TWI560326B - Method for copper plating - Google Patents

Method for copper plating

Info

Publication number
TWI560326B
TWI560326B TW101121412A TW101121412A TWI560326B TW I560326 B TWI560326 B TW I560326B TW 101121412 A TW101121412 A TW 101121412A TW 101121412 A TW101121412 A TW 101121412A TW I560326 B TWI560326 B TW I560326B
Authority
TW
Taiwan
Prior art keywords
copper plating
plating
copper
Prior art date
Application number
TW101121412A
Other languages
English (en)
Chinese (zh)
Other versions
TW201313965A (zh
Inventor
Dirk Rohde
Bernd Roelfs
Jun Higuchi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of TW201313965A publication Critical patent/TW201313965A/zh
Application granted granted Critical
Publication of TWI560326B publication Critical patent/TWI560326B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW101121412A 2011-06-22 2012-06-14 Method for copper plating TWI560326B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11171055A EP2537962A1 (en) 2011-06-22 2011-06-22 Method for copper plating

Publications (2)

Publication Number Publication Date
TW201313965A TW201313965A (zh) 2013-04-01
TWI560326B true TWI560326B (en) 2016-12-01

Family

ID=44583606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121412A TWI560326B (en) 2011-06-22 2012-06-14 Method for copper plating

Country Status (9)

Country Link
US (1) US9506158B2 (enExample)
EP (2) EP2537962A1 (enExample)
JP (1) JP6012723B2 (enExample)
KR (1) KR101899621B1 (enExample)
CN (1) CN103703167B (enExample)
ES (1) ES2555140T3 (enExample)
PT (1) PT2723921E (enExample)
TW (1) TWI560326B (enExample)
WO (1) WO2012175249A1 (enExample)

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* Cited by examiner, † Cited by third party
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US9598787B2 (en) * 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US20140262801A1 (en) * 2013-03-14 2014-09-18 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US9512529B2 (en) * 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US10950532B2 (en) 2014-12-17 2021-03-16 Mitsui Chemicals, Inc. Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
EP3286358B1 (en) 2015-04-20 2019-03-20 ATOTECH Deutschland GmbH Electrolytic copper plating bath compositions and a method for their use
US20160312372A1 (en) * 2015-04-27 2016-10-27 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits
JP6612525B2 (ja) * 2015-05-13 2019-11-27 石原ケミカル株式会社 電気銅メッキ用の前処理液及び電気銅メッキ方法
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US10767275B2 (en) 2015-08-31 2020-09-08 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
EP3141633B1 (en) 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
KR101733141B1 (ko) * 2016-03-18 2017-05-08 한국생산기술연구원 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
US10060034B2 (en) * 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
JP6948587B2 (ja) * 2017-04-19 2021-10-13 石原ケミカル株式会社 低応力皮膜形成用の電気銅メッキ浴及び電気銅メッキ方法
TWI626989B (zh) * 2017-04-21 2018-06-21 國立中興大學 化學鍍銅的前處理方法及其使用的銅離子錯合物觸媒溶液及調節液
ES2881029T3 (es) 2018-01-09 2021-11-26 Atotech Deutschland Gmbh Aditivo de ureileno, su uso y un método para su preparación
KR102075729B1 (ko) * 2018-02-19 2020-02-11 한국생산기술연구원 고평탄 구리 도금 전해 방법
KR102104261B1 (ko) * 2018-05-25 2020-04-24 한국생산기술연구원 고평탄 구리 도금 전해 방법
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
CN111945192B (zh) * 2020-08-11 2021-08-06 深圳市创智成功科技有限公司 用于hdi板和载板的盲孔填孔电镀铜溶液
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN117661051A (zh) * 2022-08-31 2024-03-08 华为技术有限公司 组合物及其应用、整平剂及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
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US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
CN1764739A (zh) * 2003-03-25 2006-04-26 埃托特克德国有限公司 用于蚀刻铜表面的溶液和在铜表面上沉积金属的方法
TW200940751A (en) * 2007-12-12 2009-10-01 Rohm & Haas Elect Mat Electroplating bronze

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US6863795B2 (en) 2001-03-23 2005-03-08 Interuniversitair Microelektronica Centrum (Imec) Multi-step method for metal deposition
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
KR20030094098A (ko) 2002-06-03 2003-12-11 쉬플리 캄파니, 엘.엘.씨. 평탄화제 화합물
JP2006316350A (ja) * 2005-04-13 2006-11-24 Hitachi Chem Co Ltd 無電解ニッケルめっき用前処理液および無電解ニッケルめっきの前処理方法
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
EP2099268A1 (en) * 2008-03-07 2009-09-09 Atotech Deutschland Gmbh Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate
CN101481812B (zh) * 2008-12-31 2011-04-06 清华大学 一种集成电路铜布线电沉积用的电解液
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
CN1764739A (zh) * 2003-03-25 2006-04-26 埃托特克德国有限公司 用于蚀刻铜表面的溶液和在铜表面上沉积金属的方法
TW200940751A (en) * 2007-12-12 2009-10-01 Rohm & Haas Elect Mat Electroplating bronze

Also Published As

Publication number Publication date
CN103703167A (zh) 2014-04-02
JP6012723B2 (ja) 2016-10-25
US20140102910A1 (en) 2014-04-17
KR20140033447A (ko) 2014-03-18
EP2723921A1 (en) 2014-04-30
CN103703167B (zh) 2016-06-29
EP2537962A1 (en) 2012-12-26
PT2723921E (pt) 2015-12-24
JP2014523485A (ja) 2014-09-11
EP2723921B1 (en) 2015-10-07
TW201313965A (zh) 2013-04-01
ES2555140T3 (es) 2015-12-29
WO2012175249A1 (en) 2012-12-27
US9506158B2 (en) 2016-11-29
KR101899621B1 (ko) 2018-09-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees