MY182550A - Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated copper foil, and method for fabricating printed wiring board - Google Patents
Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated copper foil, and method for fabricating printed wiring boardInfo
- Publication number
- MY182550A MY182550A MYPI2015701715A MYPI2015701715A MY182550A MY 182550 A MY182550 A MY 182550A MY PI2015701715 A MYPI2015701715 A MY PI2015701715A MY PI2015701715 A MYPI2015701715 A MY PI2015701715A MY 182550 A MY182550 A MY 182550A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- treated
- treated copper
- wiring board
- printed wiring
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Provided is a surface-treated copper foil which has a good peel strength and well suppresses transmission loss even when being used for a high-frequency circuit substrate. The surface-treated copper foil according to the present invention is a surface-treated copper foil having, in order, a copper foil, a metal layer containing one or more elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface-treated layer formed from a chromium oxide, wherein a total amount of the elements selected from the group consisting of Ni, Co, Zn, w, Mo, and Cr deposited in the metal layer is 200 to 2,000 ?g/dm2, and when the surface-treated copper foil is heat-treated at 250?C x 10 minutes and thereafter soaked in a nitric acid bath at a concentration of 20% by mass at a temperature of 25?C for 30 seconds with only a surface of the surface-treated layer exposed, an amount of copper eluted in the nitric acid bath is 0.0030 g/25 cm2 or less. Figure 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014110662 | 2014-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY182550A true MY182550A (en) | 2021-01-25 |
Family
ID=54872922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2015701715A MY182550A (en) | 2014-05-28 | 2015-05-27 | Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated copper foil, and method for fabricating printed wiring board |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6293093B2 (en) |
| KR (1) | KR101833590B1 (en) |
| CN (1) | CN105323958B (en) |
| MY (1) | MY182550A (en) |
| PH (1) | PH12015000180B1 (en) |
| TW (1) | TWI616122B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016194112A (en) * | 2015-03-31 | 2016-11-17 | Ｊｘ金属株式会社 | Metal foil with carrier, laminate, printed wiring board, electronic device, manufacturing method of metal foil with carrier and manufacturing method of printed wiring board |
| JP6697759B2 (en) * | 2016-02-05 | 2020-05-27 | パナソニックＩｐマネジメント株式会社 | Metal-clad laminate, method of manufacturing metal-clad laminate, metal member with resin, method of manufacturing metal member with resin, wiring board, and method of manufacturing wiring board |
| JP6836580B2 (en) * | 2016-02-18 | 2021-03-03 | 三井金属鉱業株式会社 | Copper foil for manufacturing printed wiring boards, copper foil with carriers and copper-clad laminates, and methods for manufacturing printed wiring boards using them. |
| CN105722339A (en) * | 2016-02-29 | 2016-06-29 | 江西合力泰科技有限公司 | Metal ring mounting method for biological recognition module |
| CN105704948B (en) * | 2016-03-28 | 2018-05-29 | 上海美维电子有限公司 | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board |
| US10820414B2 (en) * | 2016-12-05 | 2020-10-27 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
| JP7055049B2 (en) * | 2017-03-31 | 2022-04-15 | Ｊｘ金属株式会社 | Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards. |
| JP6413039B1 (en) * | 2018-03-29 | 2018-10-24 | Ｊｘ金属株式会社 | Surface treated copper foil and copper clad laminate |
| EP3786317A4 (en) * | 2018-04-27 | 2022-04-20 | JX Nippon Mining & Metals Corporation | Surface-treated copper foil, copper clad laminate, and printed wiring board |
| US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| KR102554287B1 (en) * | 2019-03-26 | 2023-07-12 | 미쓰이금속광업주식회사 | Manufacturing method of printed wiring board |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4107004B2 (en) | 2002-07-30 | 2008-06-25 | 日立電線株式会社 | Negative electrode current collector for lithium ion secondary battery and method for producing negative electrode current collector for lithium ion secondary battery |
| JP2005063764A (en) | 2003-08-08 | 2005-03-10 | Hitachi Cable Ltd | Copper foil for lithium ion secondary battery, and its manufacturing method |
| US7495182B2 (en) | 2004-01-30 | 2009-02-24 | Dai Nippon Printing Co., Ltd. | Electromagnetic wave shielding sheet and process for producing the same |
| JP4626390B2 (en) * | 2005-05-16 | 2011-02-09 | 日立電線株式会社 | Copper foil for printed wiring boards in consideration of environmental protection |
| TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
| JP4961023B2 (en) * | 2007-12-21 | 2012-06-27 | Ｊｘ日鉱日石金属株式会社 | Copper foil for printed wiring boards |
| JP4907580B2 (en) * | 2008-03-25 | 2012-03-28 | 新日鐵化学株式会社 | Flexible copper clad laminate |
| WO2010010893A1 (en) * | 2008-07-22 | 2010-01-28 | 古河電気工業株式会社 | Surface-treated copper foil and copper-clad laminate |
| TWI462826B (en) * | 2008-07-22 | 2014-12-01 | Furukawa Electric Co Ltd | Flexible copper clad sheet |
| US20130306486A1 (en) | 2010-06-30 | 2013-11-21 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing copper foil for negative electrode current collector |
| KR20140054435A (en) * | 2011-09-30 | 2014-05-08 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Copper foil excellent in adhesion with resin, method for manufacturing same, and printed wiring board or battery negative electrode material using electrolytic copper foil |
| JP5228130B1 (en) | 2012-08-08 | 2013-07-03 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
| JP6031332B2 (en) * | 2012-11-13 | 2016-11-24 | Ｊｘ金属株式会社 | Surface-treated copper foil, laminate using the same, printed wiring board, electronic component, and method for producing surface-treated copper foil |
| JP5364838B1 (en) | 2012-11-30 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
-
2015
- 2015-04-30 TW TW104113870A patent/TWI616122B/en active
- 2015-05-27 MY MYPI2015701715A patent/MY182550A/en unknown
- 2015-05-27 KR KR1020150074145A patent/KR101833590B1/en active IP Right Grant
- 2015-05-28 JP JP2015108922A patent/JP6293093B2/en active Active
- 2015-05-28 PH PH12015000180A patent/PH12015000180B1/en unknown
- 2015-05-28 CN CN201510284347.8A patent/CN105323958B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201547335A (en) | 2015-12-16 |
| JP2016006227A (en) | 2016-01-14 |
| KR20150137023A (en) | 2015-12-08 |
| CN105323958A (en) | 2016-02-10 |
| CN105323958B (en) | 2018-04-20 |
| JP6293093B2 (en) | 2018-03-14 |
| PH12015000180A1 (en) | 2017-01-16 |
| TWI616122B (en) | 2018-02-21 |
| KR101833590B1 (en) | 2018-02-28 |
| PH12015000180B1 (en) | 2017-01-16 |
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