JP2015010275A5

JP2015010275A5 - Copper foil with carrier, method for producing the same, method for producing copper-clad laminate, and method for producing printed wiring board

Info

Publication number: JP2015010275A5
Application number: JP2013139285A
Authority: JP
Filing date: 2013-07-02
Publication date: 2016-05-26
Anticipated expiration: 2033-07-02

Claims

A carrier-attached copper foil comprising a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer,
The intermediate layer is made of a tungsten-nickel alloy, a tungsten-cobalt alloy, or a tungsten-iron alloy,
The intermediate layer has a tungsten deposition amount of 50 to 10,000 μg / dm ² , the nickel has an adhesion amount of 50 to 40,000 μg / dm ² , and the intermediate layer has cobalt deposition amount of 50. 10000 μg / dm ² , when the intermediate layer contains iron, the amount of iron adhered is 50 to 10000 μg / dm ² ,
With a carrier whose maximum value of tungsten concentration is 1 to 70% by mass when 50 to 1000 nm long STEM line analysis is performed in a range including all of them in this order from the cross section of the carrier / intermediate layer / ultra thin copper layer. Copper foil.

When a 50 to 1000 nm long STEM line analysis is performed in a range including all of them in this order from the cross section of the carrier / intermediate layer / ultra thin copper layer, the maximum value of tungsten concentration is 3 to 70% by mass. The copper foil with a carrier according to 1.

When the 50 to 1000 nm long STEM line analysis is performed in a range including all of them in this order from the cross section of the carrier / intermediate layer / ultra thin copper layer, the maximum value of tungsten concentration is 5 to 60% by mass. 2. Copper foil with carrier according to 2.

The intermediate layer is formed by stacking nickel or a nickel alloy and a tungsten-nickel alloy, a tungsten-cobalt alloy, or a tungsten-iron alloy in this order on the carrier,
From the cross section of the copper foil carrier / intermediate layer / ultra thin copper layer, when a 50 to 1000 nm long STEM line analysis is performed in a range including all of them in this order, the maximum value of the nickel concentration is 50 to 95% by mass. The copper foil with a carrier as described in any one of Claims 1-3.

When the insulating substrate is thermocompression bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours,
From the cross section of the copper foil carrier / intermediate layer / ultra-thin copper layer, when a 50 to 1000 nm long STEM line analysis is performed in a range including all of them in this order, the maximum value of the tungsten concentration becomes 1 to 60% by mass. The copper foil with a carrier as described in any one of Claims 1-4.

When the insulating substrate is thermocompression bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours,
From the cross section of the copper foil carrier / intermediate layer / ultra-thin copper layer, when a 50-1000 nm long STEM line analysis was performed in a range including all of them in this order, tungsten, nickel and / or cobalt and / or iron The copper foil with a carrier according to any one of claims 1 to 5, wherein a minimum copper concentration in a portion where copper coexists is 10 to 65 mass%.

The copper foil with a carrier as described in any one of Claims 1-6 which satisfy | fills any one of the following (A)-(C).
(A) A roughening treatment layer is provided on the surface of the ultrathin copper layer .
(B) The surface of the ultrathin copper layer has a roughening treatment layer, and the surface of the roughening treatment layer is selected from the group consisting of a heat-resistant layer, a rust prevention layer, a chromate treatment layer, and a silane coupling treatment layer. Having one or more layers formed,
(C) One or more layers selected from the group consisting of a heat-resistant layer, a rust prevention layer, a chromate treatment layer, and a silane coupling treatment layer are provided on the surface of the ultrathin copper layer.

A resin layer is provided on the ultrathin copper layer or on the roughening treatment layer or on one or more layers selected from the group consisting of the heat-resistant layer, the rust prevention layer, the chromate treatment layer, and the silane coupling treatment layer. copper foil with carrier according to any one of claims 1-7.

The copper foil with a carrier according to any one of claims 1 to 8, which satisfies at least one of the following (D) to (G).
(D) The color difference ΔL based on JISZ8730 on the surface of the ultrathin copper layer is −40 or less .
(E) The color difference ΔE * ab based on JISZ8730 on the surface of the ultrathin copper layer is 45 or more.
(F) The color difference Δa based on JISZ8730 on the surface of the ultrathin copper layer is 20 or less.
(G) The color difference Δb based on JISZ8730 on the surface of the ultrathin copper layer is 20 or less.

After a nickel plating layer or an alloy plating layer containing nickel is formed on the carrier or by dry plating or electroplating on the carrier , tungsten-cobalt alloy, tungsten-nickel alloy, tungsten- forming an intermediate layer by forming a layer containing any one or more of iron alloy, any of claim 1-9 comprising the step of forming the ultra-thin copper layer by electrolytic plating on the middle layer A method for producing a copper foil with a carrier according to claim 1.

Method of making a print wiring board using the copper foil with carrier according to any one of claims 1-9.

Method of producing a copper-clad laminate using a copper foil with carrier according to any one of claims 1-9.

A step of preparing the carrier-attached copper foil according to any one of claims 1 to 9 and an insulating substrate;
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, forming a copper-clad laminate through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.

Forming a circuit on the ultrathin copper layer side surface of the copper foil with a carrier according to any one of claims 1 to 9 ,
Forming a resin layer on the ultrathin copper layer side surface of the carrier-attached copper foil so that the circuit is buried;
Forming a circuit on the resin layer;
Forming the circuit on the resin layer, and then peeling the carrier; and
After the carrier is peeled off, the printed wiring board includes a step of exposing the circuit embedded in the resin layer formed on the surface of the ultrathin copper layer by removing the ultrathin copper layer Method.