SG10201608038VA - Methods and apparatuses for cleaning electroplating substrate holders - Google Patents

Methods and apparatuses for cleaning electroplating substrate holders

Info

Publication number
SG10201608038VA
SG10201608038VA SG10201608038VA SG10201608038VA SG10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA SG 10201608038V A SG10201608038V A SG 10201608038VA
Authority
SG
Singapore
Prior art keywords
apparatuses
methods
substrate holders
electroplating substrate
cleaning electroplating
Prior art date
Application number
SG10201608038VA
Inventor
Santosh Kumar
Bryan L Buckalew
Steven T Mayer
Thomas Ponnuswamy
Chad Michael Hosack
Robert Rash
Lee Peng Chua
David Porter
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG10201608038VA publication Critical patent/SG10201608038VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
SG10201608038VA 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders SG10201608038VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261616909P 2012-03-28 2012-03-28
US201261676841P 2012-07-27 2012-07-27

Publications (1)

Publication Number Publication Date
SG10201608038VA true SG10201608038VA (en) 2016-11-29

Family

ID=49261220

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201608038VA SG10201608038VA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201406133WA SG11201406133WA (en) 2012-03-28 2013-03-27 Methods and apparatuses for cleaning electroplating substrate holders

Country Status (6)

Country Link
US (1) US10092933B2 (en)
KR (1) KR102112881B1 (en)
CN (1) CN104272438B (en)
SG (2) SG10201608038VA (en)
TW (1) TWI591214B (en)
WO (1) WO2013148890A1 (en)

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US20130292254A1 (en) 2013-11-07
KR102112881B1 (en) 2020-05-19
CN104272438B (en) 2018-01-12
US10092933B2 (en) 2018-10-09
TWI591214B (en) 2017-07-11
TW201402874A (en) 2014-01-16
SG11201406133WA (en) 2014-10-30
WO2013148890A1 (en) 2013-10-03

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