JP3616832B2 - Waterproof mechanism for workpiece transfer robot - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a waterproof mechanism for a work transfer robot using a waterproof pan.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is a workpiece transfer robot provided with a holding mechanism that attaches one or more arms to a robot body via joints and holds a workpiece at the tip of the arm. FIG. 3 is a schematic side view showing an example of a workpiece transfer robot that transfers a semiconductor wafer (workpiece) for polishing, cleaning, and the like of this type of conventional workpiece transfer robot. As shown in the figure, this workpiece transfer robot is configured by attaching two sets of arm mechanisms 21 and 21 to the upper surface of a robot body 10 formed in a cylindrical shape.
[0003]
The arm mechanism 21 is configured by attaching two arms 25 and 27 via two joint portions 35 and 37 and attaching a holding mechanism 33 for holding a semiconductor wafer to the upper arm 27 via a joint portion 38. ing.
[0004]
[Problems to be solved by the invention]
By the way, this transport robot transports the semiconductor wafer 60 to a predetermined apparatus by the holding mechanism 33 every time a process such as polishing or cleaning of the semiconductor wafer is performed, but a liquid such as water adheres to the semiconductor wafer 60. Therefore, the liquid may fall and collect on the upper surface of the robot body 10.
[0005]
Then, as the amount of the accumulated water 39 increases and the circumference of the joint portion 35 is filled as shown by hatching in FIG. 3, the liquid enters the arm 25 or the robot body 10 from the gap formed in the joint portion 35. It may invade and corrode the inside, causing failure, increasing the number of maintenance, and reducing cost performance and productivity. This also applies to the joint portions 37 and 38 when liquid accumulates on the upper surfaces of the arms 25 and 27.
[0006]
In order to prevent this water intrusion, there is a method using a contact type seal at each joint portion 35, 37, 38, but there is also a strict gap in the contact type seal, thus completely preventing liquid from entering. It was difficult to do.
[0007]
Further, when the joint portions 35, 37, and 38 are sealed using an effective O-ring as a contact-type seal, the tightening force due to the elastic force of the O-ring is large, so the gap is reduced, but the friction force is increased accordingly. Therefore, each arm 25 and 27 will decelerate. On the other hand, in order to maintain the speeds of the arms 25 and 27, a larger torque is required, so that there is a disadvantage that the drive motor becomes large.
[0008]
The present invention has been made in view of the above points, and its purpose is to eliminate the above-mentioned drawbacks and to enable effective waterproofing measures without generating frictional force due to mechanical sealing at each joint. An object of the present invention is to provide a waterproof mechanism for a workpiece transfer robot using a waterproof pan.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention attaches an arm to a robot body via a joint, and holds a semiconductor wafer to which a liquid adheres to the arm so as to be placed on the arm. In the waterproof mechanism of the workpiece transfer robot to which the mechanism is attached, the holding mechanism has a width and length larger than the diameter of the semiconductor wafer at a position below the part holding the semiconductor wafer and above the robot body . A waterproof pan that is sized and shaped to receive the liquid dropped from the semiconductor wafer was installed, and the waterproof pan was fixed to the robot body .
Further, a drain pipe is connected to the waterproof pan so as to drain.
Further, the drain pipe is inserted into a second waterproof pan provided on the outer peripheral side surface of the robot body, and further drained by a drain pipe connected to the second waterproof pan.
Further, the workpiece transfer robot is provided with a moving mechanism for moving the entire workpiece transfer robot, and the side of the workpiece transfer robot has a length over the entire moving distance toward the moving direction of the workpiece transfer robot. And a drain pipe connected to the second waterproof pan is inserted into the tub.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic side view of a workpiece transfer robot according to an embodiment of the present invention. This workpiece transfer robot is a semiconductor wafer transfer robot. FIG. 2 is a perspective view showing a specific example in which two workpiece transfer robots are installed.
[0011]
As shown in FIG. 1, this work transfer robot is also configured by attaching two sets of arm mechanisms 21 and 21 to the upper surface of a cylindrical robot body 10 in the same manner as the work transfer robot shown in FIG.
[0012]
In both arm mechanisms 21 and 21, two arms 25 and 27 are connected by joint portions 35 and 37, and a holding mechanism 33-1 for holding a semiconductor wafer is connected to an end portion of the upper arm 27 via a joint portion 38. , 33-2 are attached.
[0013]
The substantially flat hands 41-1 and 41-2 are attached to the front ends of the holding mechanisms 33-1 and 33-2 so as to overlap each other without contacting each other. A semiconductor wafer (work) 60 is held on each of the hands 41-1 and 41-2.
[0014]
In the case of the present embodiment, the holding mechanism 33-1 is positioned below the holding mechanism 33-2, and is waterproof between the hand 41-1 attached to the lower holding mechanism 33-1 and the joint portion 38. A pan 50 is attached. The waterproof pan 50 is formed in a dimension shape having a width and a length that are larger than the diameter of the semiconductor wafer 60 held by at least the holding mechanisms 33-1 and 33-2. In particular, in this embodiment, the length and width of the waterproof pan 50 are formed larger than the diameter of the robot body 10. In other words, the waterproof pan 50 is installed on the entire portion where the semiconductor wafer 60 moves on the robot body 10.
[0015]
As shown in FIG. 1, a drain pipe 51 is connected to a predetermined position of the waterproof pan 50, and a lower end of the drain pipe 51 is a second waterproof pan 53 attached to the outer peripheral side surface of the robot body 10 in a ring shape. Is inserted inside. In addition, if the waterproof pan 50 is inclined toward the portion where the drain pipe 51 is connected, it is preferable because drainage is easy.
[0016]
A drain pipe 55 is also connected to a predetermined position of the second waterproof pan 53, and a lower end of the drain pipe 55 is inserted into the ridge 57.
[0017]
Here, the two workpiece transfer robots shown in FIG. 2 are moved in the directions of arrows A and B shown in FIG. 1 by a moving device (not shown), and various devices such as a cleaning device and a polishing device. 2, the rod 57 is one side of two workpiece transfer robots as shown in FIG. 2, and the moving distance toward the moving direction of the workpiece transfer robots It is formed in a length over the entire length. A drain pipe 59 is also connected to the trough 57.
[0018]
By the way, a third waterproof pan 61 is installed on the left side of the left work transfer robot as viewed in FIG. 2 (not shown in FIG. 1), and a drain pipe 62 is also connected to the third waterproof pan 61. And inserted into the ridge 57. A fourth waterproof pan 63 having a length over the entire moving distance of the work transfer robot is also installed on the opposite side of the flange 57.
[0019]
Further, as shown in FIG. 1, a fifth waterproof pan 65 is also provided on the lower side of the robot body 10 (not shown in FIG. 2).
[0020]
When the workpiece transfer robot configured as described above is operated and the semiconductor wafer 60 is transferred between a cleaning device and a polishing device (not shown) by the holding mechanisms 33-1 and 33-2, the liquid adhering to the semiconductor wafer 60 is removed. Although dripping and falling, at the upper part of the robot body 10, all of the liquid falls on the first waterproof pan 50 and does not fall on the upper surface of the robot body 10 or the upper surfaces of the arms 25 and 27. Accordingly, there is no possibility that the liquid enters the arms 25 and 27 and the robot body 10 from the joint portions 35, 37 and 38.
[0021]
The liquid that has fallen on the waterproof pan 50 is collected from the drain pipe 51 through the second waterproof pan 53 and the drain pipe 55 into the gutter 57 and drained from the drain pipe 59 to the outside.
[0022]
The second waterproof pan 53 not only has a function of guiding the liquid that has fallen on the waterproof pan 50 to the bag 57, but also the liquid that should fall on the waterproof pan 50 is scattered by vibrations or the like around the robot body 10. Even when the liquid is scattered, it has a function of collecting the liquid without escaping.
[0023]
On the other hand, when the semiconductor wafer 60 is transferred between the cleaning device and the polishing device, the semiconductor wafer 60 protrudes from the first waterproof pan 50, but the liquid falling at this time is the third and fourth waterproof pans 61, 63 and the trough 57 receive this, and it drains from the drain pipe 59 and the 5th waterproofing pan 65 (refer FIG. 1), respectively.
[0024]
As described above, the waterproof pan 50 and the second waterproof pan 53 are provided mainly to prevent the liquid from dropping on the work transfer robot, and the third, fourth, and fifth waterproof pans. Reference numerals 61, 63, and 65 are provided mainly for preventing the liquid from dropping around the work transfer robot when the semiconductor wafer 60 is transferred between the work transfer robot and another apparatus. Also, the drainage mechanism such as the ridge 57 is shared by both.
[0025]
In the above embodiment, two hands are shown. Of course, it is sufficient that the number of hands is one or more, and a waterproof pan is installed only under the necessary hands, or a plurality of hands are attached to each hand. May be. The shape of the waterproof pan is not limited to that shown in the above embodiment, and any shape may be used as long as it prevents the robot body and joints from adhering to various liquids.
[0026]
【The invention's effect】
As described in detail above, the present invention has the following excellent effects. (1) Even if no mechanical frictional force is generated at each joint as in the case of a contact-type seal, liquid does not enter the joint from each joint and effective waterproofing measures are possible. . Therefore, the robot does not corrode and fail, the number of maintenance is reduced, and cost performance and productivity are improved.
[0027]
{Circle around (2)} Friction unlike a contact seal does not occur, so that it is not necessary to make the drive motor for driving the arm large, and the size can be reduced. In addition, since no consumables such as contact seals are used, there is little need for maintenance and the labor and cost can be reduced.
[0028]
(3) Since the liquid does not accumulate on the robot and the accumulated liquid does not scatter, it is not only attractive, but especially when used in a semiconductor manufacturing place where a clean environment is important. It has the effect of suppressing bacteria generated in the water.
[Brief description of the drawings]
FIG. 1 is a schematic side view of a workpiece transfer robot using the present invention.
FIG. 2 is a perspective view showing a specific example in which two workpiece transfer robots shown in FIG. 1 are installed.
FIG. 3 is a schematic side view showing an example of a conventional workpiece transfer robot.
[Explanation of symbols]
10 Robot body 25, 27 Arms 33-1, 33-2 Holding mechanism 35, 37, 38 Joint 50 Waterproof pan 51 Drain pipe 53 Second waterproof pan 55 Drain pipe 57 樋 59 Drain pipe 60 Semiconductor wafer (work)
61 3rd waterproof pan 62 Drain pipe 63 4th waterproof pan 65 5th waterproof pan

Claims (4)

Attach the arm on the robot body via the joint,
In the waterproof mechanism of the workpiece transfer robot in which the holding mechanism for holding the semiconductor wafer to which the liquid is attached is attached to the arm so as to be installed on the arm ,
The liquid that has fallen from the semiconductor wafer at a position below the portion where the holding mechanism holds the semiconductor wafer and above the robot body and having a width and length larger than the diameter of the semiconductor wafer. A waterproof mechanism for a workpiece transfer robot, characterized in that a waterproof pan is installed and the waterproof pan is fixed to the robot body . The waterproof mechanism for a workpiece transfer robot according to claim 1, wherein a drain pipe is connected to the waterproof pan to allow drainage. 3. The drain pipe is inserted into a second waterproof pan provided on the outer peripheral side surface of the robot body, and further drained by a drain pipe connected to the second waterproof pan. Waterproofing mechanism of the workpiece transfer robot. The workpiece transfer robot is provided with a moving mechanism for moving the entire workpiece transfer robot, and the side of the workpiece transfer robot is provided with a heel having a length over the entire moving distance in the moving direction of the workpiece transfer robot. 4. The waterproof mechanism for a workpiece transfer robot according to claim 3, wherein a drain pipe installed and connected to the second waterproof pan is inserted into the jar.

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