TWI799548B - 洗淨裝置、具備該洗淨裝置之鍍覆裝置、及洗淨方法 - Google Patents

洗淨裝置、具備該洗淨裝置之鍍覆裝置、及洗淨方法 Download PDF

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Publication number
TWI799548B
TWI799548B TW108109893A TW108109893A TWI799548B TW I799548 B TWI799548 B TW I799548B TW 108109893 A TW108109893 A TW 108109893A TW 108109893 A TW108109893 A TW 108109893A TW I799548 B TWI799548 B TW I799548B
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TW
Taiwan
Prior art keywords
cleaning
same
device including
plating
cleaning method
Prior art date
Application number
TW108109893A
Other languages
English (en)
Other versions
TW201943004A (zh
Inventor
大橋弘尭
阿部貴宏
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018060348A external-priority patent/JP2019175933A/ja
Priority claimed from JP2018060350A external-priority patent/JP7257742B2/ja
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201943004A publication Critical patent/TW201943004A/zh
Application granted granted Critical
Publication of TWI799548B publication Critical patent/TWI799548B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108109893A 2018-03-27 2019-03-22 洗淨裝置、具備該洗淨裝置之鍍覆裝置、及洗淨方法 TWI799548B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018060348A JP2019175933A (ja) 2018-03-27 2018-03-27 洗浄装置、これを備えためっき装置、及び洗浄方法
JP2018060350A JP7257742B2 (ja) 2018-03-27 2018-03-27 洗浄装置、これを備えためっき装置、及び洗浄方法
JP2018-060350 2018-03-27
JP2018-060348 2018-03-27

Publications (2)

Publication Number Publication Date
TW201943004A TW201943004A (zh) 2019-11-01
TWI799548B true TWI799548B (zh) 2023-04-21

Family

ID=68056857

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109893A TWI799548B (zh) 2018-03-27 2019-03-22 洗淨裝置、具備該洗淨裝置之鍍覆裝置、及洗淨方法

Country Status (3)

Country Link
US (1) US20190301044A1 (zh)
KR (1) KR102656981B1 (zh)
TW (1) TWI799548B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7324788B2 (ja) * 2021-02-04 2023-08-10 芝浦メカトロニクス株式会社 基板処理装置
CN115698389B (zh) * 2021-06-04 2023-06-16 株式会社荏原制作所 镀覆装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110282A (en) * 1996-08-30 2000-08-29 Tokyo Electron Limited Coating apparatus for semiconductor process
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
TW201036096A (en) * 2009-03-19 2010-10-01 Sumitomo Precision Prod Co Substrate processing device
CN107680916A (zh) * 2016-06-28 2018-02-09 株式会社荏原制作所 清洗装置、具有该清洗装置的镀覆装置及清洗方法
TW201809063A (zh) * 2016-05-17 2018-03-16 博祥國際股份有限公司 含胜肽的共聚酯材料的製備方法以及含胜肽的共聚酯材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3960087B2 (ja) * 2001-05-30 2007-08-15 東京エレクトロン株式会社 搬送装置
JP4846201B2 (ja) 2004-02-26 2011-12-28 株式会社荏原製作所 めっき装置及びめっき方法
US20060141157A1 (en) * 2003-05-27 2006-06-29 Masahiko Sekimoto Plating apparatus and plating method
JP5441515B2 (ja) * 2009-06-24 2014-03-12 上村工業株式会社 表面処理槽のワーク搬送方法及び搬送用治具
JP6157694B1 (ja) 2016-06-28 2017-07-05 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
JP6756540B2 (ja) * 2016-08-08 2020-09-16 株式会社荏原製作所 めっき装置、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6110282A (en) * 1996-08-30 2000-08-29 Tokyo Electron Limited Coating apparatus for semiconductor process
TW201036096A (en) * 2009-03-19 2010-10-01 Sumitomo Precision Prod Co Substrate processing device
TW201809063A (zh) * 2016-05-17 2018-03-16 博祥國際股份有限公司 含胜肽的共聚酯材料的製備方法以及含胜肽的共聚酯材料
CN107680916A (zh) * 2016-06-28 2018-02-09 株式会社荏原制作所 清洗装置、具有该清洗装置的镀覆装置及清洗方法

Also Published As

Publication number Publication date
KR102656981B1 (ko) 2024-04-11
TW201943004A (zh) 2019-11-01
KR20190113566A (ko) 2019-10-08
US20190301044A1 (en) 2019-10-03

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