SG10201705206QA - Cleaning apparatus, plating apparatus using the same, and cleaning method - Google Patents
Cleaning apparatus, plating apparatus using the same, and cleaning methodInfo
- Publication number
- SG10201705206QA SG10201705206QA SG10201705206QA SG10201705206QA SG10201705206QA SG 10201705206Q A SG10201705206Q A SG 10201705206QA SG 10201705206Q A SG10201705206Q A SG 10201705206QA SG 10201705206Q A SG10201705206Q A SG 10201705206QA SG 10201705206Q A SG10201705206Q A SG 10201705206QA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning
- same
- plating
- cleaning method
- plating apparatus
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016127630A JP6157694B1 (ja) | 2016-06-28 | 2016-06-28 | 洗浄装置、これを備えためっき装置、及び洗浄方法 |
JP2016133933A JP6088099B1 (ja) | 2016-07-06 | 2016-07-06 | 洗浄装置、これを備えためっき装置、及び洗浄方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201705206QA true SG10201705206QA (en) | 2018-01-30 |
Family
ID=60788734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201705206QA SG10201705206QA (en) | 2016-06-28 | 2017-06-22 | Cleaning apparatus, plating apparatus using the same, and cleaning method |
Country Status (5)
Country | Link |
---|---|
US (1) | US10781530B2 (zh) |
KR (1) | KR101907793B1 (zh) |
CN (1) | CN107680916B (zh) |
SG (1) | SG10201705206QA (zh) |
TW (1) | TWI629116B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102656981B1 (ko) * | 2018-03-27 | 2024-04-11 | 가부시키가이샤 에바라 세이사꾸쇼 | 세정 장치, 이를 구비한 도금 장치 및 세정 방법 |
CN108360053B (zh) * | 2018-05-10 | 2019-06-25 | 赣州市文祥电镀有限公司 | 一种电镀件的清洗设备 |
CN110773536B (zh) * | 2018-07-31 | 2021-10-22 | 台湾积体电路制造股份有限公司 | 晶粒容器工作站、晶粒容器处理的系统及方法 |
CN109537035A (zh) * | 2018-12-26 | 2019-03-29 | 安徽宏实自动化装备有限公司 | 枚叶水平输送式的晶圆电镀装置 |
US11373885B2 (en) * | 2019-05-16 | 2022-06-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Wet etching apparatus |
CN110225671B (zh) * | 2019-06-20 | 2021-04-13 | 上海银沪通信科技有限公司 | 一种记录仪用pcb板预处理系统及其工作方法 |
KR20210011773A (ko) | 2019-07-23 | 2021-02-02 | 주식회사 클로바이오 | 살균용 패치 |
CN112985043A (zh) * | 2019-12-17 | 2021-06-18 | 亚智科技股份有限公司 | 风刀结构及其机构 |
CN114671217A (zh) * | 2020-12-24 | 2022-06-28 | 志圣工业股份有限公司 | 自体清洁的输送装置及包含输送装置的加热设备 |
EP4035785B1 (de) * | 2021-02-01 | 2024-01-10 | Rösler Holding GmbH | Verfahren und vorrichtung zum behandeln von bauteilen |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6133685U (ja) | 1984-07-31 | 1986-02-28 | 日立プラント建設株式会社 | プリント基板の水切り装置 |
US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
JP2000183019A (ja) * | 1998-12-21 | 2000-06-30 | Dainippon Screen Mfg Co Ltd | 多段基板処理装置 |
US6354481B1 (en) * | 1999-02-18 | 2002-03-12 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
US6446855B1 (en) * | 1999-02-18 | 2002-09-10 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
JP2001009392A (ja) | 1999-06-29 | 2001-01-16 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
JP2001345544A (ja) | 2000-05-31 | 2001-12-14 | Sony Corp | プリント配線基板の表面処理装置及び表面処理方法 |
JP2002270513A (ja) * | 2001-03-06 | 2002-09-20 | Umc Japan | 薄膜形成装置のクリーニング装置および方法 |
JP2003188229A (ja) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | ウエハ製造システムおよびウエハ製造方法 |
JP2003303777A (ja) * | 2002-04-10 | 2003-10-24 | Ulvac Japan Ltd | プラズマ成膜装置及びクリーニング方法 |
JP4136826B2 (ja) | 2002-08-19 | 2008-08-20 | 住友精密工業株式会社 | 昇降式基板処理装置及びこれを備えた基板処理システム |
JP5009101B2 (ja) | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 基板研磨装置 |
JP2008159663A (ja) * | 2006-12-21 | 2008-07-10 | Tokyo Electron Ltd | 基板処理装置 |
KR20090035106A (ko) | 2007-10-05 | 2009-04-09 | 세메스 주식회사 | 반도체 제조 설비의 이송 장치 |
JP2009147266A (ja) * | 2007-12-18 | 2009-07-02 | Mitsubishi Heavy Ind Ltd | 薄膜太陽電池製造装置システム及び共通基板保管ラック |
JP2010064196A (ja) | 2008-09-11 | 2010-03-25 | Ebara Corp | 基板研磨装置および基板研磨方法 |
JP5290081B2 (ja) | 2008-10-15 | 2013-09-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5399165B2 (ja) * | 2008-11-17 | 2014-01-29 | 富士フイルム株式会社 | 成膜方法、成膜装置、圧電体膜、圧電素子、液体吐出装置、及び圧電型超音波振動子 |
KR101005888B1 (ko) | 2008-12-02 | 2011-01-06 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 이송 방법 |
JP5390846B2 (ja) * | 2008-12-09 | 2014-01-15 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマクリーニング方法 |
JP5240245B2 (ja) * | 2010-06-22 | 2013-07-17 | 東京エレクトロン株式会社 | 流路切替え装置、処理装置、流路切替え方法及び処理方法並びに記憶媒体 |
KR101298220B1 (ko) * | 2012-01-20 | 2013-08-22 | 주식회사 엠엠테크 | 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법 |
KR101430661B1 (ko) | 2012-08-29 | 2014-08-18 | 주식회사 에스에프에이 | 슬릿 밸브 |
JP5984622B2 (ja) * | 2012-10-23 | 2016-09-06 | 日本アクア株式会社 | 水洗装置 |
CN202962971U (zh) * | 2012-11-14 | 2013-06-05 | 曾毅 | 非接触式清洗机 |
-
2017
- 2017-06-06 TW TW106118665A patent/TWI629116B/zh active
- 2017-06-16 KR KR1020170076452A patent/KR101907793B1/ko active IP Right Grant
- 2017-06-22 SG SG10201705206QA patent/SG10201705206QA/en unknown
- 2017-06-27 CN CN201710502806.4A patent/CN107680916B/zh active Active
- 2017-06-28 US US15/636,041 patent/US10781530B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101907793B1 (ko) | 2018-10-12 |
KR20180002023A (ko) | 2018-01-05 |
TWI629116B (zh) | 2018-07-11 |
US10781530B2 (en) | 2020-09-22 |
US20170370016A1 (en) | 2017-12-28 |
CN107680916A (zh) | 2018-02-09 |
CN107680916B (zh) | 2019-05-07 |
TW201808479A (zh) | 2018-03-16 |
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