JP2014201778A5 - - Google Patents
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- JP2014201778A5 JP2014201778A5 JP2013077077A JP2013077077A JP2014201778A5 JP 2014201778 A5 JP2014201778 A5 JP 2014201778A5 JP 2013077077 A JP2013077077 A JP 2013077077A JP 2013077077 A JP2013077077 A JP 2013077077A JP 2014201778 A5 JP2014201778 A5 JP 2014201778A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- carrier
- copper foil
- less
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011889 copper foil Substances 0.000 claims 18
- 239000000969 carrier Substances 0.000 claims 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 13
- 229910052802 copper Inorganic materials 0.000 claims 13
- 239000010949 copper Substances 0.000 claims 13
- 239000000654 additive Substances 0.000 claims 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 3
- 230000001808 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000007788 roughening Methods 0.000 claims 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 3
- 229910000077 silane Inorganic materials 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000002265 prevention Effects 0.000 claims 2
- 230000000996 additive Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
Claims (9)
（Ａ）前記極薄銅層表面のＲｚの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−１９８２に準拠して測定して１．５μｍ以下であり、且つ、Ｒｚの標準偏差が０．１μｍ以下である。
（Ｂ）前記極薄銅層表面のＲｔの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−２００１に準拠して測定して２．０μｍ以下であり、且つ、Ｒｔの標準偏差が０．１μｍ以下である。
（Ｃ）前記極薄銅層表面のＲａの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−１９８２に準拠して測定して０．２μｍ以下であり、且つ、Ｒａの標準偏差が０．０３μｍ以下である。 A copper foil with a carrier comprising a copper foil carrier, a release layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the release layer, the ultrathin measured by the weight thickness method The copper foil with a carrier whose thickness accuracy of a copper layer is 3.0% or less, and satisfy | fills any one or more of the following (A)-(C).
(A) The average value of Rz on the surface of the ultrathin copper layer is 1.5 μm or less as measured according to JIS B0601-1982 with a contact-type roughness meter, and the standard deviation of Rz is 0.1 μm or less. der Ru.
(B) The average value of Rt on the surface of the ultrathin copper layer is 2.0 μm or less as measured by a contact roughness meter according to JIS B0601-2001, and the standard deviation of Rt is 0.1 μm or less. It is.
(C) The average value of Ra on the surface of the ultrathin copper layer is 0.2 μm or less as measured with a contact roughness meter according to JIS B0601-1982, and the standard deviation of Ra is 0.03 μm or less. It is.
（Ａ）前記極薄銅層表面のＲｚの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−１９８２に準拠して測定して１．５μｍ以下であり、且つ、Ｒｚの標準偏差が０．１μｍ以下である。
（Ｂ）前記極薄銅層表面のＲｔの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−２００１に準拠して測定して２．０μｍ以下であり、且つ、Ｒｔの標準偏差が０．１μｍ以下である。
（Ｃ）前記極薄銅層表面のＲａの平均値は接触式粗さ計でＪＩＳ Ｂ０６０１−１９８２に準拠して測定して０．２μｍ以下であり、且つ、Ｒａの標準偏差が０．０３μｍ以下である。 A copper foil with a carrier provided with a copper foil carrier, a peeling layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the peeling layer, which was measured by a four-probe method The copper foil with a carrier whose thickness accuracy of an ultra-thin copper layer is 10.0% or less, and satisfy | fills any one or more of the following (A)-(C).
(A) The average value of Rz on the surface of the ultrathin copper layer is 1.5 μm or less as measured according to JIS B0601-1982 with a contact-type roughness meter, and the standard deviation of Rz is 0.1 μm or less. der Ru.
(B) The average value of Rt on the surface of the ultrathin copper layer is 2.0 μm or less as measured by a contact roughness meter according to JIS B0601-2001, and the standard deviation of Rt is 0.1 μm or less. It is.
(C) The average value of Ra on the surface of the ultrathin copper layer is 0.2 μm or less as measured with a contact roughness meter according to JIS B0601-1982, and the standard deviation of Ra is 0.03 μm or less. It is.
前記キャリア付銅箔と絶縁基板とを積層する工程、及び、
前記キャリア付銅箔と絶縁基板とを積層した後に、前記キャリア付銅箔のキャリアを剥がす工程を経て銅張積層板を形成し、
その後、セミアディティブ法、サブトラクティブ法、パートリーアディティブ法又はモディファイドセミアディティブ法のいずれかの方法によって、回路を形成する工程を含むプリント配線板の製造方法。 Preparing a copper foil with a carrier and an insulating substrate according to any one of claims 1 to 6 ,
A step of laminating the copper foil with carrier and an insulating substrate; and
After laminating the carrier-attached copper foil and the insulating substrate, forming a copper-clad laminate through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077077A JP6360659B2 (en) | 2013-04-02 | 2013-04-02 | Copper foil with carrier, method of producing a printed wiring board using the copper foil with carrier, method of producing a copper clad laminate using the copper foil with carrier, and method of producing a printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077077A JP6360659B2 (en) | 2013-04-02 | 2013-04-02 | Copper foil with carrier, method of producing a printed wiring board using the copper foil with carrier, method of producing a copper clad laminate using the copper foil with carrier, and method of producing a printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014201778A JP2014201778A (en) | 2014-10-27 |
| JP2014201778A5 true JP2014201778A5 (en) | 2016-05-26 |
| JP6360659B2 JP6360659B2 (en) | 2018-07-18 |
Family
ID=52352505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013077077A Active JP6360659B2 (en) | 2013-04-02 | 2013-04-02 | Copper foil with carrier, method of producing a printed wiring board using the copper foil with carrier, method of producing a copper clad laminate using the copper foil with carrier, and method of producing a printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6360659B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6190500B2 (en) * | 2015-08-06 | 2017-08-30 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method |
| TWI781818B (en) | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | Surface-treated copper foil and copper clad laminate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2594840B2 (en) * | 1990-05-31 | 1997-03-26 | 日鉱グールド・フォイル株式会社 | Method and apparatus for producing electrolytic copper foil |
| JP3466506B2 (en) * | 1999-04-23 | 2003-11-10 | 三井金属鉱業株式会社 | Electrolytic copper foil with carrier foil, method for producing the electrolytic copper foil, and copper-clad laminate using the electrolytic copper foil |
| JP3429290B2 (en) * | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | Manufacturing method of copper foil for fine wiring |
| JP2002280689A (en) * | 2001-03-19 | 2002-09-27 | Asahi Kasei Corp | Extremely thin copper foil with support and extremely thin copper foil board using the same |
| JP4178415B2 (en) * | 2002-07-04 | 2008-11-12 | 三井金属鉱業株式会社 | Electrolytic copper foil with carrier foil |
| JP4429979B2 (en) * | 2005-06-29 | 2010-03-10 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and method for producing ultra-thin copper foil with carrier |
| JP2007146289A (en) * | 2005-10-31 | 2007-06-14 | Mitsui Mining & Smelting Co Ltd | Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil |
| JP5129642B2 (en) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate |
| JP4642120B2 (en) * | 2009-04-01 | 2011-03-02 | 三井金属鉱業株式会社 | Electrolytic metal foil manufacturing apparatus, method for manufacturing thin plate insoluble metal electrode used in electrolytic metal foil manufacturing apparatus, and electrolytic metal foil obtained using the electrolytic metal foil manufacturing apparatus |
| JP2010006071A (en) * | 2009-08-21 | 2010-01-14 | Furukawa Electric Co Ltd:The | Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board |
| JP5352542B2 (en) * | 2010-07-15 | 2013-11-27 | エル エス エムトロン リミテッド | Copper foil for current collector of lithium secondary battery |
| JP2012172198A (en) * | 2011-02-22 | 2012-09-10 | Jx Nippon Mining & Metals Corp | Electrolytic copper foil and method for manufacturing the same |
| EP2752505B1 (en) * | 2011-08-31 | 2016-03-23 | JX Nippon Mining & Metals Corporation | Copper foil with carrier |
-
2013
- 2013-04-02 JP JP2013077077A patent/JP6360659B2/en active Active
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