JP2015042785A5 - - Google Patents
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- JP2015042785A5 JP2015042785A5 JP2014193151A JP2014193151A JP2015042785A5 JP 2015042785 A5 JP2015042785 A5 JP 2015042785A5 JP 2014193151 A JP2014193151 A JP 2014193151A JP 2014193151 A JP2014193151 A JP 2014193151A JP 2015042785 A5 JP2015042785 A5 JP 2015042785A5
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- copper foil
- carrier
- treated
- layer
- resin
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- 239000011889 copper foil Substances 0.000 claims 138
- 239000010410 layer Substances 0.000 claims 94
- 239000000969 carrier Substances 0.000 claims 62
- 239000011347 resin Substances 0.000 claims 57
- 229920005989 resin Polymers 0.000 claims 57
- 239000000758 substrate Substances 0.000 claims 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 29
- 229910052802 copper Inorganic materials 0.000 claims 29
- 239000010949 copper Substances 0.000 claims 29
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000000654 additive Substances 0.000 claims 10
- 239000011888 foil Substances 0.000 claims 10
- 238000010030 laminating Methods 0.000 claims 9
- 239000000463 material Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 230000000996 additive Effects 0.000 claims 4
- 239000002335 surface treatment layer Substances 0.000 claims 4
- 230000003746 surface roughness Effects 0.000 claims 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 2
- 230000001808 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000007788 roughening Methods 0.000 claims 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- 229910000077 silane Inorganic materials 0.000 claims 2
- 239000004840 adhesive resin Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 1
- 229910052785 arsenic Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052803 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Claims (37)
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の面粗さSzが1〜5μmとなる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the surface roughness Sz of the surface of the resin substrate on the copper foil removal side is 1 to 1. A surface-treated copper foil of 5 μm.
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の三次元表面積Bと二次元表面積Aとの比B/Aが1.01〜1.5となる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the resin substrate for a printed wiring board from the surface-treated layer side and the surface-treated copper foil is removed, the three-dimensional surface area B and the two-dimensional surface of the copper foil removal side surface of the resin substrate The surface-treated copper foil whose ratio B / A with the surface area A will be 1.01-1.5.
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の黒色面積率が10〜50%であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が0.03〜1.0μmとなる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the black area ratio of the surface of the resin substrate on the copper foil removal side is 10 to 50. %, And the diameter average value of the holes on the copper foil removal side surface of the resin base material is 0.03 to 1.0 μm.
前記表面処理銅箔を、表面処理層側から絶縁基板に積層する工程、
前記絶縁基板上の表面処理銅箔を除去する工程、
前記表面処理銅箔を除去した絶縁基板の表面に回路を形成する工程
を含むプリント配線板の製造方法。 A step of preparing the surface-treated copper foil and the insulating substrate according to any one of claims 1 to 19 ,
Laminating the surface-treated copper foil on the insulating substrate from the surface-treated layer side,
Removing the surface-treated copper foil on the insulating substrate;
A printed wiring board manufacturing method including a step of forming a circuit on a surface of an insulating substrate from which the surface-treated copper foil is removed.
前記キャリア付銅箔を極薄銅層側から絶縁基板に積層する工程、
前記キャリア付銅箔と絶縁基板とを積層した後に、前記キャリア付銅箔のキャリアを剥がす工程、
前記キャリアを剥がした後の絶縁基板上の極薄銅層を除去する工程、
前記極薄銅層を除去した絶縁基板の表面に回路を形成する工程
を含むプリント配線板の製造方法。 Preparing a copper foil with a carrier according to claim 20 and an insulating substrate;
Laminating the copper foil with carrier on the insulating substrate from the ultrathin copper layer side,
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Removing the ultrathin copper layer on the insulating substrate after peeling off the carrier;
A printed wiring board manufacturing method including a step of forming a circuit on a surface of an insulating substrate from which the ultrathin copper layer is removed.
前記表面処理銅箔を、表面処理層側から絶縁基板に積層して銅張積層板を形成し、
その後、セミアディティブ法、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって、回路を形成する工程を含むプリント配線板の製造方法。 A step of preparing the surface-treated copper foil and the insulating substrate according to any one of claims 1 to 19 ,
The surface-treated copper foil is laminated on an insulating substrate from the surface-treated layer side to form a copper-clad laminate,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.
前記キャリア付銅箔を極薄銅層側から絶縁基板に積層する工程、
前記キャリア付銅箔と絶縁基板とを積層した後に、前記キャリア付銅箔のキャリアを剥がす工程を経て銅張積層板を形成し、
その後、セミアディティブ法、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって、回路を形成する工程を含むプリント配線板の製造方法。 Preparing a copper foil with a carrier according to claim 20 and an insulating substrate;
Laminating the copper foil with carrier on the insulating substrate from the ultrathin copper layer side,
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.
前記回路が埋没するように前記金属箔表面に樹脂層を形成する工程、
請求項1〜19のいずれか一項に記載の表面処理銅箔を、表面処理層側から前記樹脂層に積層する工程、
前記樹脂層上の表面処理銅箔を除去する工程、
前記表面処理銅箔を除去した樹脂層の表面に回路を形成する工程、及び、
前記金属箔を除去することで、前記金属箔表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Preparing a metal foil on which a circuit is formed;
Forming a resin layer on the surface of the metal foil so that the circuit is buried;
The step of laminating the surface-treated copper foil according to any one of claims 1 to 19 on the resin layer from the surface-treated layer side,
Removing the surface-treated copper foil on the resin layer;
Forming a circuit on the surface of the resin layer from which the surface-treated copper foil is removed; and
A method for producing a printed wiring board, comprising a step of exposing a circuit formed on the surface of the metal foil and embedded in the resin layer by removing the metal foil.
前記回路が埋没するように前記第1のキャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
第2のキャリア付銅箔を準備し、前記第2のキャリア付銅箔の極薄銅層側から前記樹脂層に積層する工程、
前記第2のキャリア付銅箔を前記樹脂層に積層した後に、前記第2のキャリア付銅箔のキャリアを剥がす工程、
前記第2のキャリア付銅箔のキャリアを剥がした後の樹脂層上の極薄銅層を除去する工程、
前記極薄銅層を除去した樹脂層の表面に回路を形成する工程、
前記樹脂層上に回路を形成した後に、前記第1のキャリア付銅箔のキャリアを剥離させる工程、及び、
前記第1のキャリア付銅箔のキャリアを剥離させた後に、前記第1のキャリア付銅箔の極薄銅層を除去することで、前記第1のキャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 The step of forming a circuit on the surface of the ultrathin copper layer of the first copper foil with carrier, wherein the copper foil with carrier according to claim 20 is a first copper foil with carrier.
Forming a resin layer on the ultrathin copper layer side surface of the first carrier-attached copper foil so that the circuit is buried;
Preparing a second copper foil with a carrier, and laminating the resin layer from the ultrathin copper layer side of the second copper foil with a carrier;
A step of peeling the carrier of the second copper foil with carrier after laminating the second copper foil with carrier on the resin layer;
Removing the ultrathin copper layer on the resin layer after peeling the carrier of the copper foil with the second carrier;
Forming a circuit on the surface of the resin layer from which the ultrathin copper layer has been removed,
After forming a circuit on the resin layer, the step of peeling the carrier of the first copper foil with carrier, and
After peeling the carrier of the first copper foil with carrier, the ultra thin copper layer side surface of the first copper foil with carrier is removed by removing the ultra thin copper layer of the first copper foil with carrier. A method for producing a printed wiring board, comprising the step of exposing a circuit buried in the resin layer formed in step 1).
前記回路が埋没するように前記金属箔表面に樹脂層を形成する工程、
請求項1〜19のいずれか一項に記載の表面処理銅箔を、表面処理層側から樹脂層に積層し、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって前記樹脂層上に回路を形成する工程、及び、
前記金属箔を除去することで、前記金属箔表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Preparing a metal foil on which a circuit is formed;
Forming a resin layer on the surface of the metal foil so that the circuit is buried;
The surface-treated copper foil according to any one of claims 1 to 19 is laminated on a resin layer from the surface-treated layer side, and the resin is obtained by any one of a subtractive method, a partly additive method, or a modified semi-additive method. Forming a circuit on the layer; and
A method for producing a printed wiring board, comprising a step of exposing a circuit formed on the surface of the metal foil and embedded in the resin layer by removing the metal foil.
前記回路が埋没するように前記第1のキャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
第2のキャリア付銅箔を準備し、前記第2のキャリア付銅箔の極薄銅層側から前記樹脂層に積層して前記第2のキャリア付銅箔のキャリアを剥がし、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって前記樹脂層上に回路を形成する工程、
前記樹脂層上に回路を形成した後に、前記第1のキャリア付銅箔のキャリアを剥離させる工程、及び、
前記第1のキャリア付銅箔のキャリアを剥離させた後に、前記第1のキャリア付銅箔の極薄銅層を除去することで、前記第1のキャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 The step of forming a circuit on the surface of the ultrathin copper layer of the first copper foil with carrier, wherein the copper foil with carrier according to claim 20 is a first copper foil with carrier.
Forming a resin layer on the ultrathin copper layer side surface of the first carrier-attached copper foil so that the circuit is buried;
Preparing a second copper foil with carrier, laminating on the resin layer from the ultra-thin copper layer side of the second copper foil with carrier, peeling off the carrier of the second copper foil with carrier, subtractive method, Forming a circuit on the resin layer by any one of a partial additive method or a modified semi-additive method;
After forming a circuit on the resin layer, the step of peeling the carrier of the first copper foil with carrier, and
After peeling the carrier of the first copper foil with carrier, the ultra thin copper layer side surface of the first copper foil with carrier is removed by removing the ultra thin copper layer of the first copper foil with carrier. A method for producing a printed wiring board, comprising the step of exposing a circuit buried in the resin layer formed in step 1).
前記回路が埋没するように前記キャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
前記キャリア付銅箔のキャリアを剥離させる工程、及び、
前記キャリア付銅箔のキャリアを剥離させた後に、前記キャリア付銅箔の極薄銅層を除去することで、前記キャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Forming a circuit on the ultrathin copper layer side surface of the copper foil with carrier according to claim 20 ;
Forming a resin layer on the ultrathin copper layer side surface of the carrier-attached copper foil so that the circuit is buried;
Peeling the carrier of the copper foil with carrier, and
After peeling the carrier of the copper foil with carrier, by removing the ultra thin copper layer of the copper foil with carrier, formed on the ultra thin copper layer side surface of the copper foil with carrier, embedded in the resin layer A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected.
前記回路が埋没するように前記キャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
前記樹脂層の表面に回路を形成する工程、
前記キャリア付銅箔のキャリアを剥離させる工程、及び、
前記キャリア付銅箔のキャリアを剥離させた後に、前記キャリア付銅箔の極薄銅層を除去することで、前記キャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Forming a circuit on the ultrathin copper layer side surface of the copper foil with carrier according to claim 20 ;
Forming a resin layer on the ultrathin copper layer side surface of the carrier-attached copper foil so that the circuit is buried;
Forming a circuit on the surface of the resin layer;
Peeling the carrier of the copper foil with carrier, and
After peeling the carrier of the copper foil with carrier, by removing the ultra thin copper layer of the copper foil with carrier, formed on the ultra thin copper layer side surface of the copper foil with carrier, embedded in the resin layer A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected.
Priority Applications (1)
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JP2014193151A JP5963824B2 (en) | 2013-07-23 | 2014-09-22 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method, and printed wiring board manufacturing method |
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JP2013153014 | 2013-07-23 | ||
JP2013153014 | 2013-07-23 | ||
JP2014193151A JP5963824B2 (en) | 2013-07-23 | 2014-09-22 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method, and printed wiring board manufacturing method |
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JP2015042785A JP2015042785A (en) | 2015-03-05 |
JP2015042785A5 true JP2015042785A5 (en) | 2016-01-07 |
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JP2013160827A Active JP6166614B2 (en) | 2013-07-23 | 2013-08-01 | Surface-treated copper foil, copper foil with carrier, substrate, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method |
JP2014193151A Active JP5963824B2 (en) | 2013-07-23 | 2014-09-22 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method, and printed wiring board manufacturing method |
JP2016064770A Active JP6227038B2 (en) | 2013-07-23 | 2016-03-28 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method |
JP2017000790A Active JP6254306B2 (en) | 2013-07-23 | 2017-01-05 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method |
JP2017113835A Pending JP2017172048A (en) | 2013-07-23 | 2017-06-08 | Surface treated copper foil, copper foil with carrier, manufacturing method of substrate, manufacturing method of printed wiring board, manufacturing method of printed circuit board and manufacturing method of copper clad laminate sheet |
JP2017113836A Active JP6475781B2 (en) | 2013-07-23 | 2017-06-08 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate |
JP2019073044A Withdrawn JP2019163541A (en) | 2013-07-23 | 2019-04-05 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, and copper clad laminate manufacturing method |
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JP2017000790A Active JP6254306B2 (en) | 2013-07-23 | 2017-01-05 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method |
JP2017113835A Pending JP2017172048A (en) | 2013-07-23 | 2017-06-08 | Surface treated copper foil, copper foil with carrier, manufacturing method of substrate, manufacturing method of printed wiring board, manufacturing method of printed circuit board and manufacturing method of copper clad laminate sheet |
JP2017113836A Active JP6475781B2 (en) | 2013-07-23 | 2017-06-08 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate |
JP2019073044A Withdrawn JP2019163541A (en) | 2013-07-23 | 2019-04-05 | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, and copper clad laminate manufacturing method |
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MY168616A (en) | 2013-07-23 | 2018-11-14 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
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2013
- 2013-08-01 JP JP2013160827A patent/JP6166614B2/en active Active
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2014
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2016
- 2016-03-28 JP JP2016064770A patent/JP6227038B2/en active Active
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2017
- 2017-01-05 JP JP2017000790A patent/JP6254306B2/en active Active
- 2017-06-08 JP JP2017113835A patent/JP2017172048A/en active Pending
- 2017-06-08 JP JP2017113836A patent/JP6475781B2/en active Active
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2019
- 2019-04-05 JP JP2019073044A patent/JP2019163541A/en not_active Withdrawn
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