SG10201404673PA - Wet treatment apparatus and substrate treatment apparatus provided with the same - Google Patents

Wet treatment apparatus and substrate treatment apparatus provided with the same

Info

Publication number
SG10201404673PA
SG10201404673PA SG10201404673PA SG10201404673PA SG10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA SG 10201404673P A SG10201404673P A SG 10201404673PA
Authority
SG
Singapore
Prior art keywords
treatment apparatus
same
wet
substrate
apparatus provided
Prior art date
Application number
SG10201404673PA
Inventor
Shinozaki Hiroyuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201404673PA publication Critical patent/SG10201404673PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG10201404673PA 2013-08-07 2014-08-06 Wet treatment apparatus and substrate treatment apparatus provided with the same SG10201404673PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013163841A JP6239893B2 (en) 2013-08-07 2013-08-07 Wet processing apparatus and substrate processing apparatus provided with the same

Publications (1)

Publication Number Publication Date
SG10201404673PA true SG10201404673PA (en) 2015-03-30

Family

ID=52447968

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404673PA SG10201404673PA (en) 2013-08-07 2014-08-06 Wet treatment apparatus and substrate treatment apparatus provided with the same

Country Status (3)

Country Link
US (1) US9687958B2 (en)
JP (1) JP6239893B2 (en)
SG (1) SG10201404673PA (en)

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB732103A (en) * 1950-12-21 1955-06-22 Roland Evan Thomas Improvements in or relating to abrasive feed device for lens grinding and like machines
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
KR100284559B1 (en) * 1994-04-04 2001-04-02 다카시마 히로시 Treatment method and processing device
JP3116297B2 (en) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 Processing method and processing apparatus
US5689749A (en) * 1994-08-31 1997-11-18 Tokyo Electron Limited Apparatus for developing a resist-coated substrate
JP3099054B2 (en) * 1994-09-09 2000-10-16 東京エレクトロン株式会社 Coating apparatus and method
JP3518948B2 (en) * 1995-08-24 2004-04-12 大日本スクリーン製造株式会社 Substrate rotation processing equipment
JPH09207047A (en) * 1996-01-31 1997-08-12 Ebara Corp Drain pan for polishing device or conveying and washing device
EP0793261B1 (en) * 1996-02-28 2005-01-05 Ebara Corporation Robotic transport apparatus having a guard against water
JP3616832B2 (en) 1996-02-28 2005-02-02 株式会社荏原製作所 Waterproof mechanism for workpiece transfer robot
JPH1076493A (en) 1996-09-04 1998-03-24 Ebara Corp Waterproofing mechanism for work conveying robot
SG98022A1 (en) * 1996-09-24 2003-08-20 Tokyo Electron Ltd Method and apparatus for cleaning treatment
TW357406B (en) * 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
JP3360001B2 (en) 1996-10-30 2002-12-24 芝浦メカトロニクス株式会社 Processing equipment
JP3578577B2 (en) * 1997-01-28 2004-10-20 大日本スクリーン製造株式会社 Processing solution supply method and apparatus
US5940651A (en) * 1998-02-13 1999-08-17 Advanced Micro Devices, Inc. Drip catching apparatus for receiving excess photoresist developer solution
US6565928B2 (en) * 1999-03-08 2003-05-20 Tokyo Electron Limited Film forming method and film forming apparatus
JP2000334395A (en) * 1999-05-31 2000-12-05 Ebara Corp Cleaning apparatus
KR100597287B1 (en) * 1999-07-28 2006-07-04 동경 엘렉트론 주식회사 Substrate processing apparatus and method
US6527860B1 (en) * 1999-10-19 2003-03-04 Tokyo Electron Limited Substrate processing apparatus
JP4426036B2 (en) * 1999-12-02 2010-03-03 東京エレクトロン株式会社 Substrate processing equipment
US6805769B2 (en) * 2000-10-13 2004-10-19 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6475066B2 (en) * 2001-02-27 2002-11-05 E. I. Du Pont De Nemours And Company Random-orbit head with concentric lock-up feature
JP2003059884A (en) * 2001-08-20 2003-02-28 Tokyo Electron Ltd Substrate treatment apparatus and substrate treatment method
JP4018958B2 (en) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 Substrate processing equipment
JP4056858B2 (en) * 2001-11-12 2008-03-05 東京エレクトロン株式会社 Substrate processing equipment
JP3852758B2 (en) * 2002-03-01 2006-12-06 インターナショナル・ビジネス・マシーンズ・コーポレーション Slurry recovery apparatus and method
US6807972B2 (en) * 2002-03-29 2004-10-26 Applied Materials, Inc. Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber
US7201808B2 (en) * 2002-03-29 2007-04-10 Applied Materials, Inc. Method and apparatus for rotating a semiconductor substrate
US7467635B2 (en) * 2003-05-12 2008-12-23 Sprout Co., Ltd. Apparatus and method for substrate processing
JP4207126B2 (en) * 2004-02-02 2009-01-14 株式会社東京精密 Wafer chamfering equipment
US7048800B2 (en) * 2004-02-17 2006-05-23 Asml Holding N.V. Semiconductor substrate processing apparatus
JP4043444B2 (en) * 2004-02-18 2008-02-06 東京エレクトロン株式会社 Coating processing apparatus and coating processing method
JP4324527B2 (en) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 Substrate cleaning method and developing apparatus
JP4672444B2 (en) * 2005-06-01 2011-04-20 株式会社ハウステック Waterproof pan for renovation
KR100687011B1 (en) * 2006-01-13 2007-02-26 세메스 주식회사 Apparatus for treating substrate
JP4690263B2 (en) * 2006-07-21 2011-06-01 エム・セテック株式会社 Wafer backside grinding method and apparatus
KR100900628B1 (en) * 2006-09-15 2009-06-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP4830962B2 (en) * 2006-10-23 2011-12-07 東京エレクトロン株式会社 Liquid processing apparatus, cup body attaching / detaching method, and storage medium
JP5106071B2 (en) * 2007-12-06 2012-12-26 株式会社ハウステック Bathroom and bathroom unit
US8580042B2 (en) * 2007-12-10 2013-11-12 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
JP4949338B2 (en) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 Liquid processing equipment
JP5218450B2 (en) 2010-03-03 2013-06-26 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
EP2372749B1 (en) * 2010-03-31 2021-09-29 Levitronix GmbH Treatment device for treating a surface of a body
JP5242632B2 (en) * 2010-06-03 2013-07-24 東京エレクトロン株式会社 Substrate liquid processing equipment
US8739806B2 (en) * 2011-05-11 2014-06-03 Nanya Technology Corp. Chemical mechanical polishing system
US8662963B2 (en) * 2011-05-12 2014-03-04 Nanya Technology Corp. Chemical mechanical polishing system
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
JP6057624B2 (en) * 2012-09-03 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ Cup and substrate processing equipment
US9339914B2 (en) * 2012-09-10 2016-05-17 Applied Materials, Inc. Substrate polishing and fluid recycling system
US10208462B2 (en) * 2012-11-06 2019-02-19 Ramsey Carter Systems and methods for precipitation collection

Also Published As

Publication number Publication date
JP6239893B2 (en) 2017-11-29
JP2015032803A (en) 2015-02-16
US20150042028A1 (en) 2015-02-12
US9687958B2 (en) 2017-06-27

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