TWI560326B - Method for copper plating - Google Patents

Method for copper plating

Info

Publication number
TWI560326B
TWI560326B TW101121412A TW101121412A TWI560326B TW I560326 B TWI560326 B TW I560326B TW 101121412 A TW101121412 A TW 101121412A TW 101121412 A TW101121412 A TW 101121412A TW I560326 B TWI560326 B TW I560326B
Authority
TW
Taiwan
Prior art keywords
copper plating
plating
copper
Prior art date
Application number
TW101121412A
Other languages
English (en)
Other versions
TW201313965A (zh
Inventor
Dirk Rohde
Bernd Roelfs
Jun Higuchi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of TW201313965A publication Critical patent/TW201313965A/zh
Application granted granted Critical
Publication of TWI560326B publication Critical patent/TWI560326B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0733Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW101121412A 2011-06-22 2012-06-14 Method for copper plating TWI560326B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11171055A EP2537962A1 (en) 2011-06-22 2011-06-22 Method for copper plating

Publications (2)

Publication Number Publication Date
TW201313965A TW201313965A (zh) 2013-04-01
TWI560326B true TWI560326B (en) 2016-12-01

Family

ID=44583606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121412A TWI560326B (en) 2011-06-22 2012-06-14 Method for copper plating

Country Status (9)

Country Link
US (1) US9506158B2 (zh)
EP (2) EP2537962A1 (zh)
JP (1) JP6012723B2 (zh)
KR (1) KR101899621B1 (zh)
CN (1) CN103703167B (zh)
ES (1) ES2555140T3 (zh)
PT (1) PT2723921E (zh)
TW (1) TWI560326B (zh)
WO (1) WO2012175249A1 (zh)

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US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US20140262801A1 (en) * 2013-03-14 2014-09-18 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US9512529B2 (en) * 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US10950532B2 (en) 2014-12-17 2021-03-16 Mitsui Chemicals, Inc. Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
EP3286358B1 (en) 2015-04-20 2019-03-20 ATOTECH Deutschland GmbH Electrolytic copper plating bath compositions and a method for their use
US20160312372A1 (en) * 2015-04-27 2016-10-27 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits
JP6612525B2 (ja) * 2015-05-13 2019-11-27 石原ケミカル株式会社 電気銅メッキ用の前処理液及び電気銅メッキ方法
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP6790075B2 (ja) 2015-08-31 2020-11-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 水性銅めっき浴および基板上での銅または銅合金の析出方法
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3141633B1 (en) 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
KR101733141B1 (ko) * 2016-03-18 2017-05-08 한국생산기술연구원 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액
JP7064115B2 (ja) 2016-08-15 2022-05-10 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー. カー・ゲー 電解銅めっきのための酸性水性組成物
US10060034B2 (en) * 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
TWI626989B (zh) * 2017-04-21 2018-06-21 國立中興大學 化學鍍銅的前處理方法及其使用的銅離子錯合物觸媒溶液及調節液
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
KR102075729B1 (ko) * 2018-02-19 2020-02-11 한국생산기술연구원 고평탄 구리 도금 전해 방법
KR102104261B1 (ko) * 2018-05-25 2020-04-24 한국생산기술연구원 고평탄 구리 도금 전해 방법
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
CN111945192B (zh) * 2020-08-11 2021-08-06 深圳市创智成功科技有限公司 用于hdi板和载板的盲孔填孔电镀铜溶液
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN117661051A (zh) * 2022-08-31 2024-03-08 华为技术有限公司 组合物及其应用、整平剂及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
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US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
CN1764739A (zh) * 2003-03-25 2006-04-26 埃托特克德国有限公司 用于蚀刻铜表面的溶液和在铜表面上沉积金属的方法
TW200940751A (en) * 2007-12-12 2009-10-01 Rohm & Haas Elect Mat Electroplating bronze

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US2758076A (en) 1952-10-31 1956-08-07 Metal & Thermit Corp Bright acid copper plating
DE3916207A1 (de) * 1989-05-18 1991-01-03 Bayer Ag Verfahren und neue zwischenprodukte zur herstellung von triazolon-derivaten
JP2001073182A (ja) 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP3498306B2 (ja) 1999-09-16 2004-02-16 石原薬品株式会社 ボイドフリー銅メッキ方法
US6863795B2 (en) 2001-03-23 2005-03-08 Interuniversitair Microelektronica Centrum (Imec) Multi-step method for metal deposition
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
TW200401848A (en) * 2002-06-03 2004-02-01 Shipley Co Llc Leveler compounds
JP2006316350A (ja) * 2005-04-13 2006-11-24 Hitachi Chem Co Ltd 無電解ニッケルめっき用前処理液および無電解ニッケルめっきの前処理方法
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
EP2099268A1 (en) * 2008-03-07 2009-09-09 Atotech Deutschland Gmbh Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate
CN101481812B (zh) * 2008-12-31 2011-04-06 清华大学 一种集成电路铜布线电沉积用的电解液
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
CN101824621A (zh) 2010-04-12 2010-09-08 海宁市科泰克金属表面技术有限公司 一种高性能铜、镍保护剂
CN102277567B (zh) * 2011-07-26 2013-04-17 陕西师范大学 用于微孔填充的化学镀铜溶液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
CN1764739A (zh) * 2003-03-25 2006-04-26 埃托特克德国有限公司 用于蚀刻铜表面的溶液和在铜表面上沉积金属的方法
TW200940751A (en) * 2007-12-12 2009-10-01 Rohm & Haas Elect Mat Electroplating bronze

Also Published As

Publication number Publication date
EP2537962A1 (en) 2012-12-26
EP2723921B1 (en) 2015-10-07
CN103703167B (zh) 2016-06-29
KR20140033447A (ko) 2014-03-18
JP6012723B2 (ja) 2016-10-25
JP2014523485A (ja) 2014-09-11
TW201313965A (zh) 2013-04-01
KR101899621B1 (ko) 2018-09-17
US20140102910A1 (en) 2014-04-17
CN103703167A (zh) 2014-04-02
US9506158B2 (en) 2016-11-29
WO2012175249A1 (en) 2012-12-27
ES2555140T3 (es) 2015-12-29
EP2723921A1 (en) 2014-04-30
PT2723921E (pt) 2015-12-24

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