RU2011113546A - Системная плата, включающая модуль над кристаллом, непосредственно закрепленным на системной плате - Google Patents

Системная плата, включающая модуль над кристаллом, непосредственно закрепленным на системной плате Download PDF

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Publication number
RU2011113546A
RU2011113546A RU2011113546/28A RU2011113546A RU2011113546A RU 2011113546 A RU2011113546 A RU 2011113546A RU 2011113546/28 A RU2011113546/28 A RU 2011113546/28A RU 2011113546 A RU2011113546 A RU 2011113546A RU 2011113546 A RU2011113546 A RU 2011113546A
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Russia
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board
chip
system board
module
directly attached
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RU2011113546/28A
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English (en)
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RU2480862C2 (ru
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Деймион СИРЛЗ (US)
Деймион СИРЛЗ
Уэстон К. РОТ (US)
Уэстон К. РОТ
Маргарет Д. РАМИРЕЗ (US)
Маргарет Д. РАМИРЕЗ
Джеймс Д. ДЖЕКСОН (US)
Джеймс Д. ДЖЕКСОН
Рейнер Э. ТОМАС (US)
Рейнер Э. ТОМАС
Чарльз Э. ДЖИЛЕР (US)
Чарльз Э. ДЖИЛЕР
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Интел Корпорейшн (Us)
Интел Корпорейшн
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract

1. Вычислительная система, содержащая: ! системную плату; ! кристалл интегральной схемы, непосредственно закрепленный на системной плате; модуль, закрепленный на системной плате и перекрывающий, по меньшей мере, один участок непосредственно закрепляемого на системной плате кристалла; а также, по меньшей мере, один другой компонент, закрепленный на системной плате; ! которая включает, по меньшей мере, один электрический канал, соединяющий непосредственно закрепляемый на системной плате кристалл с модулем и, по меньшей мере, один электрический канал, соединяющий непосредственно закрепляемый на системной плате кристалл с указанным другим компонентом. ! 2. Система по п.1, в которой модуль содержит: ! подложку; и ! первый кристалл интегральной схемы (ИС), размещенный на подложке. ! 3. Система по п.2, дополнительно содержащая второй кристалл ИС, размещенный на подложке и расположенный над первым кристаллом ИС. ! 4. Система по п.3, в которой и первый кристалл ИС и второй кристалл ИС содержат запоминающее устройство. ! 5. Система по п.4, в которой модуль содержит полупроводниковый диск. ! 6. Система по п.5, в которой полупроводниковый диск включает контроллер памяти. ! 7. Система по п.2, в которой первый кристалл ИС расположен напротив непосредственно закрепляемого на плате кристалла. ! 8. Система по п.1, в которой непосредственно закрепляемый на плате кристалл содержит процессорную систему, модуль включает, по меньшей мере, один кристалл памяти и, по меньшей мере, один другой компонент содержит беспроводное устройство связи. ! 9. Система по п.8, дополнительно содержащая: ! графический дисплей, расположенный на системной плате, системн

Claims (17)

1. Вычислительная система, содержащая:
системную плату;
кристалл интегральной схемы, непосредственно закрепленный на системной плате; модуль, закрепленный на системной плате и перекрывающий, по меньшей мере, один участок непосредственно закрепляемого на системной плате кристалла; а также, по меньшей мере, один другой компонент, закрепленный на системной плате;
которая включает, по меньшей мере, один электрический канал, соединяющий непосредственно закрепляемый на системной плате кристалл с модулем и, по меньшей мере, один электрический канал, соединяющий непосредственно закрепляемый на системной плате кристалл с указанным другим компонентом.
2. Система по п.1, в которой модуль содержит:
подложку; и
первый кристалл интегральной схемы (ИС), размещенный на подложке.
3. Система по п.2, дополнительно содержащая второй кристалл ИС, размещенный на подложке и расположенный над первым кристаллом ИС.
4. Система по п.3, в которой и первый кристалл ИС и второй кристалл ИС содержат запоминающее устройство.
5. Система по п.4, в которой модуль содержит полупроводниковый диск.
6. Система по п.5, в которой полупроводниковый диск включает контроллер памяти.
7. Система по п.2, в которой первый кристалл ИС расположен напротив непосредственно закрепляемого на плате кристалла.
8. Система по п.1, в которой непосредственно закрепляемый на плате кристалл содержит процессорную систему, модуль включает, по меньшей мере, один кристалл памяти и, по меньшей мере, один другой компонент содержит беспроводное устройство связи.
9. Система по п.8, дополнительно содержащая:
графический дисплей, расположенный на системной плате, системная плата включает электрический канал, связывающий графический дисплей, по меньшей мере, с одним непосредственно закрепляемым на плате кристаллом и модулем; а также источник энергии, закрепленный на системной плате, причем системная плата соединяет непосредственно закрепляемый на системной плате кристалл и модуль с источником энергии.
10. Система по п.8, дополнительно содержащая устройство ввода данных, расположенное на системной плате.
11. Система по п.1, дополнительно содержащая подкладочный материал, расположенный между модулем и системной платой.
12. Способ, содержащий:
непосредственное крепление кристалла интегральной схемы (непосредственно закрепляемого на плате) к системной плате;
установку модуля с перекрытием, по меньшей мере, одного участка непосредственно закрепляемого на плате кристалла и крепление модуля к системной плате;
создание электрического канала, проходящего через системную плату между непосредственно закрепляемым на плате кристаллом и модулем;
а также
создание электрического канала, проходящего через системную плату между непосредственно закрепляемым на плате кристаллом и контактом, расположенным на системной плате, контакт предназначен для подключения другого компонента.
13. Способ по п.12, дополнительно содержащий электрическое подсоединение компонента к контакту.
14. Способ по п.13, дополнительно содержащий осуществление операции пайки расплавленного дозированного припоя для крепления модуля к системной плате, в котором компонент электрически соединяется с контактом при выполнении операции пайки.
15. Способ по п.12, дополнительно содержащий нанесение подкладочного материала в пространство между непосредственно закрепляемым на плате кристаллом и системной платой и в пространство между модулем и системной платой.
16. Способ по п.15, в котором подкладочный материал занимает пространство между непосредственно закрепляемым на плате кристаллом и модулем.
17. Способ по п.12, дополнительно содержащий выполнение одиночной операции пайки расплавленного дозированного припоя для крепления непосредственно закрепляемого на плате кристалла к системной плате и крепления модуля к системной плате.
RU2011113546/28A 2008-09-08 2009-08-27 Системная плата, включающая модуль над кристаллом, непосредственно закрепленным на системной плате RU2480862C2 (ru)

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