CN108453618A - 基板的研磨装置和基板的处理系统 - Google Patents

基板的研磨装置和基板的处理系统 Download PDF

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Publication number
CN108453618A
CN108453618A CN201810151773.8A CN201810151773A CN108453618A CN 108453618 A CN108453618 A CN 108453618A CN 201810151773 A CN201810151773 A CN 201810151773A CN 108453618 A CN108453618 A CN 108453618A
Authority
CN
China
Prior art keywords
grinding
substrate
motion
grinding device
driving mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810151773.8A
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English (en)
Chinese (zh)
Inventor
安田穗积
小畠严贵
高桥信行
作川卓
高田畅行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN108453618A publication Critical patent/CN108453618A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN201810151773.8A 2017-02-22 2018-02-14 基板的研磨装置和基板的处理系统 Pending CN108453618A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017031243A JP2018134710A (ja) 2017-02-22 2017-02-22 基板の研磨装置および研磨方法
JP2017-031243 2017-02-22

Publications (1)

Publication Number Publication Date
CN108453618A true CN108453618A (zh) 2018-08-28

Family

ID=63166818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810151773.8A Pending CN108453618A (zh) 2017-02-22 2018-02-14 基板的研磨装置和基板的处理系统

Country Status (6)

Country Link
US (1) US20180236630A1 (enExample)
JP (1) JP2018134710A (enExample)
KR (1) KR20180097136A (enExample)
CN (1) CN108453618A (enExample)
SG (1) SG10201801373RA (enExample)
TW (1) TW201900338A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111482891A (zh) * 2020-04-20 2020-08-04 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
US20210187691A1 (en) * 2019-12-24 2021-06-24 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN113211299A (zh) * 2020-02-05 2021-08-06 株式会社荏原制作所 基板处理装置及基板处理方法
CN114074286A (zh) * 2020-08-17 2022-02-22 铠侠股份有限公司 研磨装置及研磨方法
CN115087517A (zh) * 2020-02-06 2022-09-20 株式会社荏原制作所 基板处理装置及基板处理方法
WO2023131075A1 (zh) * 2022-01-05 2023-07-13 杭州众硅电子科技有限公司 一种抛光垫修整装置
CN116460667A (zh) * 2022-12-30 2023-07-21 北京创思工贸有限公司 氟化钙光学零件的加工方法

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* Cited by examiner, † Cited by third party
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JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
CN109227388A (zh) * 2018-09-19 2019-01-18 大连理工大学 一种环抛机盘面修整系统及其工作方法
JP7145084B2 (ja) 2019-01-11 2022-09-30 株式会社荏原製作所 基板処理装置および基板処理装置において部分研磨されるべき領域を特定する方法
US11235454B2 (en) * 2019-01-14 2022-02-01 Dynabrade, Inc. Spring loaded adjustable head
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法
TWI771668B (zh) * 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
TWI826280B (zh) 2019-11-22 2023-12-11 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
WO2022187259A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Roller for location-specific wafer polishing
JP7733487B2 (ja) * 2021-07-07 2025-09-03 株式会社荏原製作所 研磨装置および研磨方法
JP7764215B2 (ja) * 2021-11-22 2025-11-05 株式会社ディスコ クリープフィード研削装置
KR20250038724A (ko) * 2022-07-14 2025-03-19 어플라이드 머티어리얼스, 인코포레이티드 페이스-업 연마에서의 두께 모니터링

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JPS59173555U (ja) * 1984-01-17 1984-11-20 株式会社ノリタケカンパニーリミテド 研削砥石を傾斜させた研削装置に用いられる傾斜フランジ
JPH033765A (ja) * 1989-05-29 1991-01-09 Sony Corp 剛性基板の表面処理方法
JPH08108360A (ja) * 1994-10-11 1996-04-30 Fuji Photo Film Co Ltd ガラス基板の研磨装置
US6183345B1 (en) * 1997-03-24 2001-02-06 Canon Kabushiki Kaisha Polishing apparatus and method
JP2001353659A (ja) * 2000-06-16 2001-12-25 Okamoto Machine Tool Works Ltd 研磨ウエハの研磨合否判定方法
CN1531747A (zh) * 2001-03-14 2004-09-22 美商・应用材料股份有限公司 以电化学机械研磨法进行基材平坦化
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CN1822905A (zh) * 2003-06-06 2006-08-23 P.C.T.系统公司 用兆频声波能量处理基片的方法和设备
JP2005177925A (ja) * 2003-12-19 2005-07-07 Olympus Corp 研磨加工方法
CN103231303A (zh) * 2013-05-15 2013-08-07 清华大学 化学机械抛光设备

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210187691A1 (en) * 2019-12-24 2021-06-24 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US11850697B2 (en) * 2019-12-24 2023-12-26 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
CN113211299A (zh) * 2020-02-05 2021-08-06 株式会社荏原制作所 基板处理装置及基板处理方法
CN113211299B (zh) * 2020-02-05 2024-04-16 株式会社荏原制作所 基板处理装置及基板处理方法
CN115087517A (zh) * 2020-02-06 2022-09-20 株式会社荏原制作所 基板处理装置及基板处理方法
CN115087517B (zh) * 2020-02-06 2024-04-05 株式会社荏原制作所 基板处理装置及基板处理方法
CN111482891A (zh) * 2020-04-20 2020-08-04 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
CN114074286A (zh) * 2020-08-17 2022-02-22 铠侠股份有限公司 研磨装置及研磨方法
CN114074286B (zh) * 2020-08-17 2024-04-26 铠侠股份有限公司 研磨装置及研磨方法
WO2023131075A1 (zh) * 2022-01-05 2023-07-13 杭州众硅电子科技有限公司 一种抛光垫修整装置
CN116460667A (zh) * 2022-12-30 2023-07-21 北京创思工贸有限公司 氟化钙光学零件的加工方法
CN116460667B (zh) * 2022-12-30 2023-11-07 北京创思工贸有限公司 氟化钙光学零件的加工方法

Also Published As

Publication number Publication date
US20180236630A1 (en) 2018-08-23
JP2018134710A (ja) 2018-08-30
KR20180097136A (ko) 2018-08-30
TW201900338A (zh) 2019-01-01
SG10201801373RA (en) 2018-09-27

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Application publication date: 20180828