JP2009272589A5 - - Google Patents

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Publication number
JP2009272589A5
JP2009272589A5 JP2008124381A JP2008124381A JP2009272589A5 JP 2009272589 A5 JP2009272589 A5 JP 2009272589A5 JP 2008124381 A JP2008124381 A JP 2008124381A JP 2008124381 A JP2008124381 A JP 2008124381A JP 2009272589 A5 JP2009272589 A5 JP 2009272589A5
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Japan
Prior art keywords
metal foil
carrier
foil
plate
circuit board
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Application number
JP2008124381A
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Japanese (ja)
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JP2009272589A (en
JP4805304B2 (en
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Priority to JP2008124381A priority Critical patent/JP4805304B2/en
Priority claimed from JP2008124381A external-priority patent/JP4805304B2/en
Publication of JP2009272589A publication Critical patent/JP2009272589A/en
Publication of JP2009272589A5 publication Critical patent/JP2009272589A5/ja
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Claims (11)

プリプレグからなる板状キャリヤーと、該キャリヤーの少なくとも一方の面に、機械的に剥離可能に密着させた金属箔からなるキャリヤー付金属箔。 A metal foil with a carrier comprising a plate-like carrier made of a prepreg and a metal foil mechanically and peelably adhered to at least one surface of the carrier. 金属箔が、銅箔又は銅合金箔であることを特徴とする請求項１記載のキャリヤー付金属箔。 Metal foil, a carrier coated metal foil according to claim 1, which is a copper foil or copper alloy foil. 板状キャリヤーと金属箔との剥離強度が１ｇ／ｃｍ以上、１ｋｇ／ｃｍ以下であり、剥離面が板状キャリヤーと金属との境界であることを特徴とする請求項１又は２記載のキャリヤー付金属箔。 3. The carrier according to claim 1 , wherein the peel strength between the plate carrier and the metal foil is 1 g / cm or more and 1 kg / cm or less, and the peel surface is a boundary between the plate carrier and the metal. Metal foil. 板状キャリヤーの熱膨張率が金属箔の熱膨張率の＋１０％、−３０％以内であることを特徴とする請求項１〜３のいずれか一項に記載のキャリヤー付金属箔。 The metal foil with a carrier according to any one of claims 1 to 3, wherein the thermal expansion coefficient of the plate-like carrier is within + 10% and -30% of the thermal expansion coefficient of the metal foil. 金属箔が、５〜１２０μｍの厚みを有する電解箔または圧延箔であることを特徴とする請求項１〜４のいずれか一項に記載のキャリヤー付金属箔。 The metal foil with a carrier according to any one of claims 1 to 4 , wherein the metal foil is an electrolytic foil or a rolled foil having a thickness of 5 to 120 µm. プリプレグからなる板状キャリヤーと、該キャリヤーの少なくとも一方の面に機械的に剥離可能に密着させた金属箔からなるキャリヤー付金属箔に、鍍金または金属箔厚みの半分程度エッチングすることにより回路を形成する工程、次に、その回路上にプリプレグ、さらに金属箔を重ねてホットプレスして新たな金属箔層を形成する工程、次いで、その新たな金属箔層に回路を形成する工程を行い、さらに所定の層数を重ねた後、板状キャリヤー付金属箔のプリプレグと金属箔の界面から剥離し、さらに剥離面を全面エッチングして、回路を露出させることを特徴とする多層コアレス回路基板の製造方法。 A circuit is formed by etching a plate-like carrier made of prepreg and a metal foil with a carrier made of metal foil that is mechanically peelably adhered to at least one surface of the carrier, or by etching about half the thickness of the metal foil or metal foil. Next, a step of forming a new metal foil layer by hot pressing the prepreg and metal foil on the circuit, then forming a circuit on the new metal foil layer, After a predetermined number of layers have been stacked, the multilayer coreless circuit board is manufactured by peeling from the interface between the prepreg and metal foil of the metal foil with a plate-like carrier and further etching the peeled surface to expose the circuit. Way . キャリヤー付金属箔が、板状キャリヤーの両面に金属箔を貼り付け、両方の金属箔層に予め回路を形成しておくことを特徴とする請求項６記載の多層コアレス回路基板の製造方法。 7. The method of manufacturing a multilayer coreless circuit board according to claim 6, wherein the metal foil with a carrier is formed by attaching a metal foil to both surfaces of a plate-like carrier and forming a circuit on both metal foil layers in advance . 金属箔が、銅箔又は銅合金箔であることを特徴とする請求項６又は７記載の多層コアレス回路基板の製造方法。 The method for producing a multilayer coreless circuit board according to claim 6 or 7, wherein the metal foil is a copper foil or a copper alloy foil . 板状キャリヤーと金属箔との剥離強度が１ｇ／ｃｍ以上、１ｋｇ／ｃｍ以下であり、剥離面がプリプレグと金属との境界であることを特徴とする請求項６〜８のいずれか一項に記載の多層コアレス回路基板の製造方法。 The peel strength between the plate-like carrier and the metal foil is 1 g / cm or more and 1 kg / cm or less, and the peel surface is a boundary between the prepreg and the metal. The manufacturing method of the multilayer coreless circuit board of description . 板状キャリヤーの熱膨張係数が金属箔の熱膨張係数の＋１０％、−３０％以内であることを特徴とする請求項６〜９のいずれか一項に記載の多層コアレス回路基板の製造方法。 The method for producing a multilayer coreless circuit board according to any one of claims 6 to 9, wherein the plate-like carrier has a thermal expansion coefficient within + 10% and -30% of the thermal expansion coefficient of the metal foil . 金属箔が、５〜１２０μｍの厚みを有する電解箔または圧延箔であることを特徴とする請求項６〜１０のいずれか一項に記載の多層コアレス回路基板の製造方法。 The method for producing a multilayer coreless circuit board according to any one of claims 6 to 10, wherein the metal foil is an electrolytic foil or a rolled foil having a thickness of 5 to 120 µm .
JP2008124381A 2008-05-12 2008-05-12 Metal foil with carrier and method for producing multilayer coreless circuit board Active JP4805304B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008124381A JP4805304B2 (en) 2008-05-12 2008-05-12 Metal foil with carrier and method for producing multilayer coreless circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008124381A JP4805304B2 (en) 2008-05-12 2008-05-12 Metal foil with carrier and method for producing multilayer coreless circuit board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011159555A Division JP5427847B2 (en) 2011-07-21 2011-07-21 Metal foil with carrier

Publications (3)

Publication Number Publication Date
JP2009272589A JP2009272589A (en) 2009-11-19
JP2009272589A5 true JP2009272589A5 (en) 2010-12-16
JP4805304B2 JP4805304B2 (en) 2011-11-02

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JP2008124381A Active JP4805304B2 (en) 2008-05-12 2008-05-12 Metal foil with carrier and method for producing multilayer coreless circuit board

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JP2013140856A (en) * 2011-12-28 2013-07-18 Jx Nippon Mining & Metals Corp Metal foil with carrier
JP5190553B1 (en) * 2012-03-06 2013-04-24 フリージア・マクロス株式会社 Metal foil with carrier
KR20150020621A (en) * 2012-06-04 2015-02-26 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Method for producing multilayer printed wiring board
CN104619486B (en) * 2012-06-04 2018-01-26 Jx日矿日石金属株式会社 Appendix body metal foil
CN104334346B (en) * 2012-06-04 2017-05-03 Jx日矿日石金属株式会社 Carrier-attached metal foil
KR20170034947A (en) 2012-06-04 2017-03-29 제이엑스금속주식회사 Carrier-attached metal foil
JP6063183B2 (en) * 2012-08-31 2017-01-18 パナソニックＩｐマネジメント株式会社 Peelable copper foil substrate and circuit board manufacturing method
WO2014046259A1 (en) * 2012-09-20 2014-03-27 Jx日鉱日石金属株式会社 Metallic foil having carrier
TWI615271B (en) * 2012-09-20 2018-02-21 Ｊｘ日鑛日石金屬股份有限公司 A metal foil with a carrier
KR20170130640A (en) * 2012-09-24 2017-11-28 제이엑스금속주식회사 Metallic foil having carrier, layered product comprising resin sheet-shaped carrier and metallic foil, and uses for same
JP5887420B2 (en) * 2012-09-28 2016-03-16 Ｊｘ金属株式会社 Metal foil with carrier
WO2014054803A1 (en) * 2012-10-04 2014-04-10 Jx日鉱日石金属株式会社 Production method for multilayer printed wiring board, and base material
JP6373189B2 (en) * 2012-10-04 2018-08-15 Ｊｘ金属株式会社 Metal foil with carrier
WO2014054811A1 (en) * 2012-10-04 2014-04-10 Jx日鉱日石金属株式会社 Production method for multilayer printed wiring board, and base material
WO2014132947A1 (en) * 2013-02-26 2014-09-04 古河電気工業株式会社 Ultrathin copper foil with carrier, copper-clad laminate, and coreless substrate
JP5647310B2 (en) * 2013-08-16 2014-12-24 Jx日鉱日石金属株式会社 Manufacturing method of multilayer coreless circuit board, manufacturing method of multilayer body for multilayer printed wiring board, manufacturing method of multilayer body used for manufacturing multilayer printed wiring board, and manufacturing method of printed circuit board
JP6327840B2 (en) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 Resin composition comprising a thermosetting resin and a release agent
KR102198541B1 (en) * 2014-03-17 2021-01-06 삼성전기주식회사 Carrier member
US10863621B2 (en) 2014-06-03 2020-12-08 Mitsui Mining & Smelting Co., Ltd. Metal foil with releasing resin layer, and printed wiring board
CN104582256B (en) * 2014-12-31 2018-04-20 广州兴森快捷电路科技有限公司 Centreless board member
CN104540326A (en) * 2014-12-31 2015-04-22 广州兴森快捷电路科技有限公司 Core-less board manufacturing component and manufacturing method for core-less board
JP7259302B2 (en) * 2018-12-07 2023-04-18 住友ベークライト株式会社 Manufacturing method of coreless substrate

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JP3631184B2 (en) * 2001-09-17 2005-03-23 日本アビオニクス株式会社 Method for manufacturing printed wiring board
JP4493923B2 (en) * 2003-02-26 2010-06-30 イビデン株式会社 Printed wiring board
JP5002943B2 (en) * 2004-11-10 2012-08-15 日立化成工業株式会社 Metal foil with adhesive aid and printed wiring board using the same
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP5109400B2 (en) * 2006-09-08 2012-12-26 日立化成工業株式会社 Copper surface treatment liquid set, copper surface treatment method using the same, copper, wiring board, and semiconductor package
JP2008105409A (en) * 2006-09-26 2008-05-08 Mitsui Mining & Smelting Co Ltd Copper foil with resin layer containing filler particle and copper-clad laminated plate using the same
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