja) * 2000-06-16 2001-12-25 Okamoto Machine Tool Works Ltd 研磨ウエハの研磨合否判定方法
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
JP2003282493A (ja) * 2001-08-14 2003-10-03 Sony Corp 研磨装置および研磨方法
US6875086B2 (en) * 2003-01-10 2005-04-05 Intel Corporation Surface planarization
CN1822905A (zh) * 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
JP2005177925A (ja) * 2003-12-19 2005-07-07 Olympus Corp 研磨加工方法
JP4406772B2 (ja) * 2005-04-01 2010-02-03 株式会社サンシン 板状部材表面傷修復装置
JP2009190109A (ja) * 2008-02-13 2009-08-27 Lasertec Corp 基板保持装置及び基板加工装置
JP5369478B2 (ja) * 2008-04-11 2013-12-18 株式会社ニコン 研磨装置
US9393669B2 (en) * 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
CN103231303B (zh) * 2013-05-15 2016-02-24 清华大学 化学机械抛光设备

Also Published As

Publication number Publication date
US20180236630A1 (en) 2018-08-23
JP2018134710A (ja) 2018-08-30
KR20180097136A (ko) 2018-08-30
TW201900338A (zh) 2019-01-01
CN108453618A (zh) 2018-08-28

Similar Documents

Publication Publication Date Title
SG10201801373RA (en) Substrate polisher and polishing method
TW200802526A (en) Substrate treatment apparatus and substrate treatment method
SG10201810852TA (en) Substrate processing apparatus and processing method
SG10201709841XA (en) Imprint apparatus and article manufacturing method
WO2011028556A3 (en) Structured abrasive article and method of using the same
NZ717661A (en) System and method for adjusting alignment of a panel
BR112018002497A2 (pt) processo e dispositivo para revestimento de superfícies estreitas
ATE536128T1 (de) Einrichtung zum manuellen waschen von böden oder von flachen oberflächen allgemein
TW201611949A (en) Polishing pad and method for making the same
MX2017010621A (es) Articulo de fregar y metodo para fabricarlo.
TW201611946A (en) Modifying substrate thickness profiles
TWD179672S (zh) 基板保持環之部分
MY156911A (en) Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
JP2017006534A5 (enExample)
PH12015500234A1 (en) Method and device for cleaning baking surfaces
SG11201908381RA (en) Substrate polishing device and substrate polishing method
MY181954A (en) Conveying apparatus
TW200630184A (en) Positioning apparatus and positioning method of glass substrate, edge surface polishing apparatus and edge surface polishing method
PH12017501030A1 (en) Polishing device and polishing method
TW201711778A (en) Ultrasonic vibration bonding device
WO2019155375A8 (en) Method and apparatus for cleaning surfaces
WO2017160129A3 (ko) 적층시트 연마방법 및 이를 수행하는 적층시트 연마장치
MX388020B (es) Conector eléctrico y método de conexión.
DE60208557D1 (de) Schleifblatt mit schlitzen zum staubsaugen, vorrichtung zur endbearbeitung von oberflächen und schleifblatthalterung
EP3281742B1 (en) Polishing method