SG10201608038VA - Methods and apparatuses for cleaning electroplating substrate holders - Google Patents

Methods and apparatuses for cleaning electroplating substrate holders

Info

Publication number
SG10201608038VA
SG10201608038VA SG10201608038VA SG10201608038VA SG10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA
Authority
SG
Singapore
Prior art keywords
apparatuses
methods
substrate holders
electroplating substrate
cleaning electroplating
Prior art date
Application number
SG10201608038VA
Other languages
English (en)
Inventor
Santosh Kumar
Bryan L Buckalew
Steven T Mayer
Thomas Ponnuswamy
Chad Michael Hosack
Robert Rash
Lee Peng Chua
David Porter
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG10201608038VA publication Critical patent/SG10201608038VA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/041Cleaning travelling work
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10201608038VA 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders SG10201608038VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261616909P 2012-03-28 2012-03-28
US201261676841P 2012-07-27 2012-07-27

Publications (1)

Publication Number Publication Date
SG10201608038VA true SG10201608038VA (en) 2016-11-29

Family

ID=49261220

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201608038VA SG10201608038VA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Country Status (6)

Country Link
US (1) US10092933B2 (fr)
KR (1) KR102112881B1 (fr)
CN (1) CN104272438B (fr)
SG (2) SG10201608038VA (fr)
TW (1) TWI591214B (fr)
WO (1) WO2013148890A1 (fr)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
JP6095958B2 (ja) * 2011-12-27 2017-03-15 新光電気工業株式会社 発光装置
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
US9476139B2 (en) 2012-03-30 2016-10-25 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) * 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US9518334B2 (en) 2013-03-11 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Electro-plating and apparatus for performing the same
JP2015071802A (ja) * 2013-10-02 2015-04-16 株式会社荏原製作所 めっき装置および該めっき装置に使用されるクリーニング装置
US10625280B2 (en) 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
US11355376B2 (en) 2014-10-06 2022-06-07 Tel Manufacturing And Engineering Of America, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
US20180025904A1 (en) * 2014-10-06 2018-01-25 Tel Fsi, Inc. Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
US10014191B2 (en) 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
US9812344B2 (en) * 2015-02-03 2017-11-07 Applied Materials, Inc. Wafer processing system with chuck assembly maintenance module
JP1546799S (fr) * 2015-06-12 2016-03-28
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US10307798B2 (en) * 2015-08-28 2019-06-04 Taiwan Semiconducter Manufacturing Company Limited Cleaning device for cleaning electroplating substrate holder
KR101593887B1 (ko) * 2015-10-23 2016-02-12 선호경 Pcb 도금액 분사장치
US9864283B2 (en) * 2015-11-18 2018-01-09 Applied Materials, Inc. Apparatus and methods for photomask backside cleaning
CN108291325B (zh) * 2015-12-04 2019-12-20 盛美半导体设备(上海)有限公司 基板保持装置
JP1564934S (fr) * 2016-02-26 2016-12-05
JP6462620B2 (ja) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
TW201905250A (zh) * 2017-06-23 2019-02-01 美商應用材料股份有限公司 抑制金屬沉積之方法
CN111655910B (zh) * 2018-02-01 2022-07-22 应用材料公司 在电镀系统中的清洁部件和方法
JP6963524B2 (ja) 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
TWI810269B (zh) * 2018-03-29 2023-08-01 美商應用材料股份有限公司 電化學電鍍設備與用於清洗基板的方法
WO2019204512A1 (fr) * 2018-04-20 2019-10-24 Applied Materials, Inc. Appareil d'étanchéité pour un système de dépôt électrolytique
CN112004965B (zh) * 2018-04-20 2023-02-28 应用材料公司 在电镀系统中的清洁部件及方法
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
US11371159B2 (en) * 2019-06-22 2022-06-28 Applied Materials, Inc. Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
KR102374313B1 (ko) 2019-12-24 2022-03-14 경북대학교 산학협력단 압전 폴리머 필터를 구비한 휴대용 정수기
JP7455608B2 (ja) 2020-02-25 2024-03-26 株式会社荏原製作所 洗浄方法及び洗浄装置
CN115485421A (zh) * 2020-04-30 2022-12-16 朗姆研究公司 用于在薄衬底搬运期间防止碎裂的混合式接触指
US20230313408A1 (en) * 2020-08-14 2023-10-05 Lam Research Corporation Plating-deplating waveform based contact cleaning for a substrate electroplating system
CN112831810B (zh) * 2020-12-31 2023-05-30 大连大学 一种采用无掩模定域性电沉积方法制备微柱状结构的工艺
CN114555870A (zh) * 2021-03-17 2022-05-27 株式会社荏原制作所 镀覆装置以及镀覆装置的接触部件清洗方法
TWI790581B (zh) * 2021-03-26 2023-01-21 日商荏原製作所股份有限公司 鍍覆裝置及鍍覆裝置之接觸構件清洗方法
JP7194305B1 (ja) 2022-07-01 2022-12-21 株式会社荏原製作所 基板ホルダ、めっき装置、及びめっき方法

Family Cites Families (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773257A (en) * 1956-07-27 1956-12-04 Goodman Mfg Co Conveyor having flexible strand side frames and troughing roller assembly therefor
US3225899A (en) * 1959-01-02 1965-12-28 Goodman Mfg Co Rope frame conveyor with controlled belt deflection
US3334750A (en) 1963-05-31 1967-08-08 Mullins Mfg Corp Dishwasher strainer with alternate filtering positions
US3430055A (en) 1965-04-02 1969-02-25 Bowles Eng Corp Surface flaw detector
US3716765A (en) * 1966-03-14 1973-02-13 Hughes Aircraft Co Semiconductor device with protective glass sealing
BE757899A (fr) * 1969-10-25 1971-04-01 Asturiana De Zinc Sa Procede et installation pour enlever le zinc forme sur des cathodes au cours d'un traitement electrolytique
US3684633A (en) 1971-01-05 1972-08-15 Mobil Oil Corp Laminated thermoplastic foam-film dish
US4418432A (en) 1981-08-26 1983-12-06 Vidal Stella M Drain filter having filamentary surface irregularities to entangle hair and debris
US4569695A (en) * 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US4466864A (en) 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4654235A (en) 1984-04-13 1987-03-31 Chemical Fabrics Corporation Novel wear resistant fluoropolymer-containing flexible composites and method for preparation thereof
EP0270653B1 (fr) * 1986-06-26 1991-06-05 BAXTER INTERNATIONAL INC. (a Delaware corporation) Dispositif pour nettoyer et/ou decontaminer en continu une bande d'un film en matiere thermoplastique
US5000827A (en) 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5368711A (en) 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
USRE37749E1 (en) 1990-08-01 2002-06-18 Jaime Poris Electrodeposition apparatus with virtual anode
WO1992007968A1 (fr) 1990-10-26 1992-05-14 International Business Machines Corporation STRUCTURE ET PROCEDE PERMETTANT DE FORMER DES FILMS ALPHA-Ta EN COUCHES MINCES
US5221449A (en) 1990-10-26 1993-06-22 International Business Machines Corporation Method of making Alpha-Ta thin films
US5482611A (en) 1991-09-30 1996-01-09 Helmer; John C. Physical vapor deposition employing ion extraction from a plasma
US5227041A (en) 1992-06-12 1993-07-13 Digital Equipment Corporation Dry contact electroplating apparatus
US5289639A (en) * 1992-07-10 1994-03-01 International Business Machines Corp. Fluid treatment apparatus and method
FI94271C (fi) * 1992-11-03 1995-08-10 Valmet Paper Machinery Inc Menetelmä telojen puhdistamiseksi ja telanpuhdistuslaite
US5311634A (en) 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
JP2955990B2 (ja) * 1996-06-28 1999-10-04 株式会社沖電気コミュニケーションシステムズ スクリーン版洗浄装置
JP3490238B2 (ja) 1997-02-17 2004-01-26 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
US20020157686A1 (en) * 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US20060151007A1 (en) * 1997-05-09 2006-07-13 Bergman Eric J Workpiece processing using ozone gas and chelating agents
US20060118132A1 (en) * 2004-12-06 2006-06-08 Bergman Eric J Cleaning with electrically charged aerosols
ATE336921T1 (de) 1997-05-12 2006-09-15 Microban Products Antimikrobielle bürste
US5985762A (en) 1997-05-19 1999-11-16 International Business Machines Corporation Method of forming a self-aligned copper diffusion barrier in vias
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6126798A (en) 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6159354A (en) 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
CA2320278C (fr) 1998-02-12 2006-01-03 Acm Research, Inc. Appareil et procede d'electrodeposition
JPH11274282A (ja) * 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
DE69929967T2 (de) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
US6071388A (en) 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
US6099702A (en) 1998-06-10 2000-08-08 Novellus Systems, Inc. Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
WO2000003072A1 (fr) 1998-07-10 2000-01-20 Semitool, Inc. Procede et appareil de cuivrage pour depot autocatalytique et depot electrolytique
US6303010B1 (en) 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
EP1018568A4 (fr) 1998-07-10 2006-05-31 Ebara Corp Dispositif de placage
US6080291A (en) 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6074544A (en) 1998-07-22 2000-06-13 Novellus Systems, Inc. Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
US6176985B1 (en) 1998-10-23 2001-01-23 International Business Machines Corporation Laminated electroplating rack and connection system for optimized plating
US7070686B2 (en) 2000-03-27 2006-07-04 Novellus Systems, Inc. Dynamically variable field shaping element
US6402923B1 (en) 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US6613214B2 (en) 1998-11-30 2003-09-02 Applied Materials, Inc. Electric contact element for electrochemical deposition system and method
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6413388B1 (en) 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6124203A (en) 1998-12-07 2000-09-26 Advanced Micro Devices, Inc. Method for forming conformal barrier layers
US6309520B1 (en) 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
DE19859467C2 (de) 1998-12-22 2002-11-28 Steag Micro Tech Gmbh Substrathalter
US6193854B1 (en) 1999-01-05 2001-02-27 Novellus Systems, Inc. Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
US6179973B1 (en) 1999-01-05 2001-01-30 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6221757B1 (en) 1999-01-20 2001-04-24 Infineon Technologies Ag Method of making a microelectronic structure
US6368475B1 (en) 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US6197182B1 (en) 1999-07-07 2001-03-06 Technic Inc. Apparatus and method for plating wafers, substrates and other articles
US7645366B2 (en) 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
US6267860B1 (en) 1999-07-27 2001-07-31 International Business Machines Corporation Method and apparatus for electroplating
US6309981B1 (en) * 1999-10-01 2001-10-30 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6379468B1 (en) * 1999-12-20 2002-04-30 Engineered Materials Solutions, Inc. Method for cleaning thin metal strip material
US6612915B1 (en) 1999-12-27 2003-09-02 Nutool Inc. Work piece carrier head for plating and polishing
US6270646B1 (en) 1999-12-28 2001-08-07 International Business Machines Corporation Electroplating apparatus and method using a compressible contact
US6251242B1 (en) 2000-01-21 2001-06-26 Applied Materials, Inc. Magnetron and target producing an extended plasma region in a sputter reactor
US6277249B1 (en) 2000-01-21 2001-08-21 Applied Materials Inc. Integrated process for copper via filling using a magnetron and target producing highly energetic ions
JP3939077B2 (ja) * 2000-05-30 2007-06-27 大日本スクリーン製造株式会社 基板洗浄装置
US6398926B1 (en) 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
EP1167582B1 (fr) * 2000-07-01 2005-09-14 Shipley Company LLC Compositions d'un alliage de metal et méthode de déposition associée
JP2002069698A (ja) 2000-08-31 2002-03-08 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2004536217A (ja) 2000-10-03 2004-12-02 アプライド マテリアルズ インコーポレイテッド 金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置
US6627052B2 (en) 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
JP4025953B2 (ja) * 2001-01-05 2007-12-26 荒川化学工業株式会社 洗浄剤組成物
US6546938B2 (en) * 2001-03-12 2003-04-15 The Regents Of The University Of California Combined plasma/liquid cleaning of substrates
US6540899B2 (en) 2001-04-05 2003-04-01 All Wet Technologies, Inc. Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
US6551487B1 (en) 2001-05-31 2003-04-22 Novellus Systems, Inc. Methods and apparatus for controlled-angle wafer immersion
US6800187B1 (en) 2001-05-31 2004-10-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating wafers
JP2003086548A (ja) 2001-06-29 2003-03-20 Hitachi Ltd 半導体装置の製造方法及びその研磨液
US6908540B2 (en) 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
US20030019741A1 (en) 2001-07-24 2003-01-30 Applied Materials, Inc. Method and apparatus for sealing a substrate surface during an electrochemical deposition process
US6989084B2 (en) 2001-11-02 2006-01-24 Rockwell Scientific Licensing, Llc Semiconductor wafer plating cell assembly
US6579430B2 (en) 2001-11-02 2003-06-17 Innovative Technology Licensing, Llc Semiconductor wafer plating cathode assembly
US7033465B1 (en) 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US6755946B1 (en) 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
JP4118659B2 (ja) * 2001-12-03 2008-07-16 東京応化工業株式会社 基板用トレイ
TWI244548B (en) 2002-01-22 2005-12-01 Taiwan Semiconductor Mfg Method for detecting the defect of a wafer
TWI316097B (en) 2002-06-21 2009-10-21 Ebara Corp Substrate holder and plating apparatus
US20040002430A1 (en) * 2002-07-01 2004-01-01 Applied Materials, Inc. Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use
JP2004083932A (ja) 2002-08-22 2004-03-18 Ebara Corp 電解処理装置
US7300630B2 (en) * 2002-09-27 2007-11-27 E. I. Du Pont De Nemours And Company System and method for cleaning in-process sensors
US6867119B2 (en) 2002-10-30 2005-03-15 Advanced Micro Devices, Inc. Nitrogen oxidation to reduce encroachment
US6837943B2 (en) * 2002-12-17 2005-01-04 Samsung Electronics Co., Ltd. Method and apparatus for cleaning a semiconductor substrate
WO2004065664A1 (fr) 2003-01-23 2004-08-05 Ebara Corporation Dispositif et procede de revetement metallique
US7087144B2 (en) 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
KR20040072446A (ko) 2003-02-12 2004-08-18 삼성전자주식회사 반도체 기판의 가장자리 상의 금속막을 선택적으로제거하는 방법
KR100935281B1 (ko) * 2003-03-06 2010-01-06 도쿄엘렉트론가부시키가이샤 처리액 공급노즐 및 처리액 공급장치
JP3886919B2 (ja) 2003-03-12 2007-02-28 富士通株式会社 めっき装置
KR20040081577A (ko) * 2003-03-14 2004-09-22 삼성전자주식회사 웨이퍼 폴리싱 장치
DE10313127B4 (de) 2003-03-24 2006-10-12 Rena Sondermaschinen Gmbh Verfahren zur Behandlung von Substratoberflächen
AU2004272647A1 (en) * 2003-09-16 2005-03-24 Global Ionix Inc. An electrolytic cell for removal of material from a solution
US20050081899A1 (en) * 2003-10-16 2005-04-21 Michael Shannon Adjustable spacer attachment for a power washer
JP2005146398A (ja) 2003-11-19 2005-06-09 Ebara Corp めっき方法及びめっき装置
KR20050068038A (ko) * 2003-12-29 2005-07-05 동부아남반도체 주식회사 Cmp 장치의 컨디셔너의 클리닝 컵과 cmp 장치의컨디셔너의 클리닝 방법
TWI251857B (en) * 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
US20050218000A1 (en) 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7285195B2 (en) 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
US7182673B2 (en) * 2004-06-29 2007-02-27 Novellus Systems, Inc. Method and apparatus for post-CMP cleaning of a semiconductor work piece
US7301458B2 (en) 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7837851B2 (en) * 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process
KR100727484B1 (ko) * 2005-07-28 2007-06-13 삼성전자주식회사 화학기계적 연마 장치 및 패드 컨디셔닝 방법
KR20070064847A (ko) 2005-12-19 2007-06-22 삼성전자주식회사 반도체 웨이퍼 전기도금장치
JP4453840B2 (ja) 2006-02-03 2010-04-21 Tdk株式会社 電極組立体およびめっき装置
JP2007229614A (ja) * 2006-02-28 2007-09-13 Fujitsu Ltd 洗浄装置、洗浄方法および製品の製造方法
US20080011322A1 (en) * 2006-07-11 2008-01-17 Frank Weber Cleaning systems and methods
KR20080007931A (ko) 2006-07-19 2008-01-23 삼성전자주식회사 전기 도금 장치
JP4648973B2 (ja) * 2006-07-26 2011-03-09 東京エレクトロン株式会社 液処理装置および液処理方法
JP2008045179A (ja) 2006-08-18 2008-02-28 Ebara Corp めっき装置及びめっき方法
JP2008095157A (ja) 2006-10-13 2008-04-24 Ebara Corp めっき装置及びめっき方法
JP2009014510A (ja) 2007-07-04 2009-01-22 Hitachi High-Technologies Corp 検査方法及び検査装置
US7894037B2 (en) 2007-07-30 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7985325B2 (en) 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US7935231B2 (en) 2007-10-31 2011-05-03 Novellus Systems, Inc. Rapidly cleanable electroplating cup assembly
JP5134339B2 (ja) 2007-11-02 2013-01-30 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US8105997B2 (en) * 2008-11-07 2012-01-31 Lam Research Corporation Composition and application of a two-phase contaminant removal medium
US8172992B2 (en) 2008-12-10 2012-05-08 Novellus Systems, Inc. Wafer electroplating apparatus for reducing edge defects
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
EP2221396A1 (fr) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Compositions de dépôt électrique à l'alliage d'étain sans plomb et procédés
CN101599420A (zh) * 2009-07-24 2009-12-09 上海宏力半导体制造有限公司 晶圆清洗装置
JP5279664B2 (ja) 2009-09-01 2013-09-04 本田技研工業株式会社 シリンダバレルの表面処理装置
JP5766048B2 (ja) 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
US9476139B2 (en) * 2012-03-30 2016-10-25 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US9631919B2 (en) 2013-06-12 2017-04-25 Applied Materials, Inc. Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US20170073832A1 (en) 2015-09-11 2017-03-16 Lam Research Corporation Durable low cure temperature hydrophobic coating in electroplating cup assembly

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TWI591214B (zh) 2017-07-11
SG11201406133WA (en) 2014-10-30
KR102112881B1 (ko) 2020-05-19
KR20150002712A (ko) 2015-01-07
WO2013148890A1 (fr) 2013-10-03
CN104272438A (zh) 2015-01-07
US20130292254A1 (en) 2013-11-07
TW201402874A (zh) 2014-01-16
US10092933B2 (en) 2018-10-09
CN104272438B (zh) 2018-01-12

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