SG10201404673PA - Wet treatment apparatus and substrate treatment apparatus provided with the same - Google Patents

Wet treatment apparatus and substrate treatment apparatus provided with the same

Info

Publication number
SG10201404673PA
SG10201404673PA SG10201404673PA SG10201404673PA SG10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA
Authority
SG
Singapore
Prior art keywords
treatment apparatus
same
wet
substrate
apparatus provided
Prior art date
Application number
SG10201404673PA
Other languages
English (en)
Inventor
Shinozaki Hiroyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201404673PA publication Critical patent/SG10201404673PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201404673PA 2013-08-07 2014-08-06 Wet treatment apparatus and substrate treatment apparatus provided with the same SG10201404673PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013163841A JP6239893B2 (ja) 2013-08-07 2013-08-07 ウェット処理装置及びこれを備えた基板処理装置

Publications (1)

Publication Number Publication Date
SG10201404673PA true SG10201404673PA (en) 2015-03-30

Family

ID=52447968

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404673PA SG10201404673PA (en) 2013-08-07 2014-08-06 Wet treatment apparatus and substrate treatment apparatus provided with the same

Country Status (3)

Country Link
US (1) US9687958B2 (ja)
JP (1) JP6239893B2 (ja)
SG (1) SG10201404673PA (ja)

Family Cites Families (51)

* Cited by examiner, † Cited by third party
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JPH09207047A (ja) * 1996-01-31 1997-08-12 Ebara Corp ポリッシング装置又は搬送・洗浄装置のドレンパン
EP0793261B1 (en) * 1996-02-28 2005-01-05 Ebara Corporation Robotic transport apparatus having a guard against water
JP3616832B2 (ja) 1996-02-28 2005-02-02 株式会社荏原製作所 ワーク搬送ロボットの防水機構
JPH1076493A (ja) 1996-09-04 1998-03-24 Ebara Corp ワーク搬送ロボットの防水機構
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US5997653A (en) * 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
JP3360001B2 (ja) 1996-10-30 2002-12-24 芝浦メカトロニクス株式会社 処理装置
JP3578577B2 (ja) * 1997-01-28 2004-10-20 大日本スクリーン製造株式会社 処理液供給方法及びその装置
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JP5218450B2 (ja) 2010-03-03 2013-06-26 東京エレクトロン株式会社 液処理装置及び液処理方法
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JP5242632B2 (ja) * 2010-06-03 2013-07-24 東京エレクトロン株式会社 基板液処理装置
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US10208462B2 (en) * 2012-11-06 2019-02-19 Ramsey Carter Systems and methods for precipitation collection

Also Published As

Publication number Publication date
US9687958B2 (en) 2017-06-27
JP2015032803A (ja) 2015-02-16
JP6239893B2 (ja) 2017-11-29
US20150042028A1 (en) 2015-02-12

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