JP2015042785A5 - - Google Patents

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JP2015042785A5
JP2015042785A5 JP2014193151A JP2014193151A JP2015042785A5 JP 2015042785 A5 JP2015042785 A5 JP 2015042785A5 JP 2014193151 A JP2014193151 A JP 2014193151A JP 2014193151 A JP2014193151 A JP 2014193151A JP 2015042785 A5 JP2015042785 A5 JP 2015042785A5
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copper foil
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treated
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resin
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銅箔上に表面処理層が形成された表面処理銅箔であり、前記表面処理層表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０５〜１．８である表面処理銅箔であり、
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の面粗さＳｚが１〜５μｍとなる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the surface roughness Sz of the surface of the resin substrate on the copper foil removal side is 1 to 1. A surface-treated copper foil of 5 μm. 銅箔上に表面処理層が形成された表面処理銅箔であり、前記表面処理層表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０５〜１．８である表面処理銅箔であり、
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０１〜１．５となる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the resin substrate for a printed wiring board from the surface-treated layer side and the surface-treated copper foil is removed, the three-dimensional surface area B and the two-dimensional surface of the copper foil removal side surface of the resin substrate The surface-treated copper foil whose ratio B / A with the surface area A will be 1.01-1.5. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の面粗さＳｚが１〜５μｍとなる請求項２に記載の表面処理銅箔。   When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the surface roughness Sz of the surface of the resin substrate on the copper foil removal side is 1 to 1. The surface-treated copper foil according to claim 2 which becomes 5 micrometers. 銅箔上に表面処理層が形成された表面処理銅箔であり、前記表面処理層表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０５〜１．８である表面処理銅箔であり、
表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍとなる表面処理銅箔。 A surface-treated copper foil in which a surface-treated layer is formed on a copper foil, and the ratio B / A of the three-dimensional surface area B to the two-dimensional surface area A of the surface-treated layer surface is 1.05 to 1.8 Treated copper foil,
When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the black area ratio of the surface of the resin substrate on the copper foil removal side is 10 to 50. %, And the diameter average value of the holes on the copper foil removal side surface of the resin base material is 0.03 to 1.0 μm. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍとなる請求項１〜３のいずれか一項に記載の表面処理銅箔。   When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the black area ratio of the surface of the resin substrate on the copper foil removal side is 10 to 50. The surface-treated copper foil according to any one of claims 1 to 3, wherein the average diameter of the holes on the copper foil removal side surface of the resin base material is 0.03 to 1.0 µm. . 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の面粗さＳｚが１〜５μｍとなる表面処理銅箔。   When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the surface roughness Sz of the surface of the resin substrate on the copper foil removal side is 1 to 1. A surface-treated copper foil of 5 μm. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０１〜１．５となる請求項６に記載の表面処理銅箔。   When the surface-treated copper foil is bonded to the resin substrate for a printed wiring board from the surface-treated layer side and the surface-treated copper foil is removed, the three-dimensional surface area B and the two-dimensional surface of the copper foil removal side surface of the resin substrate The surface-treated copper foil according to claim 6, wherein the ratio B / A to the surface area A is 1.01 to 1.5. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍとなる請求項６又は７に記載の表面処理銅箔。   When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the black area ratio of the surface of the resin substrate on the copper foil removal side is 10 to 50. The surface-treated copper foil according to claim 6 or 7, wherein the average diameter of the holes on the copper foil removal side surface of the resin base material is 0.03 to 1.0 µm. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍとなる表面処理銅箔。When the surface-treated copper foil is bonded to the printed wiring board resin substrate from the surface-treated layer side and the surface-treated copper foil is removed, the black area ratio of the surface of the resin substrate on the copper foil removal side is 10 to 50. %, And the diameter average value of the holes on the copper foil removal side surface of the resin base material is 0.03 to 1.0 μm. 表面処理銅箔を表面処理層側からプリント配線板用樹脂基材に貼り合わせ、前記表面処理銅箔を除去したとき、前記樹脂基材の前記銅箔除去側表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０１〜１．５となり、前記樹脂基材の前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記樹脂基材の前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍとなる表面処理銅箔。   When the surface-treated copper foil is bonded to the resin substrate for a printed wiring board from the surface-treated layer side and the surface-treated copper foil is removed, the three-dimensional surface area B and the two-dimensional surface of the copper foil removal side surface of the resin substrate The ratio B / A to the surface area A is 1.01 to 1.5, the black area ratio on the copper foil removal side surface of the resin base material is 10 to 50%, and the copper of the resin base material A surface-treated copper foil in which the average diameter of holes on the foil removal side surface is 0.03 to 1.0 μm. 前記銅箔が電解銅箔または圧延銅箔で形成されている請求項１〜１０のいずれか一項に記載の表面処理銅箔。 The surface-treated copper foil as described in any one of Claims 1-10 in which the said copper foil is formed with the electrolytic copper foil or the rolled copper foil. 前記表面処理層が粗化処理層である請求項１〜１１のいずれか一項に記載の表面処理銅箔。 The surface-treated copper foil according to any one of claims 1 to 11 , wherein the surface-treated layer is a roughened layer. 前記粗化処理層が、銅、ニッケル、コバルト、リン、タングステン、ヒ素、モリブデン、クロム及び亜鉛からなる群から選択されたいずれかの単体又はいずれか１種以上を含む合金からなる層である請求項１２に記載の表面処理銅箔。 The roughening treatment layer is a layer made of any single element selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium, and zinc, or an alloy containing at least one kind. Item 13. A surface-treated copper foil according to Item 12 . 前記粗化処理層の表面に、耐熱層、防錆層、クロメート処理層及びシランカップリング処理層からなる群から選択された１種以上の層を有する請求項１２又は１３に記載の表面処理銅箔。 The surface-treated copper of Claim 12 or 13 which has 1 or more types of layers selected from the group which consists of a heat-resistant layer, a rust prevention layer, a chromate treatment layer, and a silane coupling treatment layer on the surface of the said roughening treatment layer. Foil. 前記表面処理層が、耐熱層、防錆層、クロメート処理層及びシランカップリング処理層からなる群から選択された１種以上の層である請求項１〜１１のいずれか一項に記載の表面処理銅箔。 The surface treatment layer, the heat-resistant layer, the anticorrosive layer, the surface of any one of claim 1 to 11, which is one or more layers selected from the group consisting of chromate treatment layer and a silane coupling treatment layer Treated copper foil. 前記表面処理層上に樹脂層を備える請求項１〜１５のいずれか一項に記載の表面処理銅箔。 The surface-treated copper foil as described in any one of Claims 1-15 provided with a resin layer on the said surface-treated layer. 前記樹脂層が接着用樹脂である請求項１６に記載の表面処理銅箔。 The surface-treated copper foil according to claim 16 , wherein the resin layer is an adhesive resin. 前記樹脂層が半硬化状態の樹脂である請求項１６又は１７に記載の表面処理銅箔。 The surface-treated copper foil according to claim 16 or 17 , wherein the resin layer is a semi-cured resin. 前記樹脂層が誘電体を含む請求項１６〜１８のいずれか一項に記載の表面処理銅箔。 Surface treated copper foil according to any one of claims 16-18 wherein the resin layer comprises a dielectric. キャリアと、キャリアの一方又は両方の表面に積層された中間層と、キャリアの一方又は両方の表面に積層された中間層上に積層された厚み１２μｍ以下の極薄銅層とを備えたキャリア付銅箔であって、前記極薄銅層の一方又は両方が請求項１〜１９のいずれか一項に記載の表面処理銅箔であるキャリア付銅箔。 With a carrier comprising a carrier, an intermediate layer laminated on one or both surfaces of the carrier, and an ultrathin copper layer having a thickness of 12 μm or less laminated on the intermediate layer laminated on one or both surfaces of the carrier a copper foil, the carrier copper foil is a surface treated copper foil according to one or both of the ultra-thin copper layer is any one of claims 1 to 19. 請求項１〜１９のいずれか一項に記載の表面処理銅箔を表面処理層側から基材に貼り合わせ、前記表面処理銅箔を除去した基材であり、前記銅箔除去側表面の面粗さＳｚが１〜５μｍである基材。 Surface treated copper foil according to any one of claims 1 to 19, bonded from the surface treatment layer side substrate, a substrate obtained by removing the surface treated copper foil, the surface of the copper foil removed surface A substrate having a roughness Sz of 1 to 5 μm. 請求項１〜１９のいずれか一項に記載の表面処理銅箔を表面処理層側から基材に貼り合わせ、前記表面処理銅箔を除去した基材であり、前記銅箔除去側表面の三次元表面積Ｂと二次元表面積Ａとの比Ｂ／Ａが１．０１〜１．５である基材。 Surface treated copper foil according to any one of claims 1 to 19, bonded from the surface treatment layer side substrate, a substrate obtained by removing the surface treated copper foil, tertiary of the copper foil removed surface The base material whose ratio B / A of the original surface area B and the two-dimensional surface area A is 1.01 to 1.5. 請求項１〜１９のいずれか一項に記載の表面処理銅箔を表面処理層側から基材に貼り合わせ、前記表面処理銅箔を除去した基材であり、前記銅箔除去側表面の黒色面積率が１０〜５０％であり、且つ、前記銅箔除去側表面の穴の直径平均値が０．０３〜１．０μｍである基材。 Bonding the surface treatment layer side treated copper foil according to any one of claims 1 to 19 to a substrate, wherein a surface-treated copper foil substrate was removed, black of the copper foil removed surface A base material having an area ratio of 10 to 50% and an average diameter of holes on the copper foil removal side surface of 0.03 to 1.0 μm. 請求項１〜１９のいずれか一項に記載の表面処理銅箔又は請求項２０に記載のキャリア付銅箔を用いて製造したプリント配線板。 Printed wiring board produced using the copper foil with carrier according to the surface-treated copper foil or claim 20 according to any one of claims 1 to 19. 請求項１〜１９のいずれか一項に記載の表面処理銅箔又は請求項２０に記載のキャリア付銅箔を用いて製造したプリント回路板。 Printed circuit board produced using the copper foil with carrier according to the surface-treated copper foil or claim 20 according to any one of claims 1 to 19. 請求項１〜１９のいずれか一項に記載の表面処理銅箔又は請求項２０に記載のキャリア付銅箔を用いて製造した銅張積層板。 Copper-clad laminate produced using the copper foil with carrier according to the surface-treated copper foil or claim 20 according to any one of claims 1 to 19. 請求項１〜１９のいずれか一項に記載の表面処理銅箔と絶縁基板とを準備する工程、
前記表面処理銅箔を、表面処理層側から絶縁基板に積層する工程、
前記絶縁基板上の表面処理銅箔を除去する工程、
前記表面処理銅箔を除去した絶縁基板の表面に回路を形成する工程
を含むプリント配線板の製造方法。 A step of preparing the surface-treated copper foil and the insulating substrate according to any one of claims 1 to 19 ,
Laminating the surface-treated copper foil on the insulating substrate from the surface-treated layer side,
Removing the surface-treated copper foil on the insulating substrate;
A printed wiring board manufacturing method including a step of forming a circuit on a surface of an insulating substrate from which the surface-treated copper foil is removed. 請求項２０に記載のキャリア付銅箔と絶縁基板とを準備する工程、
前記キャリア付銅箔を極薄銅層側から絶縁基板に積層する工程、
前記キャリア付銅箔と絶縁基板とを積層した後に、前記キャリア付銅箔のキャリアを剥がす工程、
前記キャリアを剥がした後の絶縁基板上の極薄銅層を除去する工程、
前記極薄銅層を除去した絶縁基板の表面に回路を形成する工程
を含むプリント配線板の製造方法。 Preparing a copper foil with a carrier according to claim 20 and an insulating substrate;
Laminating the copper foil with carrier on the insulating substrate from the ultrathin copper layer side,
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Removing the ultrathin copper layer on the insulating substrate after peeling off the carrier;
A printed wiring board manufacturing method including a step of forming a circuit on a surface of an insulating substrate from which the ultrathin copper layer is removed. 請求項１〜１９のいずれか一項に記載の表面処理銅箔と絶縁基板とを準備する工程、
前記表面処理銅箔を、表面処理層側から絶縁基板に積層して銅張積層板を形成し、
その後、セミアディティブ法、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって、回路を形成する工程を含むプリント配線板の製造方法。 A step of preparing the surface-treated copper foil and the insulating substrate according to any one of claims 1 to 19 ,
The surface-treated copper foil is laminated on an insulating substrate from the surface-treated layer side to form a copper-clad laminate,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method. 請求項２０に記載のキャリア付銅箔と絶縁基板とを準備する工程、
前記キャリア付銅箔を極薄銅層側から絶縁基板に積層する工程、
前記キャリア付銅箔と絶縁基板とを積層した後に、前記キャリア付銅箔のキャリアを剥がす工程を経て銅張積層板を形成し、
その後、セミアディティブ法、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって、回路を形成する工程を含むプリント配線板の製造方法。 Preparing a copper foil with a carrier according to claim 20 and an insulating substrate;
Laminating the copper foil with carrier on the insulating substrate from the ultrathin copper layer side,
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method. 回路が形成された金属箔を準備する工程、
前記回路が埋没するように前記金属箔表面に樹脂層を形成する工程、
請求項１〜１９のいずれか一項に記載の表面処理銅箔を、表面処理層側から前記樹脂層に積層する工程、
前記樹脂層上の表面処理銅箔を除去する工程、
前記表面処理銅箔を除去した樹脂層の表面に回路を形成する工程、及び、
前記金属箔を除去することで、前記金属箔表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Preparing a metal foil on which a circuit is formed;
Forming a resin layer on the surface of the metal foil so that the circuit is buried;
The step of laminating the surface-treated copper foil according to any one of claims 1 to 19 on the resin layer from the surface-treated layer side,
Removing the surface-treated copper foil on the resin layer;
Forming a circuit on the surface of the resin layer from which the surface-treated copper foil is removed; and
A method for producing a printed wiring board, comprising a step of exposing a circuit formed on the surface of the metal foil and embedded in the resin layer by removing the metal foil. 請求項２０に記載のキャリア付銅箔を第１のキャリア付銅箔とし、前記第１のキャリア付銅箔の極薄銅層側表面に回路を形成する工程、
前記回路が埋没するように前記第１のキャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
第２のキャリア付銅箔を準備し、前記第２のキャリア付銅箔の極薄銅層側から前記樹脂層に積層する工程、
前記第２のキャリア付銅箔を前記樹脂層に積層した後に、前記第２のキャリア付銅箔のキャリアを剥がす工程、
前記第２のキャリア付銅箔のキャリアを剥がした後の樹脂層上の極薄銅層を除去する工程、
前記極薄銅層を除去した樹脂層の表面に回路を形成する工程、
前記樹脂層上に回路を形成した後に、前記第１のキャリア付銅箔のキャリアを剥離させる工程、及び、
前記第１のキャリア付銅箔のキャリアを剥離させた後に、前記第１のキャリア付銅箔の極薄銅層を除去することで、前記第１のキャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 The step of forming a circuit on the surface of the ultrathin copper layer of the first copper foil with carrier, wherein the copper foil with carrier according to claim 20 is a first copper foil with carrier.
Forming a resin layer on the ultrathin copper layer side surface of the first carrier-attached copper foil so that the circuit is buried;
Preparing a second copper foil with a carrier, and laminating the resin layer from the ultrathin copper layer side of the second copper foil with a carrier;
A step of peeling the carrier of the second copper foil with carrier after laminating the second copper foil with carrier on the resin layer;
Removing the ultrathin copper layer on the resin layer after peeling the carrier of the copper foil with the second carrier;
Forming a circuit on the surface of the resin layer from which the ultrathin copper layer has been removed,
After forming a circuit on the resin layer, the step of peeling the carrier of the first copper foil with carrier, and
After peeling the carrier of the first copper foil with carrier, the ultra thin copper layer side surface of the first copper foil with carrier is removed by removing the ultra thin copper layer of the first copper foil with carrier. A method for producing a printed wiring board, comprising the step of exposing a circuit buried in the resin layer formed in step 1). 回路が形成された金属箔を準備する工程、
前記回路が埋没するように前記金属箔表面に樹脂層を形成する工程、
請求項１〜１９のいずれか一項に記載の表面処理銅箔を、表面処理層側から樹脂層に積層し、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって前記樹脂層上に回路を形成する工程、及び、
前記金属箔を除去することで、前記金属箔表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Preparing a metal foil on which a circuit is formed;
Forming a resin layer on the surface of the metal foil so that the circuit is buried;
The surface-treated copper foil according to any one of claims 1 to 19 is laminated on a resin layer from the surface-treated layer side, and the resin is obtained by any one of a subtractive method, a partly additive method, or a modified semi-additive method. Forming a circuit on the layer; and
A method for producing a printed wiring board, comprising a step of exposing a circuit formed on the surface of the metal foil and embedded in the resin layer by removing the metal foil. 請求項２０に記載のキャリア付銅箔を第１のキャリア付銅箔とし、前記第１のキャリア付銅箔の極薄銅層側表面に回路を形成する工程、
前記回路が埋没するように前記第１のキャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
第２のキャリア付銅箔を準備し、前記第２のキャリア付銅箔の極薄銅層側から前記樹脂層に積層して前記第２のキャリア付銅箔のキャリアを剥がし、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって前記樹脂層上に回路を形成する工程、
前記樹脂層上に回路を形成した後に、前記第１のキャリア付銅箔のキャリアを剥離させる工程、及び、
前記第１のキャリア付銅箔のキャリアを剥離させた後に、前記第１のキャリア付銅箔の極薄銅層を除去することで、前記第１のキャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 The step of forming a circuit on the surface of the ultrathin copper layer of the first copper foil with carrier, wherein the copper foil with carrier according to claim 20 is a first copper foil with carrier.
Forming a resin layer on the ultrathin copper layer side surface of the first carrier-attached copper foil so that the circuit is buried;
Preparing a second copper foil with carrier, laminating on the resin layer from the ultra-thin copper layer side of the second copper foil with carrier, peeling off the carrier of the second copper foil with carrier, subtractive method, Forming a circuit on the resin layer by any one of a partial additive method or a modified semi-additive method;
After forming a circuit on the resin layer, the step of peeling the carrier of the first copper foil with carrier, and
After peeling the carrier of the first copper foil with carrier, the ultra thin copper layer side surface of the first copper foil with carrier is removed by removing the ultra thin copper layer of the first copper foil with carrier. A method for producing a printed wiring board, comprising the step of exposing a circuit buried in the resin layer formed in step 1). 請求項２０に記載のキャリア付銅箔の極薄銅層側表面に回路を形成する工程、
前記回路が埋没するように前記キャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
前記キャリア付銅箔のキャリアを剥離させる工程、及び、
前記キャリア付銅箔のキャリアを剥離させた後に、前記キャリア付銅箔の極薄銅層を除去することで、前記キャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Forming a circuit on the ultrathin copper layer side surface of the copper foil with carrier according to claim 20 ;
Forming a resin layer on the ultrathin copper layer side surface of the carrier-attached copper foil so that the circuit is buried;
Peeling the carrier of the copper foil with carrier, and
After peeling the carrier of the copper foil with carrier, by removing the ultra thin copper layer of the copper foil with carrier, formed on the ultra thin copper layer side surface of the copper foil with carrier, embedded in the resin layer A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected. 請求項２０に記載のキャリア付銅箔の極薄銅層側表面に回路を形成する工程、
前記回路が埋没するように前記キャリア付銅箔の前記極薄銅層側表面に樹脂層を形成する工程、
前記樹脂層の表面に回路を形成する工程、
前記キャリア付銅箔のキャリアを剥離させる工程、及び、
前記キャリア付銅箔のキャリアを剥離させた後に、前記キャリア付銅箔の極薄銅層を除去することで、前記キャリア付銅箔の極薄銅層側表面に形成した、前記樹脂層に埋没している回路を露出させる工程
を含むプリント配線板の製造方法。 Forming a circuit on the ultrathin copper layer side surface of the copper foil with carrier according to claim 20 ;
Forming a resin layer on the ultrathin copper layer side surface of the carrier-attached copper foil so that the circuit is buried;
Forming a circuit on the surface of the resin layer;
Peeling the carrier of the copper foil with carrier, and
After peeling the carrier of the copper foil with carrier, by removing the ultra thin copper layer of the copper foil with carrier, formed on the ultra thin copper layer side surface of the copper foil with carrier, embedded in the resin layer A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected. 前記第２のキャリア付銅箔が請求項２０に記載のキャリア付銅箔である請求項３２又は３４に記載のプリント配線板の製造方法。 The method for producing a printed wiring board according to claim 32 or 34 , wherein the second copper foil with a carrier is the copper foil with a carrier according to claim 20 .
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