SG10201404673PA - Wet treatment apparatus and substrate treatment apparatus provided with the same - Google Patents
Wet treatment apparatus and substrate treatment apparatus provided with the sameInfo
- Publication number
- SG10201404673PA SG10201404673PA SG10201404673PA SG10201404673PA SG10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA
- Authority
- SG
- Singapore
- Prior art keywords
- treatment apparatus
- same
- wet
- substrate
- apparatus provided
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013163841A JP6239893B2 (en) | 2013-08-07 | 2013-08-07 | Wet processing apparatus and substrate processing apparatus provided with the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201404673PA true SG10201404673PA (en) | 2015-03-30 |
Family
ID=52447968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201404673PA SG10201404673PA (en) | 2013-08-07 | 2014-08-06 | Wet treatment apparatus and substrate treatment apparatus provided with the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US9687958B2 (en) |
JP (1) | JP6239893B2 (en) |
SG (1) | SG10201404673PA (en) |
Family Cites Families (51)
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GB732103A (en) * | 1950-12-21 | 1955-06-22 | Roland Evan Thomas | Improvements in or relating to abrasive feed device for lens grinding and like machines |
US4788994A (en) * | 1986-08-13 | 1988-12-06 | Dainippon Screen Mfg. Co. | Wafer holding mechanism |
KR100284559B1 (en) * | 1994-04-04 | 2001-04-02 | 다카시마 히로시 | Treatment method and processing device |
JP3116297B2 (en) * | 1994-08-03 | 2000-12-11 | 東京エレクトロン株式会社 | Processing method and processing apparatus |
KR100262902B1 (en) * | 1994-08-31 | 2000-09-01 | 다카시마 히로시 | Method and apparatus for developing treatment |
JP3099054B2 (en) * | 1994-09-09 | 2000-10-16 | 東京エレクトロン株式会社 | Coating apparatus and method |
JP3518948B2 (en) * | 1995-08-24 | 2004-04-12 | 大日本スクリーン製造株式会社 | Substrate rotation processing equipment |
JPH09207047A (en) * | 1996-01-31 | 1997-08-12 | Ebara Corp | Drain pan for polishing device or conveying and washing device |
EP0793261B1 (en) * | 1996-02-28 | 2005-01-05 | Ebara Corporation | Robotic transport apparatus having a guard against water |
JP3616832B2 (en) | 1996-02-28 | 2005-02-02 | 株式会社荏原製作所 | Waterproof mechanism for workpiece transfer robot |
JPH1076493A (en) | 1996-09-04 | 1998-03-24 | Ebara Corp | Waterproofing mechanism for work conveying robot |
SG103277A1 (en) * | 1996-09-24 | 2004-04-29 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
US5997653A (en) * | 1996-10-07 | 1999-12-07 | Tokyo Electron Limited | Method for washing and drying substrates |
JP3360001B2 (en) | 1996-10-30 | 2002-12-24 | 芝浦メカトロニクス株式会社 | Processing equipment |
JP3578577B2 (en) * | 1997-01-28 | 2004-10-20 | 大日本スクリーン製造株式会社 | Processing solution supply method and apparatus |
US5940651A (en) * | 1998-02-13 | 1999-08-17 | Advanced Micro Devices, Inc. | Drip catching apparatus for receiving excess photoresist developer solution |
US6565928B2 (en) * | 1999-03-08 | 2003-05-20 | Tokyo Electron Limited | Film forming method and film forming apparatus |
JP2000334395A (en) * | 1999-05-31 | 2000-12-05 | Ebara Corp | Cleaning apparatus |
KR100597287B1 (en) * | 1999-07-28 | 2006-07-04 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and method |
US6527860B1 (en) * | 1999-10-19 | 2003-03-04 | Tokyo Electron Limited | Substrate processing apparatus |
JP4426036B2 (en) * | 1999-12-02 | 2010-03-03 | 東京エレクトロン株式会社 | Substrate processing equipment |
US6805769B2 (en) * | 2000-10-13 | 2004-10-19 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
US6475066B2 (en) * | 2001-02-27 | 2002-11-05 | E. I. Du Pont De Nemours And Company | Random-orbit head with concentric lock-up feature |
JP2003059884A (en) * | 2001-08-20 | 2003-02-28 | Tokyo Electron Ltd | Substrate treatment apparatus and substrate treatment method |
JP4018958B2 (en) * | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP4056858B2 (en) * | 2001-11-12 | 2008-03-05 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP3852758B2 (en) * | 2002-03-01 | 2006-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Slurry recovery apparatus and method |
US6807972B2 (en) * | 2002-03-29 | 2004-10-26 | Applied Materials, Inc. | Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber |
US7201808B2 (en) * | 2002-03-29 | 2007-04-10 | Applied Materials, Inc. | Method and apparatus for rotating a semiconductor substrate |
US7467635B2 (en) * | 2003-05-12 | 2008-12-23 | Sprout Co., Ltd. | Apparatus and method for substrate processing |
JP4207126B2 (en) * | 2004-02-02 | 2009-01-14 | 株式会社東京精密 | Wafer chamfering equipment |
US7048800B2 (en) * | 2004-02-17 | 2006-05-23 | Asml Holding N.V. | Semiconductor substrate processing apparatus |
JP4043444B2 (en) * | 2004-02-18 | 2008-02-06 | 東京エレクトロン株式会社 | Coating processing apparatus and coating processing method |
JP4324527B2 (en) * | 2004-09-09 | 2009-09-02 | 東京エレクトロン株式会社 | Substrate cleaning method and developing apparatus |
JP4672444B2 (en) * | 2005-06-01 | 2011-04-20 | 株式会社ハウステック | Waterproof pan for renovation |
KR100687011B1 (en) * | 2006-01-13 | 2007-02-26 | 세메스 주식회사 | Apparatus for treating substrate |
JP4690263B2 (en) * | 2006-07-21 | 2011-06-01 | エム・セテック株式会社 | Wafer backside grinding method and apparatus |
KR100900628B1 (en) * | 2006-09-15 | 2009-06-02 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate processing apparatus and substrate processing method |
JP4830962B2 (en) * | 2006-10-23 | 2011-12-07 | 東京エレクトロン株式会社 | Liquid processing apparatus, cup body attaching / detaching method, and storage medium |
JP5106071B2 (en) * | 2007-12-06 | 2012-12-26 | 株式会社ハウステック | Bathroom and bathroom unit |
JP4994501B2 (en) * | 2007-12-10 | 2012-08-08 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Semiconductor wafer cleaning method and apparatus |
JP4949338B2 (en) * | 2008-08-06 | 2012-06-06 | 東京エレクトロン株式会社 | Liquid processing equipment |
JP5218450B2 (en) | 2010-03-03 | 2013-06-26 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
EP2372749B1 (en) * | 2010-03-31 | 2021-09-29 | Levitronix GmbH | Treatment device for treating a surface of a body |
JP5242632B2 (en) * | 2010-06-03 | 2013-07-24 | 東京エレクトロン株式会社 | Substrate liquid processing equipment |
US8739806B2 (en) * | 2011-05-11 | 2014-06-03 | Nanya Technology Corp. | Chemical mechanical polishing system |
US8662963B2 (en) * | 2011-05-12 | 2014-03-04 | Nanya Technology Corp. | Chemical mechanical polishing system |
US20130115862A1 (en) * | 2011-11-09 | 2013-05-09 | Applied Materials, Inc. | Chemical mechanical polishing platform architecture |
JP6057624B2 (en) * | 2012-09-03 | 2017-01-11 | 株式会社Screenセミコンダクターソリューションズ | Cup and substrate processing equipment |
US9339914B2 (en) * | 2012-09-10 | 2016-05-17 | Applied Materials, Inc. | Substrate polishing and fluid recycling system |
US10208462B2 (en) * | 2012-11-06 | 2019-02-19 | Ramsey Carter | Systems and methods for precipitation collection |
-
2013
- 2013-08-07 JP JP2013163841A patent/JP6239893B2/en active Active
-
2014
- 2014-08-04 US US14/450,738 patent/US9687958B2/en active Active
- 2014-08-06 SG SG10201404673PA patent/SG10201404673PA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US9687958B2 (en) | 2017-06-27 |
JP2015032803A (en) | 2015-02-16 |
JP6239893B2 (en) | 2017-11-29 |
US20150042028A1 (en) | 2015-02-12 |
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