PT2723921E - Método para cobreagem - Google Patents
Método para cobreagem Download PDFInfo
- Publication number
- PT2723921E PT2723921E PT127193803T PT12719380T PT2723921E PT 2723921 E PT2723921 E PT 2723921E PT 127193803 T PT127193803 T PT 127193803T PT 12719380 T PT12719380 T PT 12719380T PT 2723921 E PT2723921 E PT 2723921E
- Authority
- PT
- Portugal
- Prior art keywords
- copper
- acid
- substrate
- aqueous
- additive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
- H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
- H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11171055A EP2537962A1 (en) | 2011-06-22 | 2011-06-22 | Method for copper plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT2723921E true PT2723921E (pt) | 2015-12-24 |
Family
ID=44583606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT127193803T PT2723921E (pt) | 2011-06-22 | 2012-05-07 | Método para cobreagem |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9506158B2 (enExample) |
| EP (2) | EP2537962A1 (enExample) |
| JP (1) | JP6012723B2 (enExample) |
| KR (1) | KR101899621B1 (enExample) |
| CN (1) | CN103703167B (enExample) |
| ES (1) | ES2555140T3 (enExample) |
| PT (1) | PT2723921E (enExample) |
| TW (1) | TWI560326B (enExample) |
| WO (1) | WO2012175249A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9598787B2 (en) | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| US20140262801A1 (en) * | 2013-03-14 | 2014-09-18 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| US9512529B2 (en) * | 2013-06-04 | 2016-12-06 | Rohm And Haas Electronic Materials Llc | Electroplating baths of silver and tin alloys |
| JP6585434B2 (ja) * | 2014-10-06 | 2019-10-02 | 株式会社荏原製作所 | めっき方法 |
| KR101898404B1 (ko) | 2014-12-17 | 2018-09-12 | 미쓰이 가가쿠 가부시키가이샤 | 기판 중간체, 관통 비어 전극 기판 및 관통 비어 전극 형성 방법 |
| KR102426521B1 (ko) | 2015-04-20 | 2022-07-27 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 전해 구리 도금 배쓰 조성물 및 그 사용 방법 |
| US20160312372A1 (en) * | 2015-04-27 | 2016-10-27 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits |
| JP6612525B2 (ja) * | 2015-05-13 | 2019-11-27 | 石原ケミカル株式会社 | 電気銅メッキ用の前処理液及び電気銅メッキ方法 |
| JP5907301B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 |
| JP5907302B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法 |
| JP6790075B2 (ja) | 2015-08-31 | 2020-11-25 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 水性銅めっき浴および基板上での銅または銅合金の析出方法 |
| EP3135709B1 (en) | 2015-08-31 | 2018-01-10 | ATOTECH Deutschland GmbH | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions |
| EP3141633B1 (en) | 2015-09-10 | 2018-05-02 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| US10508357B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| KR101733141B1 (ko) * | 2016-03-18 | 2017-05-08 | 한국생산기술연구원 | 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액 |
| CN109790638B (zh) | 2016-08-15 | 2021-06-18 | 德国艾托特克公司 | 用于电解镀铜的酸性水性组合物 |
| US10060034B2 (en) * | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| EP3360988B1 (en) | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| JP6948587B2 (ja) * | 2017-04-19 | 2021-10-13 | 石原ケミカル株式会社 | 低応力皮膜形成用の電気銅メッキ浴及び電気銅メッキ方法 |
| TWI626989B (zh) * | 2017-04-21 | 2018-06-21 | 國立中興大學 | 化學鍍銅的前處理方法及其使用的銅離子錯合物觸媒溶液及調節液 |
| EP3508620B1 (en) | 2018-01-09 | 2021-05-19 | ATOTECH Deutschland GmbH | Ureylene additive, its use and a preparation method therefor |
| KR102075729B1 (ko) * | 2018-02-19 | 2020-02-11 | 한국생산기술연구원 | 고평탄 구리 도금 전해 방법 |
| KR102104261B1 (ko) * | 2018-05-25 | 2020-04-24 | 한국생산기술연구원 | 고평탄 구리 도금 전해 방법 |
| EP3901331A1 (en) | 2020-04-23 | 2021-10-27 | ATOTECH Deutschland GmbH | Acidic aqueous composition for electrolytically depositing a copper deposit |
| CN111945192B (zh) * | 2020-08-11 | 2021-08-06 | 深圳市创智成功科技有限公司 | 用于hdi板和载板的盲孔填孔电镀铜溶液 |
| EP4032930B1 (en) | 2021-01-22 | 2023-08-30 | Atotech Deutschland GmbH & Co. KG | Biuret-based quaternized polymers and their use in metal or metal alloy plating baths |
| CN117661051A (zh) * | 2022-08-31 | 2024-03-08 | 华为技术有限公司 | 组合物及其应用、整平剂及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2758076A (en) | 1952-10-31 | 1956-08-07 | Metal & Thermit Corp | Bright acid copper plating |
| US3542655A (en) * | 1968-04-29 | 1970-11-24 | M & T Chemicals Inc | Electrodeposition of copper |
| DE3916207A1 (de) | 1989-05-18 | 1991-01-03 | Bayer Ag | Verfahren und neue zwischenprodukte zur herstellung von triazolon-derivaten |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| JP3498306B2 (ja) | 1999-09-16 | 2004-02-16 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
| US6863795B2 (en) | 2001-03-23 | 2005-03-08 | Interuniversitair Microelektronica Centrum (Imec) | Multi-step method for metal deposition |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| TW200401848A (en) | 2002-06-03 | 2004-02-01 | Shipley Co Llc | Leveler compounds |
| DE10313517B4 (de) * | 2003-03-25 | 2006-03-30 | Atotech Deutschland Gmbh | Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens |
| JP2006316350A (ja) * | 2005-04-13 | 2006-11-24 | Hitachi Chem Co Ltd | 無電解ニッケルめっき用前処理液および無電解ニッケルめっきの前処理方法 |
| EP1870495A1 (de) * | 2006-06-21 | 2007-12-26 | Atotech Deutschland Gmbh | Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen |
| JP2009041097A (ja) * | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
| US7780839B2 (en) * | 2007-12-12 | 2010-08-24 | Rohm And Haas Electronic Materials Llc | Electroplating bronze |
| EP2099268A1 (en) * | 2008-03-07 | 2009-09-09 | Atotech Deutschland Gmbh | Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate |
| CN101481812B (zh) * | 2008-12-31 | 2011-04-06 | 清华大学 | 一种集成电路铜布线电沉积用的电解液 |
| US8608931B2 (en) * | 2009-09-25 | 2013-12-17 | Rohm And Haas Electronic Materials Llc | Anti-displacement hard gold compositions |
| CN101824621A (zh) * | 2010-04-12 | 2010-09-08 | 海宁市科泰克金属表面技术有限公司 | 一种高性能铜、镍保护剂 |
| CN102277567B (zh) | 2011-07-26 | 2013-04-17 | 陕西师范大学 | 用于微孔填充的化学镀铜溶液 |
-
2011
- 2011-06-22 EP EP11171055A patent/EP2537962A1/en not_active Withdrawn
-
2012
- 2012-05-07 ES ES12719380.3T patent/ES2555140T3/es active Active
- 2012-05-07 CN CN201280030816.8A patent/CN103703167B/zh active Active
- 2012-05-07 KR KR1020137033919A patent/KR101899621B1/ko not_active Expired - Fee Related
- 2012-05-07 EP EP12719380.3A patent/EP2723921B1/en active Active
- 2012-05-07 PT PT127193803T patent/PT2723921E/pt unknown
- 2012-05-07 JP JP2014516238A patent/JP6012723B2/ja not_active Expired - Fee Related
- 2012-05-07 US US14/124,268 patent/US9506158B2/en active Active
- 2012-05-07 WO PCT/EP2012/058377 patent/WO2012175249A1/en not_active Ceased
- 2012-06-14 TW TW101121412A patent/TWI560326B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP2723921A1 (en) | 2014-04-30 |
| JP6012723B2 (ja) | 2016-10-25 |
| EP2723921B1 (en) | 2015-10-07 |
| US9506158B2 (en) | 2016-11-29 |
| KR101899621B1 (ko) | 2018-09-17 |
| CN103703167A (zh) | 2014-04-02 |
| US20140102910A1 (en) | 2014-04-17 |
| TW201313965A (zh) | 2013-04-01 |
| ES2555140T3 (es) | 2015-12-29 |
| TWI560326B (en) | 2016-12-01 |
| EP2537962A1 (en) | 2012-12-26 |
| CN103703167B (zh) | 2016-06-29 |
| WO2012175249A1 (en) | 2012-12-27 |
| JP2014523485A (ja) | 2014-09-11 |
| KR20140033447A (ko) | 2014-03-18 |
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