JP2010528300A - 膜構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法 - Google Patents

膜構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法 Download PDF

Info

Publication number
JP2010528300A
JP2010528300A JP2010509728A JP2010509728A JP2010528300A JP 2010528300 A JP2010528300 A JP 2010528300A JP 2010509728 A JP2010509728 A JP 2010509728A JP 2010509728 A JP2010509728 A JP 2010509728A JP 2010528300 A JP2010528300 A JP 2010528300A
Authority
JP
Japan
Prior art keywords
membrane
cover
support
circuit
detector element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010509728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010528300A5 (enExample
Inventor
カルステン ギーベレール
マチアス シライテル
クリスチアン パウルス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pyreos Ltd
Original Assignee
Pyreos Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pyreos Ltd filed Critical Pyreos Ltd
Publication of JP2010528300A publication Critical patent/JP2010528300A/ja
Publication of JP2010528300A5 publication Critical patent/JP2010528300A5/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0205Mechanical elements; Supports for optical elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0225Shape of the cavity itself or of elements contained in or suspended over the cavity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0225Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/023Particular leg structure or construction or shape; Nanotubes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • G01J5/041Mountings in enclosures or in a particular environment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/045Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G01J5/14Electrical features thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22Electrical features thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077Imaging
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J2005/202Arrays
    • G01J2005/204Arrays prepared by semiconductor processing, e.g. VLSI
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Micromachines (AREA)
JP2010509728A 2007-05-29 2008-05-28 膜構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法 Pending JP2010528300A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710024902 DE102007024902B8 (de) 2007-05-29 2007-05-29 Vorrichtung mit Membranstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
PCT/EP2008/004246 WO2008145353A1 (de) 2007-05-29 2008-05-28 Vorrichtung mit membranstruktur zur detektion von wärmestrahlung, verfahren zum herstellen und verwendung der vorrichtung

Publications (2)

Publication Number Publication Date
JP2010528300A true JP2010528300A (ja) 2010-08-19
JP2010528300A5 JP2010528300A5 (enExample) 2011-07-14

Family

ID=39708794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010509728A Pending JP2010528300A (ja) 2007-05-29 2008-05-28 膜構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法

Country Status (10)

Country Link
US (1) US9279730B2 (enExample)
EP (1) EP2153187B1 (enExample)
JP (1) JP2010528300A (enExample)
KR (1) KR101612400B1 (enExample)
CN (1) CN101688810B (enExample)
AU (1) AU2008256413B2 (enExample)
BR (1) BRPI0812099B1 (enExample)
DE (1) DE102007024902B8 (enExample)
RU (1) RU2468346C2 (enExample)
WO (1) WO2008145353A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009017845B4 (de) * 2009-04-17 2011-07-21 Pyreos Ltd. Infrarotlichtsensor mit hoher Signalspannung und hohem Signal-Rausch-Verhältnis, sowie Infrarotlichtdetektor mit dem Infrarotlichtsensor
DE102009060217B3 (de) 2009-12-23 2011-06-22 Pyreos Ltd. Verfahren zum Herstellen eines Infrarotlichtdetektors
DE102010012701B4 (de) 2010-03-24 2013-10-17 Bundesrepublik Deutschland, vertr.d.d. Bundesministerium für Wirtschaft und Technologie, d.vertr.d.d. Präsidenten der Physikalisch-Technischen Bundesanstalt Mikrokraftsensor
DE102012216618A1 (de) 2012-09-18 2014-03-20 Robert Bosch Gmbh Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung
DE102012217881A1 (de) * 2012-10-01 2014-04-03 Siemens Aktiengesellschaft Sensoranordnung und Herstellungsverfahren
DE102013204763A1 (de) * 2013-03-19 2014-09-25 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren
US10323979B2 (en) * 2015-06-01 2019-06-18 Seoul Viosys Co., Ltd. Ultraviolet measuring device, photodetector element, ultraviolet detector, ultraviolet index calculation device, and electronic device including same
CN108827676B (zh) * 2018-04-25 2020-12-11 合肥美的电冰箱有限公司 散热测量系统及其方法、控制装置

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01308927A (ja) * 1988-06-07 1989-12-13 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびその製法
JPH055652A (ja) * 1990-04-24 1993-01-14 Thorn Emi Plc 熱検知装置およびその製造方法
JPH0674820A (ja) * 1992-04-30 1994-03-18 Terumo Corp 赤外線センサ
JPH07128140A (ja) * 1993-10-29 1995-05-19 Matsushita Electric Works Ltd 赤外線検出素子
JPH09506712A (ja) * 1993-12-13 1997-06-30 ハネウエル・インコーポレーテッド 赤外線デバイス用集積シリコン真空マイクロパッケージ
JP2000298060A (ja) * 1999-04-14 2000-10-24 Murata Mfg Co Ltd 赤外線センサ及びその製造方法
JP2003100919A (ja) * 2001-06-11 2003-04-04 Matsushita Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2003166876A (ja) * 2001-12-04 2003-06-13 Ihi Aerospace Co Ltd 熱型赤外線検出素子およびその製造方法ならびに熱型赤外線検出素子アレイ
JP2004093535A (ja) * 2002-09-04 2004-03-25 Mitsubishi Electric Corp 熱型赤外線固体撮像装置およびその製造方法
JP2004239708A (ja) * 2003-02-05 2004-08-26 Mitsubishi Electric Corp 赤外線検出装置およびその製造方法
JP2005043381A (ja) * 2004-10-18 2005-02-17 Nec Corp 熱型赤外線検出器およびその製造方法
JP2006258815A (ja) * 2005-03-16 2006-09-28 Ulis ボロメータ検出器、そのような検出器を使用して赤外線を検出するための装置、およびこの検出器の製造方法
JP2007506935A (ja) * 2003-06-20 2007-03-22 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 光学的なセンサ装置および相応する製造方法
JP2008544263A (ja) * 2005-06-27 2008-12-04 エイチエル−プラナー・テクニク・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 電磁波検出用装置及びそのような装置製造のための方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4044251A (en) * 1976-05-18 1977-08-23 Minnesota Mining And Manufacturing Company Electromagnetic radiation detector with large area sensing medium
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
DE10004216C2 (de) * 2000-02-01 2002-09-19 Siemens Ag Vorrichtung zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
JP2001326367A (ja) * 2000-05-12 2001-11-22 Denso Corp センサおよびその製造方法
DE10042945A1 (de) * 2000-08-31 2002-03-28 Siemens Ag Bauelement für Sensoren mit integrierter Elektronik und Verfahren zu seiner Herstellung, sowie Sensor mit integrierter Elektronik
DE10058861A1 (de) 2000-11-27 2002-06-13 Siemens Ag Infrarotsensor für hochauflösende Infrarot-Detektoranordnungen und Verfahren zu seiner Herstellung
US6902759B2 (en) * 2002-09-12 2005-06-07 Innovaquartz Incorporated Technique for coating or marking glass strands
FR2844635B1 (fr) * 2002-09-16 2005-08-19 Commissariat Energie Atomique Dispositif detecteur de rayonnement electromagnetique avec boitier integre comportant deux detecteurs superposes
KR100538996B1 (ko) * 2003-06-19 2005-12-27 한국전자통신연구원 적외선 흡수층으로 실리콘 산화막을 사용한 적외선 센서및 그 제조 방법
RU2258207C1 (ru) * 2004-01-09 2005-08-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" Болометрический резистивный элемент
JP2005241457A (ja) * 2004-02-26 2005-09-08 Hamamatsu Photonics Kk 赤外線センサ及びその製造方法
FR2867273B1 (fr) * 2004-03-04 2006-09-08 Commissariat Energie Atomique Procede de realisation d'un dispositif pour la detection thermique d'un rayonnement comportant un microbolometre actif et un microbolometre passif
JP4385255B2 (ja) * 2004-06-10 2009-12-16 日本電気株式会社 ボロメータ型赤外線検出器及び残像の低減方法
US7718967B2 (en) * 2005-01-26 2010-05-18 Analog Devices, Inc. Die temperature sensors
WO2007054111A1 (de) * 2005-11-10 2007-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor zum erfassen einer elektromagnetischen strahlung

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01308927A (ja) * 1988-06-07 1989-12-13 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびその製法
JPH055652A (ja) * 1990-04-24 1993-01-14 Thorn Emi Plc 熱検知装置およびその製造方法
JPH0674820A (ja) * 1992-04-30 1994-03-18 Terumo Corp 赤外線センサ
JPH07128140A (ja) * 1993-10-29 1995-05-19 Matsushita Electric Works Ltd 赤外線検出素子
JPH09506712A (ja) * 1993-12-13 1997-06-30 ハネウエル・インコーポレーテッド 赤外線デバイス用集積シリコン真空マイクロパッケージ
JP2000298060A (ja) * 1999-04-14 2000-10-24 Murata Mfg Co Ltd 赤外線センサ及びその製造方法
JP2003100919A (ja) * 2001-06-11 2003-04-04 Matsushita Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2003166876A (ja) * 2001-12-04 2003-06-13 Ihi Aerospace Co Ltd 熱型赤外線検出素子およびその製造方法ならびに熱型赤外線検出素子アレイ
JP2004093535A (ja) * 2002-09-04 2004-03-25 Mitsubishi Electric Corp 熱型赤外線固体撮像装置およびその製造方法
JP2004239708A (ja) * 2003-02-05 2004-08-26 Mitsubishi Electric Corp 赤外線検出装置およびその製造方法
JP2007506935A (ja) * 2003-06-20 2007-03-22 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 光学的なセンサ装置および相応する製造方法
JP2005043381A (ja) * 2004-10-18 2005-02-17 Nec Corp 熱型赤外線検出器およびその製造方法
JP2006258815A (ja) * 2005-03-16 2006-09-28 Ulis ボロメータ検出器、そのような検出器を使用して赤外線を検出するための装置、およびこの検出器の製造方法
JP2008544263A (ja) * 2005-06-27 2008-12-04 エイチエル−プラナー・テクニク・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 電磁波検出用装置及びそのような装置製造のための方法

Also Published As

Publication number Publication date
EP2153187B1 (de) 2013-01-16
CN101688810B (zh) 2013-09-18
CN101688810A (zh) 2010-03-31
DE102007024902A1 (de) 2008-12-11
AU2008256413B2 (en) 2013-09-12
BRPI0812099A2 (pt) 2014-11-25
US20110006211A1 (en) 2011-01-13
EP2153187A1 (de) 2010-02-17
WO2008145353A1 (de) 2008-12-04
KR101612400B1 (ko) 2016-04-14
KR20100023007A (ko) 2010-03-03
RU2009144001A (ru) 2011-07-10
DE102007024902B8 (de) 2010-12-30
AU2008256413A1 (en) 2008-12-04
DE102007024902B4 (de) 2010-08-26
US9279730B2 (en) 2016-03-08
BRPI0812099B1 (pt) 2018-06-19
RU2468346C2 (ru) 2012-11-27

Similar Documents

Publication Publication Date Title
JP2010528300A (ja) 膜構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法
JP5763682B2 (ja) Mems及びasicを備える小型化した電気的デバイス及びその製造方法
CN103119925B (zh) 红外摄像机架构系统和方法
US20030122137A1 (en) Optical device and method of manufacturing the same, optical module, circuit board, and electronic instrument
US20090134481A1 (en) Molded Sensor Package and Assembly Method
TWI533444B (zh) 無蓋式感測器模組及其製造方法
CN108291840A (zh) 晶圆级封装件中的热红外传感器阵列
JP2007282137A (ja) 光学装置用モジュール及び光学装置用モジュールの製造方法
JP2009500821A (ja) 電子素子
CN101065648A (zh) 红外线检测装置
JP5455239B2 (ja) サンドイッチ構造体を有する熱放射検出用デバイス、このデバイスの製造方法および使用方法
JP2012059881A (ja) 撮像素子、撮像モジュール及び撮像素子の製造方法
CN109455664B (zh) 一种微桥组件、红外探测器及其制造方法
JP5389045B2 (ja) 遮蔽されたサンドイッチ構造を有する熱放射の検知用素子とその使用
KR101232886B1 (ko) 재배선용 기판을 이용한 반도체 패키지 및 그 제조 방법
JPH06509912A (ja) 電子部品およびそのパッケージ内への装着方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110524

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110524

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120514

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120822

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130401

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20130604

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20130606

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20130606

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131028

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140127

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140226

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140804