SE518640C2 - Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning - Google Patents
Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckningInfo
- Publication number
- SE518640C2 SE518640C2 SE0002619A SE0002619A SE518640C2 SE 518640 C2 SE518640 C2 SE 518640C2 SE 0002619 A SE0002619 A SE 0002619A SE 0002619 A SE0002619 A SE 0002619A SE 518640 C2 SE518640 C2 SE 518640C2
- Authority
- SE
- Sweden
- Prior art keywords
- viscous medium
- substrate
- screen printing
- additional
- screen
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Methods (AREA)
- Ink Jet (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
EP01950142A EP1314342B1 (fr) | 2000-07-11 | 2001-07-06 | Procede et dispositif d'application de milieux visqueux sur un substrat, et utilisation de ces procede et dispositif |
AT01950142T ATE406085T1 (de) | 2000-07-11 | 2001-07-06 | Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat |
PCT/SE2001/001567 WO2002005608A1 (fr) | 2000-07-11 | 2001-07-06 | Procede et dispositif d'application de milieux visqueux sur un substrat, et utilisation de ces procede et dispositif |
DE60135467T DE60135467D1 (de) | 2000-07-11 | 2001-07-06 | Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat |
AU2001271170A AU2001271170A1 (en) | 2000-07-11 | 2001-07-06 | Method, apparatus and use of applying viscous medium on a substrate |
JP2002508879A JP5198709B2 (ja) | 2000-07-11 | 2001-07-06 | 粘性媒体を基板に塗布する方法、装置および使用 |
US09/901,592 US7757391B2 (en) | 2000-07-11 | 2001-07-11 | Method for applying viscous medium on a substrate |
US11/502,477 US7600548B2 (en) | 2000-07-11 | 2006-08-11 | Method and apparatus for applying viscous medium onto a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0002619D0 SE0002619D0 (sv) | 2000-07-11 |
SE0002619L SE0002619L (sv) | 2002-03-08 |
SE518640C2 true SE518640C2 (sv) | 2002-11-05 |
Family
ID=20280455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0002619A SE518640C2 (sv) | 2000-07-11 | 2000-07-11 | Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning |
Country Status (8)
Country | Link |
---|---|
US (2) | US7757391B2 (fr) |
EP (1) | EP1314342B1 (fr) |
JP (1) | JP5198709B2 (fr) |
AT (1) | ATE406085T1 (fr) |
AU (1) | AU2001271170A1 (fr) |
DE (1) | DE60135467D1 (fr) |
SE (1) | SE518640C2 (fr) |
WO (1) | WO2002005608A1 (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE518642C2 (sv) | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
JP4618085B2 (ja) * | 2005-09-30 | 2011-01-26 | 株式会社日立プラントテクノロジー | はんだペースト印刷システム |
US20070146442A1 (en) | 2005-11-14 | 2007-06-28 | Mydata Automation Ab | System, assembly and method for jetting viscous medium onto a substrate |
JP4869776B2 (ja) * | 2006-04-28 | 2012-02-08 | ヤマハ発動機株式会社 | 印刷検査装置及び印刷装置 |
US7823762B2 (en) * | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
KR100807090B1 (ko) * | 2007-03-28 | 2008-02-26 | 에스엔유 프리시젼 주식회사 | 기판 지지장치와 이를 이용한 엘씨디 셀의 씰패턴 검사장치 |
DE102009053575B4 (de) * | 2009-11-06 | 2016-06-30 | Ekra Automatisierungssysteme Gmbh | Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste |
US9398697B2 (en) | 2013-03-13 | 2016-07-19 | Mycronic AB | Methods and devices for jetting viscous medium on workpiece |
JP6359541B2 (ja) * | 2013-08-07 | 2018-07-18 | 株式会社Fuji | 電子部品装着機、および転写確認方法 |
JP6155468B2 (ja) * | 2013-12-06 | 2017-07-05 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
JP2015109397A (ja) * | 2013-12-06 | 2015-06-11 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装システム |
DE102014202170A1 (de) * | 2014-02-06 | 2015-08-20 | Ekra Automatisierungssysteme Gmbh | Vorrichtung und Verfahren zum Bedrucken von Substraten |
CN107079587B (zh) * | 2014-09-09 | 2020-07-14 | 迈康尼股份公司 | 用于施加焊膏焊剂的方法和装置 |
CN107079618B (zh) * | 2014-11-20 | 2020-04-14 | 株式会社高永科技 | 检查装置及具有其的部件贴装系统 |
DE102016116201B4 (de) * | 2016-08-31 | 2018-06-21 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker |
US11544836B2 (en) * | 2021-03-18 | 2023-01-03 | Inventec (Pudong) Technology Corporation | Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof |
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SE518642C2 (sv) * | 2000-07-11 | 2002-11-05 | Mydata Automation Ab | Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel |
-
2000
- 2000-07-11 SE SE0002619A patent/SE518640C2/sv unknown
-
2001
- 2001-07-06 WO PCT/SE2001/001567 patent/WO2002005608A1/fr active Application Filing
- 2001-07-06 AT AT01950142T patent/ATE406085T1/de not_active IP Right Cessation
- 2001-07-06 EP EP01950142A patent/EP1314342B1/fr not_active Expired - Lifetime
- 2001-07-06 DE DE60135467T patent/DE60135467D1/de not_active Expired - Lifetime
- 2001-07-06 JP JP2002508879A patent/JP5198709B2/ja not_active Expired - Lifetime
- 2001-07-06 AU AU2001271170A patent/AU2001271170A1/en not_active Abandoned
- 2001-07-11 US US09/901,592 patent/US7757391B2/en not_active Expired - Fee Related
-
2006
- 2006-08-11 US US11/502,477 patent/US7600548B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1314342B1 (fr) | 2008-08-20 |
AU2001271170A1 (en) | 2002-01-21 |
US7757391B2 (en) | 2010-07-20 |
ATE406085T1 (de) | 2008-09-15 |
DE60135467D1 (de) | 2008-10-02 |
US20020015780A1 (en) | 2002-02-07 |
US20070137558A1 (en) | 2007-06-21 |
EP1314342A1 (fr) | 2003-05-28 |
US7600548B2 (en) | 2009-10-13 |
SE0002619D0 (sv) | 2000-07-11 |
SE0002619L (sv) | 2002-03-08 |
JP5198709B2 (ja) | 2013-05-15 |
WO2002005608A1 (fr) | 2002-01-17 |
JP2004502539A (ja) | 2004-01-29 |
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