PH12014000344B1 - Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board - Google Patents

Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board

Info

Publication number
PH12014000344B1
PH12014000344B1 PH12014000344A PH12014000344A PH12014000344B1 PH 12014000344 B1 PH12014000344 B1 PH 12014000344B1 PH 12014000344 A PH12014000344 A PH 12014000344A PH 12014000344 A PH12014000344 A PH 12014000344A PH 12014000344 B1 PH12014000344 B1 PH 12014000344B1
Authority
PH
Philippines
Prior art keywords
copper foil
wiring board
treated
laminate
carrier
Prior art date
Application number
PH12014000344A
Other languages
English (en)
Other versions
PH12014000344A1 (en
Inventor
Terusama Moriyama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12014000344A1 publication Critical patent/PH12014000344A1/en
Publication of PH12014000344B1 publication Critical patent/PH12014000344B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
PH12014000344A 2013-11-29 2014-11-28 Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board PH12014000344B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248691A JP5710737B1 (ja) 2013-11-29 2013-11-29 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器

Publications (2)

Publication Number Publication Date
PH12014000344A1 PH12014000344A1 (en) 2016-06-06
PH12014000344B1 true PH12014000344B1 (en) 2016-06-06

Family

ID=53277197

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014000344A PH12014000344B1 (en) 2013-11-29 2014-11-28 Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board

Country Status (5)

Country Link
JP (1) JP5710737B1 (ja)
KR (2) KR20150062988A (ja)
CN (1) CN104717831B (ja)
PH (1) PH12014000344B1 (ja)
TW (1) TWI619409B (ja)

Families Citing this family (21)

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JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
KR20170037750A (ko) * 2015-09-25 2017-04-05 일진머티리얼즈 주식회사 표면처리동박 및 그의 제조방법
JP6294862B2 (ja) * 2015-12-09 2018-03-14 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
US10448507B2 (en) 2016-01-15 2019-10-15 Jx Nippon Mining & Metals Corporation Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
KR20180047897A (ko) * 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 표면처리 전해동박, 이의 제조방법, 및 이의 용도
JP6462961B2 (ja) * 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
JP7002200B2 (ja) * 2017-02-07 2022-01-20 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7033905B2 (ja) 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110832120B (zh) * 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
JP6529684B2 (ja) * 2017-03-30 2019-06-12 古河電気工業株式会社 表面処理銅箔及びこれを用いた銅張積層板
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
KR102180926B1 (ko) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 우수한 작업성 및 충방전 특성을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
CN111954597B (zh) * 2018-04-10 2023-03-21 Dic株式会社 复合结构体及其制造方法
CN112041485B (zh) 2018-04-27 2023-07-14 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板及印刷配线板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111867239B (zh) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 覆铜层压板和印制电路板
US12104265B2 (en) 2021-03-29 2024-10-01 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper-clad laminate and printed wiring board
WO2022209989A1 (ja) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN113811093A (zh) * 2021-08-09 2021-12-17 广州方邦电子股份有限公司 金属箔、覆铜层叠板、线路板及线路板的制备方法

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JP3662404B2 (ja) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置
TW499508B (en) * 1999-12-10 2002-08-21 Nippon Denkai Kk Roughening treated copper foil and producing method therefor
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP3622680B2 (ja) * 2001-02-22 2005-02-23 住友金属工業株式会社 ブラウン管のマスクフレーム用フェライト系ステンレス連続焼鈍鋼材およびその製造方法
CN1217564C (zh) * 2001-05-14 2005-08-31 日本电解株式会社 经糙化处理的铜箔及其制造方法
JP2002356789A (ja) * 2001-05-30 2002-12-13 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP2003013156A (ja) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP2004238647A (ja) * 2003-02-04 2004-08-26 Furukawa Techno Research Kk 平滑化銅箔とその製造方法
JP4172704B2 (ja) * 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TWI513388B (zh) * 2008-09-05 2015-12-11 Furukawa Electric Co Ltd A very thin copper foil with a carrier, and a laminated plate or printed circuit board with copper foil
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP5794806B2 (ja) * 2011-03-30 2015-10-14 古河電気工業株式会社 表面処理銅箔、および、該表面処理銅箔を用いた銅張積層基板、並びにプリント配線基板
JP5871426B2 (ja) * 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
TWI503062B (zh) * 2012-05-21 2015-10-01 Jx Nippon Mining & Metals Corp Surface treatment of copper foil and the use of its laminated board, printed wiring board, electronic equipment and manufacturing printed wiring board method

Also Published As

Publication number Publication date
CN104717831A (zh) 2015-06-17
JP2015105421A (ja) 2015-06-08
KR20150062988A (ko) 2015-06-08
TWI619409B (zh) 2018-03-21
PH12014000344A1 (en) 2016-06-06
CN104717831B (zh) 2018-01-23
TW201524280A (zh) 2015-06-16
KR20170046632A (ko) 2017-05-02
JP5710737B1 (ja) 2015-04-30

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