RU2468346C2 - Устройство с мембранной конструкцией для обнаружения теплового излучения, способ его изготовления и использования - Google Patents

Устройство с мембранной конструкцией для обнаружения теплового излучения, способ его изготовления и использования Download PDF

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RU2468346C2
RU2468346C2 RU2009144001/28A RU2009144001A RU2468346C2 RU 2468346 C2 RU2468346 C2 RU 2468346C2 RU 2009144001/28 A RU2009144001/28 A RU 2009144001/28A RU 2009144001 A RU2009144001 A RU 2009144001A RU 2468346 C2 RU2468346 C2 RU 2468346C2
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membrane
substrate
circuit
sensor
cover
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RU2009144001/28A
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Russian (ru)
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RU2009144001A (ru
Inventor
Карстен ГИБЕЛЕР
Матиас ШРАЙТЕР
Кристиан ПАУЛУС
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Пайриос Лтд.
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0205—Mechanical elements; Supports for optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/023—Particular leg structure or construction or shape; Nanotubes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G01J5/14—Electrical features thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22—Electrical features thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077—Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J2005/202—Arrays
    • G01J2005/204—Arrays prepared by semiconductor processing, e.g. VLSI
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Micromachines (AREA)
RU2009144001/28A 2007-05-29 2008-05-28 Устройство с мембранной конструкцией для обнаружения теплового излучения, способ его изготовления и использования RU2468346C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200710024902 DE102007024902B8 (de) 2007-05-29 2007-05-29 Vorrichtung mit Membranstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
DE102007024902.2 2007-05-29
PCT/EP2008/004246 WO2008145353A1 (de) 2007-05-29 2008-05-28 Vorrichtung mit membranstruktur zur detektion von wärmestrahlung, verfahren zum herstellen und verwendung der vorrichtung

Publications (2)

Publication Number Publication Date
RU2009144001A RU2009144001A (ru) 2011-07-10
RU2468346C2 true RU2468346C2 (ru) 2012-11-27

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RU2009144001/28A RU2468346C2 (ru) 2007-05-29 2008-05-28 Устройство с мембранной конструкцией для обнаружения теплового излучения, способ его изготовления и использования

Country Status (10)

Country Link
US (1) US9279730B2 (enExample)
EP (1) EP2153187B1 (enExample)
JP (1) JP2010528300A (enExample)
KR (1) KR101612400B1 (enExample)
CN (1) CN101688810B (enExample)
AU (1) AU2008256413B2 (enExample)
BR (1) BRPI0812099B1 (enExample)
DE (1) DE102007024902B8 (enExample)
RU (1) RU2468346C2 (enExample)
WO (1) WO2008145353A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009017845B4 (de) * 2009-04-17 2011-07-21 Pyreos Ltd. Infrarotlichtsensor mit hoher Signalspannung und hohem Signal-Rausch-Verhältnis, sowie Infrarotlichtdetektor mit dem Infrarotlichtsensor
DE102009060217B3 (de) 2009-12-23 2011-06-22 Pyreos Ltd. Verfahren zum Herstellen eines Infrarotlichtdetektors
DE102010012701B4 (de) 2010-03-24 2013-10-17 Bundesrepublik Deutschland, vertr.d.d. Bundesministerium für Wirtschaft und Technologie, d.vertr.d.d. Präsidenten der Physikalisch-Technischen Bundesanstalt Mikrokraftsensor
DE102012216618A1 (de) 2012-09-18 2014-03-20 Robert Bosch Gmbh Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung
DE102012217881A1 (de) * 2012-10-01 2014-04-03 Siemens Aktiengesellschaft Sensoranordnung und Herstellungsverfahren
DE102013204763A1 (de) * 2013-03-19 2014-09-25 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren
US10323979B2 (en) * 2015-06-01 2019-06-18 Seoul Viosys Co., Ltd. Ultraviolet measuring device, photodetector element, ultraviolet detector, ultraviolet index calculation device, and electronic device including same
CN108827676B (zh) * 2018-04-25 2020-12-11 合肥美的电冰箱有限公司 散热测量系统及其方法、控制装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2258207C1 (ru) * 2004-01-09 2005-08-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" Болометрический резистивный элемент
FR2867273A1 (fr) * 2004-03-04 2005-09-09 Commissariat Energie Atomique Procede de realisation d'un dispositif pour la detection thermique d'un rayonnement comportant un microbolometre actif et un microbolometre passif
EP1719988A1 (en) * 2004-02-26 2006-11-08 Hamamatsu Photonics K. K. Infrared sensor and method of producing the same
WO2007000172A1 (en) * 2005-06-27 2007-01-04 Hl-Planar Technik Gmbh Device for the detection of electromagnetic waves and method for producing such a device
WO2007054111A1 (de) * 2005-11-10 2007-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor zum erfassen einer elektromagnetischen strahlung

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4044251A (en) * 1976-05-18 1977-08-23 Minnesota Mining And Manufacturing Company Electromagnetic radiation detector with large area sensing medium
JPH01308927A (ja) 1988-06-07 1989-12-13 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびその製法
GB9009117D0 (en) 1990-04-24 1990-08-08 Emi Plc Thorn Pyroelectric detector and method of manufacturing the same
JP3200657B2 (ja) * 1992-04-30 2001-08-20 テルモ株式会社 赤外線センサ
JPH07128140A (ja) 1993-10-29 1995-05-19 Matsushita Electric Works Ltd 赤外線検出素子
CA2179052C (en) 1993-12-13 2001-02-13 Robert E. Higashi Integrated silicon vacuum micropackage for infrared devices
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
JP3399399B2 (ja) * 1999-04-14 2003-04-21 株式会社村田製作所 赤外線センサ及びその製造方法
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
DE10004216C2 (de) * 2000-02-01 2002-09-19 Siemens Ag Vorrichtung zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
JP2001326367A (ja) * 2000-05-12 2001-11-22 Denso Corp センサおよびその製造方法
DE10042945A1 (de) * 2000-08-31 2002-03-28 Siemens Ag Bauelement für Sensoren mit integrierter Elektronik und Verfahren zu seiner Herstellung, sowie Sensor mit integrierter Elektronik
DE10058861A1 (de) 2000-11-27 2002-06-13 Siemens Ag Infrarotsensor für hochauflösende Infrarot-Detektoranordnungen und Verfahren zu seiner Herstellung
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
JP3604130B2 (ja) 2001-12-04 2004-12-22 株式会社アイ・エイチ・アイ・エアロスペース 熱型赤外線検出素子およびその製造方法ならびに熱型赤外線検出素子アレイ
JP2004093535A (ja) 2002-09-04 2004-03-25 Mitsubishi Electric Corp 熱型赤外線固体撮像装置およびその製造方法
US6902759B2 (en) * 2002-09-12 2005-06-07 Innovaquartz Incorporated Technique for coating or marking glass strands
FR2844635B1 (fr) * 2002-09-16 2005-08-19 Commissariat Energie Atomique Dispositif detecteur de rayonnement electromagnetique avec boitier integre comportant deux detecteurs superposes
JP2004239708A (ja) * 2003-02-05 2004-08-26 Mitsubishi Electric Corp 赤外線検出装置およびその製造方法
KR100538996B1 (ko) * 2003-06-19 2005-12-27 한국전자통신연구원 적외선 흡수층으로 실리콘 산화막을 사용한 적외선 센서및 그 제조 방법
DE10327694A1 (de) * 2003-06-20 2005-01-05 Robert Bosch Gmbh Optische Sensoranordnung und entsprechendes Herstellungsverfahren
JP4385255B2 (ja) * 2004-06-10 2009-12-16 日本電気株式会社 ボロメータ型赤外線検出器及び残像の低減方法
JP2005043381A (ja) * 2004-10-18 2005-02-17 Nec Corp 熱型赤外線検出器およびその製造方法
US7718967B2 (en) * 2005-01-26 2010-05-18 Analog Devices, Inc. Die temperature sensors
FR2883417B1 (fr) * 2005-03-16 2007-05-11 Ulis Soc Par Actions Simplifie Detecteur bolometrique, dispositif de detection infrarouge mettant en oeuvre un tel detecteur et procede de fabrication de ce detecteur

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2258207C1 (ru) * 2004-01-09 2005-08-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" Болометрический резистивный элемент
EP1719988A1 (en) * 2004-02-26 2006-11-08 Hamamatsu Photonics K. K. Infrared sensor and method of producing the same
FR2867273A1 (fr) * 2004-03-04 2005-09-09 Commissariat Energie Atomique Procede de realisation d'un dispositif pour la detection thermique d'un rayonnement comportant un microbolometre actif et un microbolometre passif
WO2007000172A1 (en) * 2005-06-27 2007-01-04 Hl-Planar Technik Gmbh Device for the detection of electromagnetic waves and method for producing such a device
WO2007054111A1 (de) * 2005-11-10 2007-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor zum erfassen einer elektromagnetischen strahlung

Also Published As

Publication number Publication date
JP2010528300A (ja) 2010-08-19
EP2153187B1 (de) 2013-01-16
CN101688810B (zh) 2013-09-18
CN101688810A (zh) 2010-03-31
DE102007024902A1 (de) 2008-12-11
AU2008256413B2 (en) 2013-09-12
BRPI0812099A2 (pt) 2014-11-25
US20110006211A1 (en) 2011-01-13
EP2153187A1 (de) 2010-02-17
WO2008145353A1 (de) 2008-12-04
KR101612400B1 (ko) 2016-04-14
KR20100023007A (ko) 2010-03-03
RU2009144001A (ru) 2011-07-10
DE102007024902B8 (de) 2010-12-30
AU2008256413A1 (en) 2008-12-04
DE102007024902B4 (de) 2010-08-26
US9279730B2 (en) 2016-03-08
BRPI0812099B1 (pt) 2018-06-19

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