JP2009190109A - Substrate holding device and substrate machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate grinding device which horizontally holds a substrate and carries out a stable machining. <P>SOLUTION: The substrate machining device 100 is formed of: a stage 2 on which the substrate W is mounted: first and second suction portions formed in the stage 2, for sucking the substrate W; a switching portion 3 for switching ON/OFF states of the first and second suction portions; and a machining probe 20 for carrying out operation on the substrate W. The switching portion 3 turns on one of the first and second suction portions according to the location of the machining probe 20, and turns off the other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate holding apparatus and a substrate processing apparatus, and more particularly to a substrate holding apparatus that holds a substrate by suction and a substrate processing apparatus using the same.

  A manufacturing process of a liquid crystal display device, a semiconductor device, or the like includes a process for correcting defects such as foreign matters attached to a substrate. In the process of correcting the protrusion defect, the polishing head provided on the processing probe is disposed close to the surface of the substrate. Then, the protrusion defect is corrected by polishing the protrusion defect with a polishing head (for example, Patent Document 1).

A substrate polishing apparatus that performs such substrate polishing processing includes a flat stage that holds the substrate. As shown in FIG. 5, the stage 2 is provided with a plurality of suction holes 12 for vacuum suction of the substrate W. By performing vacuum suction with the plurality of suction holes 12, the substrate W is fixed to the stage 2 so that the substrate W does not deviate from the stage 2 during polishing.
JP-A-6-313871

  However, according to the experience of the present inventor, there may be a problem that the amount of polishing in the local region in the polishing surface of the substrate varies. That is, in the conventional substrate holding device, the substrate may be fixed to the mounting table by vacuum suction while the substrate is deflected. The substrate is excessively fixed by a plurality of suction holes so as not to deviate from the mounting table during polishing. For this reason, when polishing is performed in the vicinity of the suction hole, if the substrate is polished while being pushed by the polishing head, there is no escape area for the deflection of the substrate, and the substrate is greatly deformed without becoming a flat surface of the mounting table. As a result, polishing instability such as an increase in the amount of polishing in the local region near the suction hole or a decrease in the amount of polishing has occurred. As described above, when the thickness of the substrate varies, there is a risk that the quality of the liquid crystal display device or the like to be manufactured may be reduced or the yield may be reduced.

  The present invention has been made against the background of such circumstances, and an object of the present invention is to provide a substrate processing apparatus that can hold a substrate flat and perform stable processing.

  A substrate processing apparatus according to a first aspect of the present invention includes a mounting table on which a substrate is mounted, a first suction unit and a second suction unit that are provided on the mounting table and suck the substrate, and the first A switching unit that switches ON / OFF of the suction unit and the second suction unit, and a probe for performing an operation on the substrate, the switching unit and the first suction unit according to the position of the probe One of the second suction portions is turned on and the other is turned off. Thereby, the flatness of a board | substrate can be improved and the stable process etc. are attained.

  The substrate processing apparatus according to a second aspect of the present invention is the substrate processing apparatus, wherein the switching unit moves the first suction unit when the probe moves to a position corresponding to the first suction unit. OFF, turn on the second suction part, and turn off the first suction part and turn on the second suction part when the probe moves to a position corresponding to the first suction part. It is characterized by. Thereby, the flatness of a board | substrate can be improved and the stable process etc. are attained.

  In the substrate processing apparatus according to a third aspect of the present invention, in the above substrate processing apparatus, the switching unit is in a boundary region between a position corresponding to the first suction unit and a position corresponding to the second suction unit. The first suction unit and the second suction unit are turned on. Thereby, even when the boundary region is processed, the substrate does not deviate from the mounting table, and stable processing or the like is possible.

  A substrate processing apparatus according to a fourth aspect of the present invention is the above substrate processing apparatus, wherein the probe includes a polishing head. The present invention is particularly effective in such a case.

  A substrate processing method according to a fifth aspect of the present invention is a substrate processing method for processing a substrate with a probe, wherein the substrate is mounted on a mounting table, and the first suction portion provided on the mounting table is provided. Then, the substrate is adsorbed by the second adsorbing unit, one of the first adsorbing unit and the second adsorbing unit is turned on and the other is turned off according to the position of the probe. Thereby, the flatness of a board | substrate can be improved and the stable process etc. are attained.

  The substrate processing method according to a sixth aspect of the present invention is the substrate processing method described above, wherein when the probe moves to a position corresponding to the first suction portion, the first suction portion is turned OFF, and When the second suction part is turned on and the probe moves to a position corresponding to the first suction part, the first suction part is turned off and the second suction part is turned on. Thereby, the flatness of a board | substrate can be improved and the stable process etc. are attained.

  The substrate processing method according to a seventh aspect of the present invention is the substrate processing method described above, wherein the first suction part is located in a boundary region between a position corresponding to the first suction part and a position corresponding to the second suction part. And the second suction part is turned on. Thereby, even when the boundary region is processed, the substrate does not deviate from the mounting table, and stable processing or the like is possible.

  A substrate processing method according to an eighth aspect of the present invention is characterized in that in the above substrate processing method, polishing is performed by the probe. The present invention is particularly effective in such a case.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate processing apparatus which can hold | maintain a board | substrate flat and can perform a stable process can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. The following description shows preferred examples of the present invention, and the scope of the present invention is not limited to the following examples. In the following description, the same reference numerals denote the same contents.

  A substrate processing apparatus according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a substrate polishing apparatus 100 that is an example of a substrate processing apparatus according to the present embodiment. As shown in FIG. 1, the substrate polishing apparatus 100 includes a base 1, a stage 2, a switching unit 3, a support column 4, a support rail 5, an optical device 6, a protrusion removing device 7, a lifting mechanism 8, a motor control circuit 9, and a motor. 10, a processing device 11. The substrate polishing apparatus 100 is an apparatus that corrects protrusion defects such as foreign matters on the substrate W by polishing. The substrate W is a pattern substrate such as a color filter substrate used in a liquid crystal display device, for example. On the substrate W, patterns such as a colored layer and a light shielding layer are formed.

  A stage 2 is provided on the base 1. The stage 2 is a mounting table on which the substrate W is mounted. The stage 2 is provided with a plurality of suction holes for vacuum suction of the substrate W. The configuration of the stage 2 will be described in detail later. A switching unit 3 is connected to a suction part formed of a plurality of suction holes provided in the stage 2 via a pipe.

  A support column 4 is connected on the base 1. The support column 4 is fixed to the base 1 outside the stage 2. The support column 4 is provided along the vertical direction (Z direction). A support rail 5 is connected to the upper portion of the column 4. The support rail 5 is provided along the horizontal direction. The front end side of the support rail 5 is located above the substrate W.

  An optical device 6 is attached below the front end side of the support rail 5. The optical device 6 optically detects defects such as foreign matters attached on the substrate W. That is, the optical device 6 is a defect detection device that detects defects on the substrate W, and detects protrusions on the substrate W. The optical device 6 includes a light source that illuminates the substrate W, a photodetector that detects reflected light reflected by the substrate W, and an optical system between them. Then, a protrusion formed by foreign matter or the like adhering to the substrate W is detected by a known method. The processing device 11 stores the address of the protrusion defect detected by the optical device 6. That is, the processing device 11 stores the position where the protrusion on the target object is detected.

  A protrusion removing device 7 is provided near the center of the support rail 5. The protrusion removing device 7 provided below the support rail 5 is located between the optical device 6 and the support column 4. The protrusion removing device 7 is connected to a lifting mechanism 8 having a ball screw provided in the vertical direction. The ball screw of the elevating mechanism 8 is rotated by the rotational drive of the motor 10. Thereby, the protrusion removal apparatus 7 moves to an up-down direction (Z direction). Further, the protrusion removing device 7 can be moved in the horizontal direction (XY direction) by a driving mechanism (not shown).

  The motor 10 is driven and controlled by a motor control circuit 9. The processing device 11 is an information processing device such as a personal computer, and controls a drive mechanism that drives the switching unit 3, the motor control circuit 9, and the protrusion removal device in the horizontal direction. The processing device 11 stores the position of the protrusion defect detected by the optical device 6. By the signal from the processing apparatus 11, the protrusion removing apparatus 7 moves to the position of the protrusion defect and descends to the vicinity of the substrate W.

  The protrusion removing device 7 includes a processing probe having a polishing head. The configuration of this processing probe will be described with reference to FIG. FIG. 2 is a diagram illustrating a configuration of the processing probe 20 provided in the protrusion removing device 7. As shown in FIG. 2, the processing probe 20 includes a polishing head 21, a support portion 22, a first reel 23, a second reel 24, and a polishing tape 25.

  The processing probe 20 is provided with a support portion 22 to which a polishing head 21 is attached. A first reel 23 and a second reel 24 are attached to the support portion 22. The polishing head 21 is disposed below the support portion 22 at a position approximately at the center between the first reel 23 and the second reel 24. The first reel 23 and the second reel 24 are rotatably attached to the support portion 22.

  A polishing tape 25 is attached to the first reel 23 and the second reel 24. The polishing tape 25 is mounted on the first reel 23 and the second reel 24 via the polishing head 21. The polishing tape 25 is provided in contact with the lower surface of the polishing head 21. The lower surface of the polishing head 21 is a curved surface. Further, the lower surface of the polishing tape 25 is roughened.

  Although not shown here, the first reel 23 is provided with a motor. By driving this motor, the first reel 23 and the second reel 24 rotate in the direction of the arrow. As a result, the polishing tape 25 is wound around the first reel 23 from the second reel 24 via the polishing head 21. That is, the polishing tape 25 is sent out in the direction of the arrow along the lower surface of the polishing head 21.

  The polishing head 21 is disposed so as to protrude downward from the processing probe 20 (on the substrate W side). The stage 2 is moved so that the polishing head 21 is positioned at the protrusion defect D of the substrate W. Then, the protrusion defect D is polished by feeding the polishing tape 25 at the position of the protrusion defect D as shown in FIG. Thereby, the protrusion defect D can be removed and the defect can be corrected. Note that the processing probe 20 used in the present invention is not limited to the above-described configuration. That is, any known processing probe can be used. For example, a processing probe that directly polishes the projection defect D by a polishing head can be used. Of course, other processing probes can be used.

  Here, the configuration of the stage 2 will be described with reference to FIG. FIG. 3 is a view as seen from the placement surface side of the substrate W of the stage 2. As shown in FIG. 3, the stage 2 is provided with a suction portion including a plurality of suction holes 12 for vacuum suction of the substrate W. In this example, four suction holes 12 are arranged at equal intervals in the vertical and horizontal directions, and a total of 16 suction holes 12 are provided. A vacuum pump (not shown) is connected to the suction hole 12, and air is sucked from the suction hole 12. When suction is performed with the substrate W placed on the stage 2, the inside of the suction hole 12 is depressurized. Thereby, the substrate W is vacuum-sucked and fixed to the stage 2.

  In the present embodiment, the adsorption unit is divided into two systems. That is, the stage 2 is formed with a first suction part 12a and a second suction part 12b. The first suction part 12 a has twelve suction holes 12 arranged in the peripheral part of the stage 2. The second suction part 12 b has four suction holes 12 provided in the center part of the stage 2.

  The switching unit 3 is connected to the first adsorption unit 12a and the second adsorption unit 12b via a pipe. The switching unit 3 independently controls ON / OFF of the first suction unit 12a and the second suction unit 12b. The switching unit 3 includes, for example, a vacuum pump and an electromagnetic valve provided in the piping. By opening and closing the electromagnetic valve, ON / OFF of the first adsorption unit 12a and the second adsorption unit 12b is controlled.

  When the first suction part 12a is turned on, the peripheral part of the substrate W is sucked. In addition, when the first suction unit 12a is turned off, suction of the peripheral portion of the substrate W is released. On the other hand, when the second suction part 12b is turned ON, the central part of the substrate W is sucked. Further, when the second suction unit 12b is turned OFF, the suction of the central portion of the substrate W is released.

  ON / OFF of the first suction unit 12a and the second suction unit 12b is independently controlled. For this reason, one of the 1st adsorption | suction part 12a and the 2nd adsorption | suction part 12b can be set to ON, and the other can be set to OFF. Of course, both the first suction unit 12a and the second suction unit 12b can be turned on.

  ON / OFF of the first suction unit 12a and the second suction unit 12b is controlled according to the position of the processing probe 20. For example, when the processing probe 20 is in a region corresponding to the first suction portion 12a, the first suction portion 12a is turned off and the second suction portion 12b is turned on. That is, when the processing probe 20 is in the peripheral part of the substrate W, the first suction part 12a in the peripheral part of the stage 2 is switched from ON to OFF. On the other hand, when the processing probe 20 is in the region corresponding to the second suction portion 12b, the first suction portion 12a is turned on and the second suction portion 12b is turned off. That is, when the processing probe 20 is at the center of the substrate W, the second suction unit 12b at the center of the stage 2 is switched from ON to OFF. Further, when the processing probe 20 is in a region corresponding to the boundary between the first suction portion 12a and the second suction portion 12b, the suction of the first suction portion 12a and the second suction portion 12b is turned on.

  In this way, the suction portion in the vicinity of the processing probe 20 that performs polishing correction is turned off. As a result, the substrate W is not excessively fixed to the stage 2 as shown in FIG. 4, and can follow the plane of the stage 2, and the flatness of the substrate W in the vicinity of the processing probe 20 that performs polishing correction can be increased. Can be improved. For this reason, stable polishing can be performed.

  Further, when the processing probe 20 is in a region corresponding to the boundary between the first suction portion 12a and the second suction portion 12b, suction of both the first suction portion 12a and the second suction portion 12b is turned on. Thereby, there is no moment when both the first suction part 12a and the second suction part 12b are turned off. That is, at the time of switching the operation of the first suction unit 12a and the second suction unit 12b, both the first suction unit 12a and the second suction unit 12b are turned on. Therefore, since the substrate W is always adsorbed by one or more adsorbing portions, it is possible to prevent the substrate W from moving. Thereby, stable polishing can be performed.

  Next, a procedure for performing polishing with the processing probe 20 will be described. First, the projection defect D is detected by the optical device 6 shown in FIG. Then, the position where the protrusion defect D is detected is stored in the processing device 11. When the defect inspection is completed, the protrusion removing device 7 is moved onto the protrusion defect D. And the motor 10 is driven, the raising / lowering mechanism 8 is operated, and the protrusion removal apparatus 7 is lowered | hung.

  And according to the position of the processing probe 20, ON / OFF of the 1st adsorption | suction part 12a and the 2nd adsorption | suction part 12b is controlled as mentioned above. That is, ON / OFF of the first suction unit 12a and the second suction unit 12b is controlled according to the position of the projection defect D (the position of the polishing correction region) detected by the optical device 6. That is, only the first suction part 12a or the second suction part 12b in the vicinity of the processing probe 20 is turned OFF. The solenoid valve can be controlled by software coordinate judgment, or can be mechanically controlled using a relay. In addition, when the processing probe 20 exists in the area | region corresponding to the boundary of the 1st adsorption | suction part 12a and the 2nd adsorption | suction part 12b, adsorption | suction of the 1st adsorption | suction part 12a and the 2nd adsorption | suction part 12b is turned ON.

  Then, in a state where the polishing tape is in contact with the surface of the substrate W, the polishing tape 25 is sent out, and the projection defect D is polished and corrected. Thereby, the protrusion defect D is removed by the polishing tape 25, and the defect is corrected. As described above, the substrate W is not sucked in the suction holes 12 in the vicinity of the processing probe 20. For this reason, even when the substrate is fixed to the stage 2 while the substrate W is bent, the flatness of the substrate W is improved in accordance with the mounting surface of the stage 2 as shown in FIG. Thereby, it is possible to suppress variation in the polishing amount of the substrate W, and it is possible to prevent deterioration in quality or yield of a liquid crystal display device to be manufactured.

  Note that the movement of the substrate W with respect to the protrusion removing device 7 is not limited to the movement of the protrusion removing device 7. For example, by making the stage 2 movable in the X and Y directions, the relative position between the protrusion removing device 7 and the substrate W can be changed. The optical device 6 may be movably provided.

  Moreover, you may use for the processing apparatus which processes other than grinding | polishing. That is, the substrate processing apparatus according to the present embodiment can be applied to other processing apparatuses provided with a processing head that moves on the substrate W. Furthermore, you may divide an adsorption | suction part into 3 or more systems.

It is a figure which shows the structure of the substrate processing apparatus which concerns on embodiment. It is a figure which shows the structure of the processing probe used for the board | substrate processing apparatus which concerns on embodiment. It is a figure which shows the structure of the stage used for the substrate processing apparatus which concerns on embodiment. It is a figure which shows the state of a board | substrate when polishing is performed using the board | substrate processing apparatus which concerns on embodiment. It is a figure which shows the state of a board | substrate when polishing is performed using the conventional board | substrate processing apparatus.

Explanation of symbols

1 base 2 stage 3 switching part 4 strut 5 support rail
DESCRIPTION OF SYMBOLS 6 Optical apparatus 7 Protrusion removal apparatus 8 Lifting mechanism 9 Motor control circuit 10 Motor 11 Processing apparatus 12 Adsorption hole 12a 1st adsorption part 12b 2nd adsorption part 20 Process probe 21 Polishing head 22 Support part 23 1st reel 24 2nd reel 25 Polishing tape 100 Substrate polishing equipment

Claims (8)

A mounting table on which a substrate is mounted;
A first suction unit and a second suction unit which are provided on the mounting table and suck the substrate;
A switching unit for switching ON / OFF of the first suction unit and the second suction unit;
A probe for processing the substrate,
The switching unit is a substrate processing apparatus that turns on one of the first suction unit and the second suction unit and turns off the other according to the position of the probe. The switching unit is
When the probe has moved to a position corresponding to the first suction part, the first suction part is turned OFF, and the second suction part is turned ON,
2. The substrate processing apparatus according to claim 1, wherein when the probe moves to a position corresponding to the first suction portion, the first suction portion is turned off and the second suction portion is turned on. . The switching unit is
The first suction unit and the second suction unit are turned on in a boundary region between a position corresponding to the first suction unit and a position corresponding to the second suction unit. The board | substrate processing apparatus of description.   The substrate processing apparatus according to claim 1, wherein the probe includes a polishing head. A substrate processing method for processing a substrate with a probe,
Placing the substrate on a mounting table;
Adsorbing the substrate by the first adsorption unit and the second adsorption unit provided on the mounting table,
A substrate processing method in which one of the first suction unit and the second suction unit is turned on and the other is turned off according to the position of the probe. When the probe has moved to a position corresponding to the first suction part, the first suction part is turned OFF, and the second suction part is turned ON,
6. The substrate processing method according to claim 5, wherein when the probe moves to a position corresponding to the first suction part, the first suction part is turned off and the second suction part is turned on. .   7. The first suction unit and the second suction unit are turned on in a boundary region between a position corresponding to the first suction unit and a position corresponding to the second suction unit. Substrate processing method.   The substrate processing apparatus according to claim 5, wherein polishing is performed by the probe.

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