SG10201801373RA - Substrate polisher and polishing method - Google Patents

Substrate polisher and polishing method

Info

Publication number
SG10201801373RA
SG10201801373RA SG10201801373RA SG10201801373RA SG10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA SG 10201801373R A SG10201801373R A SG 10201801373RA
Authority
SG
Singapore
Prior art keywords
substrate
polisher
polishing
polishing member
polishing method
Prior art date
Application number
SG10201801373RA
Inventor
Yasuda Hozumi
Kobata Itsuki
Takahashi Nobuyuki
SAKUGAWA Suguru
Takada Nobuyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201801373RA publication Critical patent/SG10201801373RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

SUBSTRATE POLISHER AND POLISHING METHOD A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher. Representative drawing: Fig. 1
SG10201801373RA 2017-02-22 2018-02-20 Substrate polisher and polishing method SG10201801373RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017031243A JP2018134710A (en) 2017-02-22 2017-02-22 Polishing device and polishing method of substrate

Publications (1)

Publication Number Publication Date
SG10201801373RA true SG10201801373RA (en) 2018-09-27

Family

ID=63166818

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201801373RA SG10201801373RA (en) 2017-02-22 2018-02-20 Substrate polisher and polishing method

Country Status (6)

Country Link
US (1) US20180236630A1 (en)
JP (1) JP2018134710A (en)
KR (1) KR20180097136A (en)
CN (1) CN108453618A (en)
SG (1) SG10201801373RA (en)
TW (1) TW201900338A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6884015B2 (en) * 2017-03-22 2021-06-09 株式会社荏原製作所 Substrate polishing equipment and polishing method
CN109227388A (en) * 2018-09-19 2019-01-18 大连理工大学 A kind of glass polishing machine disk conditioning system and its working method
JP7145084B2 (en) * 2019-01-11 2022-09-30 株式会社荏原製作所 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR SPECIFYING REGION TO BE POLISHED IN SUBSTRATE PROCESSING APPARATUS
US11235454B2 (en) * 2019-01-14 2022-02-01 Dynabrade, Inc. Spring loaded adjustable head
JP7317532B2 (en) * 2019-03-19 2023-07-31 キオクシア株式会社 Polishing device and polishing method
TWI771668B (en) * 2019-04-18 2022-07-21 美商應用材料股份有限公司 Temperature-based in-situ edge assymetry correction during cmp
TWI797501B (en) 2019-11-22 2023-04-01 美商應用材料股份有限公司 Wafer edge asymmetry correction using groove in polishing pad
JP7442314B2 (en) * 2019-12-24 2024-03-04 東京エレクトロン株式会社 Substrate processing equipment and substrate processing method
JP7387471B2 (en) * 2020-02-05 2023-11-28 株式会社荏原製作所 Substrate processing equipment and substrate processing method
JP7341918B2 (en) * 2020-02-06 2023-09-11 株式会社荏原製作所 Substrate processing equipment and substrate processing method
CN114012605B (en) * 2022-01-05 2022-05-17 杭州众硅电子科技有限公司 Polishing pad trimming device
CN116460667B (en) * 2022-12-30 2023-11-07 北京创思工贸有限公司 Processing method of calcium fluoride optical part

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943666A (en) * 1974-07-31 1976-03-16 Dysan Corporation Method and apparatus for burnishing flexible recording material
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
JPS59173555U (en) * 1984-01-17 1984-11-20 株式会社ノリタケカンパニーリミテド Inclined flange used in grinding equipment with an inclined grinding wheel
US4958463A (en) * 1988-06-06 1990-09-25 United Technologies Corporation Optical surface quality improving arrangement
JPH033765A (en) * 1989-05-29 1991-01-09 Sony Corp Processing method for surface of rigid substrate
JPH04322964A (en) * 1991-04-22 1992-11-12 Amada Washino Co Ltd Grinding control method
JPH074750B2 (en) * 1992-12-03 1995-01-25 株式会社松田精機 Planar polishing device using film polishing material
JP3020800B2 (en) * 1994-05-16 2000-03-15 株式会社ノリタケカンパニーリミテド Grinding equipment for scratch removal
JPH0811042A (en) * 1994-06-30 1996-01-16 Nippondenso Co Ltd Surface grinding method
JPH0947947A (en) * 1994-08-30 1997-02-18 Seiko Seiki Co Ltd Grinding device, and grinding method, and semiconductor device, and manufacture of semiconductor substrate
JPH08108360A (en) * 1994-10-11 1996-04-30 Fuji Photo Film Co Ltd Polishing device of glass substrate
JPH10329015A (en) * 1997-03-24 1998-12-15 Canon Inc Polishing device and polishing method
JPH11285978A (en) * 1998-04-03 1999-10-19 Ebara Corp Grinding wheel holding structure and polishing device
JP3652163B2 (en) * 1999-03-15 2005-05-25 キヤノン株式会社 Polishing method
JP2001353659A (en) * 2000-06-16 2001-12-25 Okamoto Machine Tool Works Ltd Method for determining acceptability of polish of polished wafer
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
JP2003282493A (en) * 2001-08-14 2003-10-03 Sony Corp Polishing machine and polishing method
US6875086B2 (en) * 2003-01-10 2005-04-05 Intel Corporation Surface planarization
CN1822905A (en) * 2003-06-06 2006-08-23 P.C.T.系统公司 Method and apparatus to process substrates with megasonic energy
JP2005177925A (en) * 2003-12-19 2005-07-07 Olympus Corp Polishing method
JP4406772B2 (en) * 2005-04-01 2010-02-03 株式会社サンシン Plate-shaped member surface flaw repair device
JP2009190109A (en) * 2008-02-13 2009-08-27 Lasertec Corp Substrate holding device and substrate machining device
JP5369478B2 (en) * 2008-04-11 2013-12-18 株式会社ニコン Polishing equipment
US9393669B2 (en) * 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
CN103231303B (en) * 2013-05-15 2016-02-24 清华大学 Chemical-mechanical polisher

Also Published As

Publication number Publication date
KR20180097136A (en) 2018-08-30
TW201900338A (en) 2019-01-01
JP2018134710A (en) 2018-08-30
CN108453618A (en) 2018-08-28
US20180236630A1 (en) 2018-08-23

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