WO2014054803A1 - Production method for multilayer printed wiring board, and base material - Google Patents

Abstract

A production method for a base material used in the production of a multilayer printed wiring board includes: a step in which a resin, plate-like carrier is prepared; and a step in which, either a stacked body having a mould-release-agent layer stacked upon a metal foil therein is stacked upon at least one main surface of the plate-like carrier, or the mould-release-agent layer is stacked upon the metal foil which has already been stacked upon the at least one main surface of the plate-like carrier, so that the mould-release-agent layer is stacked upon the main surface of the plate-like carrier, with the metal foil located therebetween.

Description

Multilayer printed wiring board manufacturing method and base substrate

The present invention relates to a method for manufacturing a multilayer printed wiring board and a base substrate.

Various developments have been made on multilayer printed wiring boards. For example, Patent Document 1 discloses a configuration in which a prepreg is employed as a copper foil carrier and the copper foil is laminated on the prepreg so as to be peeled off.

JP 2009-272589 A

A multilayer printed wiring board usually includes a configuration in which a build-up layer including one or more wiring layers and one or more insulating layers is laminated on a resin substrate. However, when the resin substrate is thinned, the multilayer printed wiring board is being manufactured. In some cases, the mounting process may be hindered due to bending and deformation or warping. In view of this point, an object of the present invention is to provide a base substrate that functions as a support when a thin multilayer printed wiring board having a configuration different from the conventional one is manufactured.

A method for producing a base substrate for producing a multilayer printed wiring board according to the present invention comprises a step of preparing a resinous plate-like carrier, and a laminate in which a release agent layer is laminated on a metal foil. A release agent layer is laminated on a metal foil previously laminated on at least one main surface of the plate-like carrier, or on at least one main surface of the plate-like carrier, and on the main surface of the plate-like carrier. Laminating the release agent layer via the metal foil.

A method for manufacturing a multilayer printed wiring board according to the present invention includes a step of preparing a base substrate obtained by the above-described manufacturing method, and a set of an insulating layer and a wiring layer on the release agent layer of the base substrate. Laminating one or more buildup layers.

The peel strength between the base substrate and the buildup layer is preferably 10 gf / cm or more and 200 gf / cm or less.

The peel strength between the base substrate and the buildup layer after heating at 220 ° C. for 3 hours, 6 hours, or 9 hours is preferably 10 gf / cm or more and 200 gf / cm or less.

The layer thickness of the metal foil is preferably in the range of 1 to 400 μm.

The thickness of the plate carrier is preferably 5 μm or more and 1000 μm or less.

The layer thickness of the release agent layer is preferably in the range of 0.001 to 10 μm.

It is preferable that the metal foil is a copper foil or a copper alloy foil.

It is preferable that the plate carrier is a prepreg.

The plate carrier preferably has a glass transition temperature Tg of 120 to 320 ° C.

It is preferable that the method further includes a step of separating the base substrate and the buildup layer.

It is preferable that the method further includes a step of laminating a buildup layer on the surface of the multilayer printed wiring board obtained by the above step.

The build-up layer preferably includes one or more insulating layers and one or more wiring layers.

The one or more wiring layers included in the build-up layer may be a patterned or non-patterned metal foil.

The one or more insulating layers included in the build-up layer may be a thermosetting resin.

The one or more insulating layers included in the buildup layer may be a prepreg.

The build-up layer preferably includes one or more single-sided or double-sided metal-clad laminates.

The build-up layer may be formed using at least one of a subtractive method, a full additive method, or a semi-additive method.

It is preferable that the method further includes a step of performing a dicing process on the laminate in which the buildup layer is laminated on the base substrate.

It is preferable that one or more grooves are formed in the laminate in which the buildup layer is laminated on the base substrate by the dicing process, and the buildup layer can be separated into pieces by the grooves.

Preferably, the method further includes a step of forming a via wiring for one or more insulating layers included in the build-up layer.

The release agent layer has the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product may be used alone or in combination.

The release agent layer is preferably made of a compound having 2 or less mercapto groups in the molecule.

The release agent layer has the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R ¹ is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
It is preferable to use the aluminate compound, titanate compound, zirconate compound, the hydrolysis products thereof, and the condensates of the hydrolysis products, which are used alone or in combination.

The release agent layer may be a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin.

A multilayer printed wiring board manufactured by the method for manufacturing a multilayer printed wiring board as described above is also provided.

A base substrate used in the method for manufacturing a multilayer printed wiring board according to the present invention includes a resin-made plate carrier, a metal foil laminated on at least one main surface of the plate carrier, and the metal foil. And a release agent layer laminated on the main surface of the plate-like carrier.

The layer thickness of the metal foil is preferably in the range of 1 to 400 μm.

The thickness of the plate carrier is preferably 5 μm or more and 1000 μm or less.

The layer thickness of the release agent layer is preferably in the range of 0.001 to 10 μm.

It is preferable that the metal foil is a copper foil or a copper alloy foil.

It is preferable that the plate-like carrier is a thermosetting resin.

It is preferable that the plate carrier is a prepreg.

The release agent layer has the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product may be used alone or in combination.

The release agent layer is preferably made of a compound having 2 or less mercapto groups in the molecule.

The release agent layer has the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R ¹ is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
It is preferable to use the aluminate compound, titanate compound, zirconate compound, the hydrolysis products thereof, and the condensates of the hydrolysis products, which are used alone or in combination.

The release agent layer may be a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin.

According to the present invention, the build-up layer and the base substrate can be separated after the build-up layer lamination step, and a thin multilayer printed wiring board can be efficiently manufactured.

1 is a schematic cross-sectional view of a base substrate according to a first embodiment of the present invention. It is a schematic process drawing which shows the state which laminated | stacked the buildup layer on the base base material which concerns on 1st Embodiment of this invention. It is process drawing which shows typically the process of isolate | separating the multilayer printed wiring board and base material which concern on 1st Embodiment of this invention. It is a schematic sectional drawing of the base substrate concerning a 2nd embodiment of the present invention. It is a schematic sectional drawing which shows the state which laminated | stacked the prepreg and the buildup layer on both surfaces of the base base material which concerns on 2nd Embodiment of this invention. It is a table | surface which shows the test result of the Example which concerns on this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments are not individually independent, and need not be overexplained. Those skilled in the art can appropriately combine the embodiments, and can also grasp the synergistic effect of the combination. In principle, duplicate descriptions between the embodiments are omitted.

<First Embodiment>
The first embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a schematic cross-sectional view of a base substrate. FIG. 2 is a schematic process diagram showing a state in which a buildup layer is laminated on a base substrate. FIG. 3 is a process diagram schematically showing a process of separating the multilayer printed wiring board and the base material.

As shown in FIG. 1, the base substrate 100 is a thermosetting resin having a predetermined thickness which is a resin plate carrier, in this example, a prepreg 10, a metal foil 20 laminated on the upper surface (main surface) of the prepreg 10, A release agent layer 30 is provided on the upper surface of the prepreg 10 via the metal foil 20, and the prepreg 10, the metal foil 20, and the release agent layer 30 are laminated in this order. It is not always necessary to form the metal foil 20 on the entire upper surface of the prepreg 10. Similarly, the release agent layer 30 does not necessarily have to be laminated on the entire upper surface of the metal foil 20. The top view shapes of the prepreg 10, the metal foil 20, and the release agent layer 30 are not limited to a rectangle, and may be other shapes such as a circle. A laminate of the prepreg 10 and the metal foil 20 is referred to as a metal-clad laminate 25, and if the metal foil 20 is a copper foil, this may be referred to as a copper-clad laminate. In addition, although what is shown in FIG. 1 is a metal-clad laminated board with which metal foil was provided in the single side | surface, you may provide metal foil in the front and back both surfaces. The number of resin layers and metal layers included in the metal-clad laminate 25 is arbitrary.

For example, after the metal-clad laminate 25 is first prepared, the release agent layer 30 is laminated on the metal foil 20 of the metal-clad laminate 25. Also good. Or after laminating the release agent layer 30 and the metal foil 20 and preparing a metal foil with a release agent layer in advance, the metal foil with a release agent layer and the prepreg 10 may be laminated. The release agent layer 30 may be formed by utilizing an arbitrary coating method. The layers may be tightly integrated by using a heating press.

As shown in FIGS. 2 and 3, one or more buildup layers 110 are laminated on the release agent layer 30 of the base substrate 100. The build-up layer 110 is a laminate of one insulating layer 40 and one wiring layer 50, and FIG. 2 exemplarily shows a build-up layer 110 having a two-layer structure. The insulating layer 40 of the build-up layer 110 is preferably made of a thermosetting resin layer, and more preferably made of a prepreg in which the thermosetting resin is reinforced with glass fiber, an inorganic filler or the like. The wiring layer 50 of the buildup layer 110 is preferably a patterned or non-patterned metal layer, preferably a metal foil or a plated metal layer, and copper is more preferable as the material of the metal foil or the plated metal layer. It is. The buildup layer 110 is formed by repeatedly laminating the insulating layer 40 and the wiring layer 50 in order. After the buildup layer 110 is laminated on the base substrate 100, the buildup layer 110 is separated from the base substrate 100, whereby the buildup layer 110 can be suitably obtained as a thin multilayer printed wiring board.

In the multilayer printed wiring board manufactured in this way, the base substrate 100 used for stacking the buildup layer 110 is not included. In this sense, it can be said that the multilayer printed wiring board according to the present embodiment has a “thin” configuration. “Thin” means, for example, that the thickness of the multilayer printed wiring board is 400 μm or less, preferably 200 μm or less, more preferably 100 μm or less. However, when the number of wiring layers is extremely large (for example, 10 layers or more) or when an insulating layer or wiring layer thicker than 100 μm is required for the function of the multilayer printed wiring board, the multilayer printed wiring board The thickness may exceed 400 μm.

In the stacking process of the build-up layer 110, the base substrate 100 itself is also heated or physically or chemically treated, and in some cases, immersed in a chemical solution. Even after going through such a process, as schematically shown in FIG. 3, the separation between the buildup layer 110 and the base substrate 100, that is, the releasability is ensured. Preferably, the release agent layer 30 remains on the prepreg 10 side, but this is not necessarily the case.

The constituent materials and layer thicknesses of the insulating layer 40 and the wiring layer 50 are arbitrary, and one wiring layer 50 may be composed of a stack of one or more conductive layers, and one insulating layer 40 may have one or more insulating layers. You may comprise from lamination | stacking of a layer. The wiring layer 50 is composed of, for example, one or more metal foils. The insulating layer 40 is composed of one or more resin layers. It is desirable that the insulating layer 40 has high insulating properties, but this is not necessarily the case. The wiring layer 50 does not necessarily have to be patterned and does not necessarily have to be electrically connected to other wiring layers. Providing the floating wiring layer 50 may be effective when controlling the electrostatic capacity or adjusting the mechanical strength of the multilayer printed wiring board.

The specific configuration of the buildup layer 110 is arbitrary. For example, the buildup layer 110 includes one or more insulating layers 40 and one or more wiring layers 50. For example, one or more wiring layers 50 included in the buildup layer 110 are patterned or unpatterned metal foil. For example, one or more insulating layers 40 included in the buildup layer 110 are prepregs. For example, the build-up layer 110 includes a single-sided or double-sided metal-clad laminate.

The prepreg 10 that functions as a plate-like carrier or support substrate for the metal foil 20 is a composite of an arbitrary base material and an arbitrary filling material. Typically, the base material such as a nonwoven fabric or a woven fabric is filled with a synthetic resin or the like. It is obtained by solidifying the filling material from a liquid while impregnating the material. The prepreg 10 has a high insulating property and a desired mechanical strength. The resin that is a constituent material of the prepreg 10 is illustratively a phenol resin, a polyimide resin, an epoxy resin, natural rubber, pine resin, and the like. The prepreg 10 is preferably in a B-stage state, thereby ensuring sufficient strength.

The prepreg 10 desirably has a high glass transition temperature Tg. The glass transition temperature Tg of the prepreg 10 is, for example, 120 to 320 ° C., preferably 170 to 240 ° C. The glass transition temperature Tg is a value measured by DSC (differential scanning calorimetry).

The thickness of the prepreg 10 is not particularly limited, and is set to a thickness that has flexibility or a thickness that does not have flexibility. However, since it is desirable that the substrate in the base substrate 100 has mechanical strength and rigidity, it is not appropriate to make it extremely thin. Further, if the prepreg 10 is extremely thick, heat propagation through the prepreg 10 is difficult to occur, and therefore, a non-uniform heat distribution occurs in the plane of the prepreg 10 during hot pressing, making it difficult to achieve sufficient hot pressing. There is a fear. In view of this point, the thickness of the prepreg 10 is set to 50 to 900 μm, more preferably 100 to 400 μm.

As the metal foil 20, a copper or copper alloy foil is typical, but a foil of aluminum, nickel, zinc or the like can also be used. In the case of copper or copper alloy foil, electrolytic foil or rolled foil can be used. By utilizing the copper alloy, the hardness of the metal foil 20 can be increased. Examples of the copper alloy include high-purity copper alloys to which a small amount of beryllium or cadmium is added. The thickness of the metal foil 20 is typically 1 to 400 μm, preferably 5 to 70 μm.

The metal foil 20 may be surface treated. For example, metal plating for the purpose of imparting heat resistance (Ni plating, Ni—Zn alloy plating, Cu—Ni alloy plating, Cu—Zn alloy plating, Zn plating, Cu—Ni—Zn alloy plating, Co—Ni alloy plating, etc. ), Chromate treatment (including the case where one or more alloy elements such as Zn, P, Ni, Mo, Zr, Ti, etc. are contained in the chromate treatment liquid) for imparting rust prevention and discoloration resistance, surface roughness (For example, copper electrodeposition grains, Cu—Ni—Co alloy plating, Cu—Ni—P alloy plating, Cu—Co alloy plating, Cu—Ni alloy plating, Cu—Co alloy plating, And copper alloy plating such as Cu—As alloy plating and Cu—As—W alloy plating).

The roughening treatment on the metal foil 20 affects the peel strength between the metal-clad laminate 25 and the buildup layer 110. Similarly, the chromate treatment on the metal foil 20 has a great influence on the peel strength. Chromate treatment is important from the viewpoint of rust prevention and discoloration resistance, but since it tends to significantly increase the peel strength, it is also meaningful as a means for adjusting the peel strength.

For example, the glossy surface of the copper foil or copper alloy foil as the metal foil 20 may be subjected to nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn chromate) treatment under the following conditions.

(Nickel-zinc alloy plating)
Ni concentration 17g / L (added as NiSO ₄ )
Zn concentration 4g / L (added as ZnSO ₄ )
pH 3.1
Liquid temperature 40 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

(Chromate treatment)
Cr concentration 1.4g / L (added as CrO ₃ or K ₂ CrO ₇ )
Zn concentration 0.01 to 1.0 g / L (added as ZnSO ₄ )
Na ₂ SO ₄ concentration 10 g / L
pH 4.8
Liquid temperature 55 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

The metal foil 20 is laminated and fixed onto the prepreg 10 by thermocompression bonding using a hot press or the like. As hot pressing conditions, it is preferable to perform hot pressing at a pressure of 30 to 40 kg / cm ² and a temperature higher than the glass transition temperature of the prepreg 10.

The release agent layer 30 is selected from any material that is relatively strongly fixed to the metal foil 20 and that is relatively weakly fixed to the buildup layer 110 and, ultimately, the lowermost insulating layer 40. It is preferable. The lowermost insulating layer 40 is typically a resin layer, and preferably a prepreg. In the stacking process of the buildup layer 110 shown in FIG. 2, the base substrate 100 may be heated and chemically or physically processed. From such a viewpoint, it is desirable to ensure that the release agent layer 30 also has heat resistance and chemical resistance and is not easily altered or eroded by chemicals. The release agent layer 30 can be formed on the metal foil 20 by any method such as spin coating, dip coating, spray coating, and printing.

The upper surface of the metal foil 20 on which the release agent layer 30 is formed is a rough surface (M surface) or a glossy surface (S surface), but is preferably a glossy surface. Thereby, the variation in the roughness of the upper surface of the metal foil 20 can be suppressed, and the quality of the base substrate 100 can be stabilized. The layer thickness of the release agent layer 30 is typically 0.001 to 10 μm, preferably 0.001 to 0.1 μm.

(1) Silane Compound The constituent material of the release agent layer 30 should not be limited to materials disclosed in the present application or currently available. For example, a silane compound represented by the following chemical formula and a hydrolysis product thereof A condensate of the hydrolysis product may be used alone or in combination.

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)

The silane compound must have at least one alkoxy group. A hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom When a substituent is comprised only by group, there exists a tendency for the adhesiveness of the mold release agent layer 30 and the metal foil 20 to fall too much. The silane compound is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom. It is necessary to have at least one. This is because when the hydrocarbon group does not exist, the adhesion between the release agent layer 30 and the metal foil 20 tends to increase. The alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms.

In adjusting the peel strength between the metal-clad laminate 25 and the build-up layer 110 to a range described later, the silane compound has three alkoxy groups and the above hydrocarbon groups (one or more hydrogen atoms are substituted with halogen atoms). It is preferable that it has one hydrocarbon group. In the above formula, both R ³ and R ⁴ are alkoxy groups.

Alkoxy groups include, but are not limited to, methoxy, ethoxy, n- or iso-propoxy, n-, iso- or tert-butoxy, n-, iso- or neo-pentoxy, n-hexoxy Group, cyclohexyloxy group, n-heptoxy group, n-octoxy group and the like, straight chain, branched or cyclic carbon number of 1-20, preferably carbon number of 1-10, more preferably carbon number of 1- 5 alkoxy groups. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

Examples of the alkyl group include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, and n-hexyl. A linear or branched alkyl group having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as a group, n-octyl group and n-decyl group.

Examples of the cycloalkyl group include, but are not limited to, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and the like, which have 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms. An alkyl group is mentioned.

The aryl group includes a phenyl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, etc., having 6 to 20, preferably 6 to 14 carbon atoms. An aryl group is mentioned.

In these hydrocarbon groups, one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo-pentyl. Trimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, phenyltrimethoxysilane; alkyl-substituted phenyltrimethoxysilane (eg, p- (methyl) phenyltrimethoxysilane), methyltriethoxysilane, ethyl Triethoxysilane, n- or iso-propyltriethoxysilane, n-, iso- or tert-butyltriethoxysilane, pentyltriethoxysilane, hexyltriethoxysilane, octyltriethoxy Silane, decyltriethoxysilane, phenyltriethoxysilane, alkyl-substituted phenyltriethoxysilane (eg, p- (methyl) phenyltriethoxysilane), (3,3,3-trifluoropropyl) trimethoxysilane, and trideca Fluorooctyltriethoxysilane, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane, trimethylfluorosilane, dimethyldibromosilane, diphenyldibromosilane, their hydrolysis products, and condensates of these hydrolysis products Etc. Among these, propyltrimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane, and decyltrimethoxysilane are preferable from the viewpoint of availability.

(2) Compound having two or less mercapto groups in the molecule Instead of the silane compound described above, a compound having two or less mercapto groups in the molecule may be used for the release agent layer 30. Examples thereof include thiol, dithiol, thiocarboxylic acid or a salt thereof, dithiocarboxylic acid or a salt thereof, thiosulfonic acid or a salt thereof, and dithiosulfonic acid or a salt thereof, and at least one selected from these is used. be able to.

Thiol has one mercapto group in the molecule and is represented by, for example, R-SH. Here, R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.

Dithiol has two mercapto groups in the molecule and is represented by, for example, R (SH) ₂ . R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. Two mercapto groups may be bonded to the same carbon, or may be bonded to different carbons or nitrogens.

The thiocarboxylic acid is one in which a hydroxyl group of an organic carboxylic acid is substituted with a mercapto group, and is represented by, for example, R—CO—SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The thiocarboxylic acid can also be used in the form of a salt. A compound having two thiocarboxylic acid groups can also be used.

Dithiocarboxylic acid is one in which two oxygen atoms in the carboxy group of an organic carboxylic acid are substituted with sulfur atoms, and is represented by, for example, R- (CS) -SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. Dithiocarboxylic acid can also be used in the form of a salt. A compound having two dithiocarboxylic acid groups can also be used.

The thiosulfonic acid is obtained by replacing the hydroxyl group of an organic sulfonic acid with a mercapto group, and is represented by, for example, R (SO ₂ ) -SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. Further, thiosulfonic acid can be used in the form of a salt.

Dithiosulfonic acid is one in which two hydroxyl groups of organic disulfonic acid are substituted with mercapto groups, and is represented by, for example, R-((SO ₂ ) -SH) ₂ . R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. Two thiosulfonic acid groups may be bonded to the same carbon, or may be bonded to different carbons. Dithiosulfonic acid can also be used in the form of a salt.

Here, examples of the aliphatic hydrocarbon group suitable as R include an alkyl group and a cycloalkyl group, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.

Examples of the alkyl group include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, n And straight-chain or branched alkyl groups having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as -hexyl group, n-octyl group, and n-decyl group. .

Further, the cycloalkyl group is not limited, but it has 3 to 10 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, etc., preferably 5 to 7 carbon atoms. Of the cycloalkyl group.

In addition, examples of suitable aromatic hydrocarbon groups as R include phenyl groups, phenyl groups substituted with alkyl groups (eg, tolyl groups, xylyl groups), 1- or 2-naphthyl groups, anthryl groups, and the like. -20, preferably 6-14 aryl groups, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.

Also, examples of the heterocyclic group suitable as R include imidazole, triazole, tetrazole, benzimidazole, benzotriazole, thiazole, and benzothiazole, which may contain either or both of a hydroxyl group and an amino group.

Preferred examples of the compound having two or less mercapto groups in the molecule include 3-mercapto-1,2, propanediol, 2-mercaptoethanol, 1,2-ethanedithiol, 6-mercapto-1-hexanol, 1- Octanethiol, 1-dodecanethiol, 10-hydroxy-1-dodecanethiol, 10-carboxy-1-dodecanethiol, 10-amino-1-dodecanethiol, sodium 1-dodecanethiolsulfonate, thiophenol, thiobenzoic acid, Examples include 4-amino-thiophenol, p-toluenethiol, 2,4-dimethylbenzenethiol, 3-mercapto-1,2,4 triazole, and 2-mercapto-benzothiazole. Of these, 3-mercapto-1,2-propanediol is preferred from the viewpoint of water solubility and waste disposal.

(3) Metal alkoxide An aluminate compound, titanate compound, zirconate compound having a structure represented by the following formula, or a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a metal alkoxide) alone Or by using a mixture of a plurality of layers and laminating the insulating layer 40 on the metal-clad laminate 25, the adhesiveness is appropriately lowered, and the peel strength can be adjusted to a range as described later.

In the formula, R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms. Any one of these substituted hydrocarbon groups, M is any one of Al, Ti, and Zr, n is 0, 1 or 2, m is an integer from 1 to M, and R ^At least one of ¹ is an alkoxy group. M + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr.

The metal alkoxide must have at least one alkoxy group. A hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom When a substituent is comprised only by group, there exists a tendency for the adhesiveness of the surface of the metal foil 20 of the metal-clad laminated board 25 and the insulating layer 40 to fall too much. The metal alkoxide is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom. It is necessary to have 0-2. This is because when there are three or more hydrocarbon groups, the adhesion between the surface of the metal foil 20 of the metal-clad laminate 25 and the insulating layer 40 tends to be excessively lowered. The alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms. In adjusting the peel strength between the metal-clad laminate 25 and the build-up layer 110 within the range described below, the metal alkoxide has two or more alkoxy groups and the hydrocarbon group (one or more hydrogen atoms are replaced by halogen atoms). Preferably one or two of them).

Examples of the alkyl group include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, n And straight-chain or branched alkyl groups having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as -hexyl group, n-octyl group, and n-decyl group. .

Further, the cycloalkyl group is not limited, but it has 3 to 10 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, etc., preferably 5 to 7 carbon atoms. Of the cycloalkyl group.

Further, examples of the aromatic hydrocarbon group suitable as R ² include a phenyl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, and the like. Examples thereof include 6 to 20, preferably 6 to 14, aryl groups, and these hydrocarbon groups may contain one or both of a hydroxyl group and an amino group.
In these hydrocarbon groups, one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred aluminate compounds include trimethoxyaluminum, methyldimethoxyaluminum, ethyldimethoxyaluminum, n- or iso-propyldimethoxyaluminum, n-, iso- or tert-butyldimethoxyaluminum, n-, iso- or neo- Pentyl dimethoxy aluminum, hexyl dimethoxy aluminum, octyl dimethoxy aluminum, decyl dimethoxy aluminum, phenyl dimethoxy aluminum; alkyl-substituted phenyl dimethoxy aluminum (for example, p- (methyl) phenyl dimethoxy aluminum), dimethylmethoxy aluminum, triethoxy aluminum, methyl diethoxy aluminum Ethyldiethoxyaluminum, n- or iso-propyldiethyl Aluminum, n-, iso- or tert-butyldiethoxyaluminum, pentyldiethoxyaluminum, hexyldiethoxyaluminum, octyldiethoxyaluminum, decyldiethoxyaluminum, phenyldiethoxyaluminum, alkyl-substituted phenyldiethoxyaluminum (eg p -(Methyl) phenyldiethoxyaluminum), dimethylethoxyaluminum, triisopropoxyaluminum, methyldiisopropoxyaluminum, ethyldiisopropoxyaluminum, n- or iso-propyldiethoxyaluminum, n-, iso- or tert-butyl Diisopropoxy aluminum, pentyl diisopropoxy aluminum, hexyl diisopropoxy aluminum, octyl dii Propoxyaluminum, decyldiisopropoxyaluminum, phenyldiisopropoxyaluminum, alkyl-substituted phenyldiisopropoxyaluminum (eg, p- (methyl) phenyldiisopropoxyaluminum), dimethylisopropoxyaluminum, (3,3,3-tri Fluoropropyl) dimethoxyaluminum and tridecafluorooctyldiethoxyaluminum, methyldichloroaluminum, dimethylchloroaluminum, dimethylchloroaluminum, phenyldichloroaluminum, dimethylfluoroaluminum, dimethylbromoaluminum, diphenylbromoaluminum, their hydrolysis products, And condensates of these hydrolysis products. Among these, from the viewpoint of availability, trimethoxyaluminum, triethoxyaluminum, and triisopropoxyaluminum are preferable.

Examples of preferred titanate compounds include tetramethoxy titanium, methyl trimethoxy titanium, ethyl trimethoxy titanium, n- or iso-propyl trimethoxy titanium, n-, iso- or tert-butyl trimethoxy titanium, n-, iso- Or neo-pentyltrimethoxytitanium, hexyltrimethoxytitanium, octyltrimethoxytitanium, decyltrimethoxytitanium, phenyltrimethoxytitanium; alkyl-substituted phenyltrimethoxytitanium (eg p- (methyl) phenyltrimethoxytitanium), dimethyldimethoxy Titanium, tetraethoxy titanium, methyl triethoxy titanium, ethyl triethoxy titanium, n- or iso-propyl triethoxy titanium, n-, iso- or tert-butyl triethoxy titanium, Nitrotriethoxytitanium, hexyltriethoxytitanium, octyltriethoxytitanium, decyltriethoxytitanium, phenyltriethoxytitanium, alkyl-substituted phenyltriethoxytitanium (eg p- (methyl) phenyltriethoxytitanium), dimethyldiethoxytitanium , Tetraisopropoxytitanium, methyltriisopropoxytitanium, ethyltriisopropoxytitanium, n- or iso-propyltriethoxytitanium, n-, iso- or tert-butyltriisopropoxytitanium, pentyltriisopropoxytitanium, hexyltri Isopropoxytitanium, octyltriisopropoxytitanium, decyltriisopropoxytitanium, phenyltriisopropoxytitanium, alkyl-substituted phenyltriisopropoxytitanium ( For example, p- (methyl) phenyltriisopropoxytitanium), dimethyldiisopropoxytitanium, (3,3,3-trifluoropropyl) trimethoxytitanium, and tridecafluorooctyltriethoxytitanium, methyltrichlorotitanium, dimethyldichloro Examples include titanium, trimethylchlorotitanium, phenyltrichlorotitanium, dimethyldifluorotitanium, dimethyldibromotitanium, diphenyldibromotitanium, hydrolysis products thereof, and condensates of these hydrolysis products. Among these, tetramethoxy titanium, tetraethoxy titanium, and tetraisopropoxy titanium are preferable from the viewpoint of availability.

Examples of preferred zirconate compounds include tetramethoxyzirconium, methyltrimethoxyzirconium, ethyltrimethoxyzirconium, n- or iso-propyltrimethoxyzirconium, n-, iso- or tert-butyltrimethoxyzirconium, n-, iso- Or neo-pentyltrimethoxyzirconium, hexyltrimethoxyzirconium, octyltrimethoxyzirconium, decyltrimethoxyzirconium, phenyltrimethoxyzirconium; alkyl-substituted phenyltrimethoxyzirconium (eg, p- (methyl) phenyltrimethoxyzirconium), dimethyldimethoxy Zirconium, tetraethoxyzirconium, methyltriethoxyzirconium, ethyltriethoxyzirconium, -Or iso-propyltriethoxyzirconium, n-, iso- or tert-butyltriethoxyzirconium, pentyltriethoxyzirconium, hexyltriethoxyzirconium, octyltriethoxyzirconium, decyltriethoxyzirconium, phenyltriethoxyzirconium, alkyl-substituted phenyl Triethoxyzirconium (eg, p- (methyl) phenyltriethoxyzirconium), dimethyldiethoxyzirconium, tetraisopropoxyzirconium, methyltriisopropoxyzirconium, ethyltriisopropoxyzirconium, n- or iso-propyltriethoxyzirconium, n -, Iso- or tert-butyltriisopropoxyzirconium, pentyltriisopropoxy Luconium, hexyltriisopropoxyzirconium, octyltriisopropoxyzirconium, decyltriisopropoxyzirconium, phenyltriisopropoxyzirconium, alkyl-substituted phenyltriisopropoxyzirconium (eg, p- (methyl) phenyltriisopropoxytitanium), dimethyldi Isopropoxyzirconium, (3,3,3-trifluoropropyl) trimethoxyzirconium, and tridecafluorooctyltriethoxyzirconium, methyltrichlorozirconium, dimethyldichlorozirconium, trimethylchlorozirconium, phenyltrichlorozirconium, dimethyldifluorozirconium, dimethyldibromo Zirconium, diphenyldibromozirconium and their hydrolysis Products, and condensates of these hydrolysis products. Among these, tetramethoxyzirconium, tetraethoxyzirconium, and tetraisopropoxyzirconium are preferable from the viewpoint of availability.

It can be manufactured by bringing the insulating layer 40 into close contact with the base substrate 100 by hot pressing. For example, the metal alkoxide is applied to the bonding surface of the metal foil 20 in the molecule, and then the base substrate 100 is hot-press laminated with a B-stage resin insulating layer 40. Is possible.

Metal alkoxide can be used in the form of an aqueous solution. Alcohols such as methanol and ethanol can be added in order to increase the solubility in water. The addition of alcohol is particularly effective when a highly hydrophobic metal alkoxide is used.

The higher the concentration of the metal alkoxide in the aqueous solution, the lower the peel strength between the metal-clad laminate 25 and the build-up layer 110, and the peel strength can be adjusted by adjusting the metal alkoxide concentration. Although not limited, the concentration of the metal alkoxide in the aqueous solution can be 0.001 to 1.0 mol / L, and typically 0.005 to 0.2 mol / L.

The pH of the aqueous solution of metal alkoxide is not particularly limited and can be used on either the acidic side or the alkaline side. For example, it can be used at a pH in the range of 3.0 to 10.0. From the standpoint that no special pH adjustment is required, the pH is preferably in the range of 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0. .

(4) Release agent layer made of resin coating film Release agent layer composed of silicone and any one or more resins selected from epoxy resins, melamine resins and fluororesins As a result, the insulating layer 40 and the base substrate 100 may be bonded together, the adhesiveness is appropriately reduced, and the peel strength can be adjusted to a range as described later.

As described later, the adjustment of the peel strength for realizing such adhesion is composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin. This is done by using a resin coating. Such a resin coating film is subjected to a baking process under predetermined conditions as will be described later, and is hot-pressed and bonded between the metal-clad laminate 25 and the insulating layer 40, so that the adhesiveness is appropriately reduced. This is because the peel strength can be adjusted within the range described below.

Epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, brominated epoxy resin, amine type epoxy resin, flexible epoxy resin, hydrogenated bisphenol A type epoxy resin, phenoxy resin, Examples thereof include brominated phenoxy resin.

Examples of the melamine-based resin include methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin, and butyl alcohol-modified melamine resin. The melamine resin may be a mixed resin of the resin and a butylated urea resin, a butylated benzoguanamine resin, or the like.

The number average molecular weight of the epoxy resin is preferably 2000 to 3000, and the number average molecular weight of the melamine resin is preferably 500 to 1000. By having such a number average molecular weight, the resin can be made into a paint and the adhesive strength of the resin coating film can be easily adjusted to a predetermined range.

Also, examples of the fluororesin include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and polyvinyl fluoride.

Examples of silicone include methylphenyl polysiloxane, methyl hydropolysiloxane, dimethyl polysiloxane, modified dimethyl polysiloxane, and mixtures thereof. Here, the modification is, for example, epoxy modification, alkyl modification, amino modification, carboxyl modification, alcohol modification, fluorine modification, alkylaralkyl polyether modification, epoxy polyether modification, polyether modification, alkyl higher alcohol ester modification, polyester modification. And acyloxyalkyl modification, halogenated alkylacyloxyalkyl modification, halogenated alkyl modification, aminoglycol modification, mercapto modification, hydroxyl group-containing polyester modification, and the like.

In the resin coating film, if the film thickness is too small, the resin coating film is too thin and difficult to form, so that the productivity is likely to decrease. Moreover, even if a film thickness exceeds a fixed magnitude | size, the further improvement of the peelability of a resin coating film is not seen, but the manufacturing cost of a resin coating film tends to become high. From such a viewpoint, the resin coating film preferably has a thickness of 0.1 to 10 μm, and more preferably 0.5 to 5 μm. Moreover, the film thickness of a resin coating film is achieved by apply | coating a resin coating material by the predetermined application amount in the procedure mentioned later.

In the resin coating film, silicone functions as a release agent for the resin coating film. Therefore, if the total amount of the epoxy resin and the melamine resin is too much compared to silicone, the peel strength imparted by the resin coating between the metal-clad laminate 25 and the insulating layer 40 is increased. May be difficult to remove by hand. On the other hand, if the total amount of the epoxy resin and the melamine resin is too small, the above-described peeling strength is reduced, and thus the peeling may occur at the time of transportation or processing. From this viewpoint, the total of the epoxy resin and the melamine resin is preferably included in an amount of 10 to 1500 parts by weight, more preferably 20 to 800 parts by weight with respect to 100 parts by weight of silicone. Is preferred.

Fluorine resin also functions as a mold release agent, like silicone, and has the effect of improving the heat resistance of the resin coating film. If the fluororesin is too much compared to silicone, the above-mentioned peel strength becomes small, so that it may be peeled off during transport or processing, and the temperature required for the baking process described later increases, which is uneconomical. From this viewpoint, the fluororesin is preferably 0 to 50 parts by mass, more preferably 0 to 40 parts by mass with respect to 100 parts by mass of silicone.

The resin coating film is selected from SiO ₂ , MgO, Al ₂ O ₃ , BaSO _4, and Mg (OH) ₂ in addition to silicone, epoxy resin and / or melamine resin, and, if necessary, fluororesin 1 You may further contain the surface roughening particle | grains of a seed | species or more. When the resin coating film contains surface roughening particles, the surface of the resin coating film becomes uneven. Due to the unevenness, the surface of the metal foil 20 coated with the resin coating film becomes uneven and becomes a matte surface. The content of the surface roughening particles is not particularly limited as long as the resin coating is roughened, but it is preferably 1 to 10 parts by mass with respect to 100 parts by mass of silicone.

The particle diameter of the surface roughened particles is preferably 15 nm to 4 μm. Here, the particle diameter means an average particle diameter (average value of the maximum particle diameter and the minimum particle diameter) measured from a scanning electron microscope (SEM) photograph or the like. When the particle diameter of the surface roughened particles is within the above range, the unevenness on the surface of the resin coating film can be easily adjusted, and as a result, the unevenness on the surface of the metal foil 20 can be easily adjusted. Specifically, the amount of unevenness on the surface of the metal foil 20 is about 4.0 μm in terms of the maximum height roughness Ry defined by JIS.

Here, a method for manufacturing the base substrate 100 will be described. The base substrate 100 is obtained through a step of laminating the metal foil 20 on at least one surface of the prepreg 10 by thermocompression bonding or the like and a step of laminating the release agent layer 30 on the metal foil 20. The process of forming the release agent layer 30 on the metal foil 20 includes an application process and a baking process as follows.

(Coating process)
The coating step is a resin comprising, on the metal foil 20 of the metal-clad laminate 25, a silicone as a main agent, an epoxy resin as a curing agent, a melamine resin, and a fluororesin as a release agent as necessary. It is a step of applying a paint to form a resin coating film. The resin paint is obtained by dissolving an epoxy resin, a melamine resin, a fluororesin, and silicone in an organic solvent such as alcohol. The blending amount (addition amount) in the resin coating is preferably 10 to 1500 parts by mass of the total of the epoxy resin and the melamine resin with respect to 100 parts by mass of the silicone. The fluororesin is preferably 0 to 50 parts by mass with respect to 100 parts by mass of silicone.

The coating method in the coating process is not particularly limited as long as a resin coating film can be formed, but a gravure coating method, a bar coating method, a roll coating method, a curtain flow coating method, a method using an electrostatic coating machine, etc. are used. In view of the uniformity of the resin coating film and the ease of work, the gravure coating method is preferred. The coating amount is preferably 1.0 to 2.0 g / m ² so that the resin coating film 3 has a preferable film thickness: 0.5 to 5 μm.

The gravure coating method is a method in which a resin coating film is formed on the surface of the metal foil 20 by transferring the resin coating filled in the recesses (cells) provided on the roll surface to the metal-clad laminate 25. Specifically, the lower part of the lower roll having cells provided on the surface is immersed in the resin paint, and the resin paint is pumped into the cell by the rotation of the lower roll. Then, the metal-clad laminate 25 is supplied between the lower roll and the upper roll disposed on the upper side of the lower roll, and the upper roll and the upper roll are pressed while pressing the coating object against the lower roll with the upper roll. By rotating the roll, the metal-clad laminate 25 is conveyed, and the resin paint pumped into the cell is transferred (applied) to the surface of the metal foil 20 of the metal-clad laminate 25.

Further, by placing a doctor blade on the carry-in side of the metal-clad laminate 25 so as to contact the surface of the lower roll, excess resin paint pumped up on the roll surface other than the cells is removed, and the metal-clad laminate is removed. A predetermined amount of resin paint is applied to the surface of the plate 25. In addition, when the count (size and depth) of a cell is large, or when the viscosity of a resin coating is high, the resin coating film formed on one side of the metal-clad laminate 25 is difficult to be smooth. Therefore, a smoothing roll may be arranged on the carry-out side of the metal-clad laminate 25 to maintain the smoothness of the resin coating film.

In addition, when the metal-clad laminate 25 has metal foils on both the front and back surfaces, resin coatings may be individually formed on the surfaces of the metal foils on both sides of the metal-clad laminate 25. In this case, after forming the resin coating on one side of the metal-clad laminate, turn over the metal-clad laminate, and again supply the metal-clad laminate between the lower roll and the upper roll, Similarly, the resin paint in the cell of the lower roll is transferred (applied) to the back surface of the metal-clad laminate.

(Baking process)
The baking step is a step of subjecting the resin coating film formed in the coating step to a baking treatment at 125 to 320 ° C. (baking temperature) for 0.5 to 60 seconds (baking time). In this way, the peel strength between the metal-clad laminate 25 and the insulating layer 40 imparted by the resin coating film is obtained by subjecting the resin coating film formed of the resin coating of a predetermined blending amount to a baking process under a predetermined condition. Is controlled within a predetermined range. In the present invention, the baking temperature is the temperature reached by the coating object. Moreover, a conventionally well-known apparatus is used as a heating means used for a baking process.

When the baking is insufficient, for example, when the baking temperature is less than 125 ° C. or when the baking time is less than 0.5 seconds, the resin coating becomes insufficiently cured, and the peel strength exceeds 200 gf / cm, The peelability is reduced. Moreover, when baking is an excessive condition, for example, when baking temperature exceeds 320 degreeC, a resin coating film deteriorates, the said peeling strength exceeds 200 gf / cm, and the workability | operativity at the time of peeling deteriorates. Alternatively, the coating object may be altered by high temperatures. Further, when the baking time exceeds 60 seconds, the productivity is deteriorated.

Regarding the manufacturing method of the base substrate 100, the resin coating in the application step includes silicone as a main agent, epoxy resin as a curing agent, melamine resin, fluororesin as a release agent, SiO ₂ , MgO, al ₂ O _3, BaSO ₄ and Mg (OH) may be made of one or more surface roughening particles selected from _2.

Specifically, the resin paint is obtained by further adding surface roughening particles to the above-described silicone-added resin solution. By further adding such surface-roughening particles to the resin coating, the surface of the resin coating becomes uneven, and the metal foil 20 becomes uneven due to the unevenness, resulting in a matte surface. In order to obtain the metal foil 20 having such a matte surface, the compounding amount (addition amount) of the surface roughening particles in the resin coating is 1 to 10 parts by mass with respect to 100 parts by mass of the silicone. It is preferable. Further, it is more preferable that the surface roughened particles have a particle size of 15 nm to 4 μm.

The manufacturing method according to the present embodiment is as described above. However, other steps may be included between or before and after each step in performing the present embodiment. For example, a cleaning process for cleaning the surface of the metal foil 20 may be performed before the coating process.

As described at the beginning, the insulating layer 40 made of a resin layer laminated on the base substrate 100 may have the same configuration as the prepreg 10 that functions as a carrier of the metal foil 20 in the base substrate 100. It may be a different configuration. If the mechanical strength of the insulating layer 40 may be lower than the mechanical strength of the prepreg 10 of the base substrate 100, the insulating layer 40 may be made thinner than the prepreg 10.

It is desirable to sufficiently fix the insulating layer 40 on the base substrate 100 in the build-up layer 110 stacking step, and on the other hand, the insulating layer 40 and the base substrate 100 can be easily peeled off after the build-up layer 110 stacking step. It is desirable to set the peel strength between the insulating layer 40 and the base substrate 100 based on the viewpoint of ensuring the above. In addition, adjustment of peeling strength can be adjusted with the setting of the material and thickness of the above-mentioned mold release agent layer 30, and can be adjusted with surface treatment of the metal foil 20 or the insulating layer 40.

Before the buildup layer 110 is laminated, the peel strength between the metal-clad laminate 25 and the buildup layer 110 is typically 10 gf / cm or higher, preferably 30 gf / cm or higher, more preferably 50 gf / cm or higher. , Typically 200 gf / cm or less, preferably 150 gf / cm or less, more preferably 80 gf / cm or less. By setting the peel strength between the metal-clad laminate 25 and the buildup layer 110 in this manner, the positional deviation of the insulating layer 40 on the base substrate 100 can be suppressed, and the buildup layer 110 is laminated. Later, appropriate peelability between the base substrate 100 and the buildup layer 110 can be ensured.

Desirably, the peel strength between the metal-clad laminate 25 and the buildup layer 110 does not vary greatly even after the buildup layer 110 is laminated. Thereby, it can avoid that the peelability between the base base material 100 and the buildup layer 110 after the lamination process of the buildup layer 110 is impaired.

For example, the peel strength between the metal-clad laminate 25 and the buildup layer 110 after heating at 220 ° C. for 3 hours, 6 hours, or 9 hours is typically 10 gf / cm or more, preferably 30 gf. / Cm or more, more preferably 50 gf / cm or more, typically 200 g / fcm or less, preferably 150 gf / cm or less, more preferably 80 gf / cm or less.

Regarding the peel strength after heating at 220 ° C., the peel strength was described above in both 3 hours and 6 hours, or in both 6 hours and 9 hours, from the viewpoint of being able to cope with various lamination numbers. It is preferable to satisfy the range, and it is further preferable that all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above-described range.

In the present invention, the peel strength is measured in accordance with a 90 degree peel strength measuring method defined in JIS C6481.

In conventional CCL, since it is desired that the peel strength between the resin and the copper foil is high, for example, the matte surface (M surface) of the electrolytic copper foil is used as an adhesive surface with the resin, and surface treatment such as roughening treatment is performed. Thus, the adhesive strength is improved by the chemical and physical anchor effect. On the resin side, various binders are added to increase the adhesive strength with the copper foil. As described above, unlike the CCL, in this embodiment, it is desirable to finally peel the base substrate 100 and the insulating layer 40, and therefore it is not desirable that the peel strength is excessively high.

In order to adjust the peel strength between the metal-clad laminate 25 and the build-up layer 110 to the above-described preferable range, the surface roughness of the upper surface of the metal foil 20 was measured in accordance with JIS B 0601 (2001). When expressed by the ten-point average roughness (Rz jis) of the upper surface, it is preferably 3.5 μm or less, more preferably 3.0 μm or less. However, reducing the surface roughness as much as possible takes time and causes a cost increase. Therefore, the surface roughness is preferably 0.1 μm or more, and more preferably 0.3 μm or more. When an electrolytic copper foil is used as the metal foil 20, it is possible to use either a glossy surface (S surface) or a rough surface (M surface) by adjusting to such a surface roughness. Is easier to adjust to the surface roughness.

Depending on the embodiment, the surface treatment for improving the peel strength such as the roughening treatment is not performed on the bonding surfaces of the metal foil 20 and the insulating layer 40. Depending on the embodiment, a binder for increasing the adhesive strength with the base substrate 100 is not added to the insulating layer 40.

A method for manufacturing a multilayer printed wiring board will be described with reference to FIGS. First, the base substrate 100 shown in FIG. 1 is prepared. The manufacturing method of the base substrate 100 itself is clear from the above description. Typically, the metal foil 20 is laminated on the prepreg 10 by hot pressing with a hot press, and then released onto the metal foil 20. The agent layer 30 is formed by an arbitrary method. Although the metal foil 20 is laminated | stacked over the whole upper surface of the prepreg 10, it is not necessarily this limitation. The release agent layer 30 is laminated over the entire top surface of the metal foil 20, but this is not necessarily the case.

Next, the buildup layer 110 is laminated on the base substrate 100, whereby the buildup layer 110 is laminated on the metal-clad laminate 25 via the release agent layer 30. The wiring layer 50 in the buildup layer 110 may use a metal foil. Alternatively, the wiring layer 50 may be formed using at least one of a subtractive method, a full additive method, or a semi-additive method.

The subtractive method is a method of selectively removing unnecessary portions of metal foil on an arbitrary substrate such as a metal-clad laminate or a wiring board (including a printed wiring board and a printed circuit board) by etching or the like. Refers to the method of forming. The full additive method is a method of forming the wiring layer 50 that is a patterned conductor layer by using electroless plating and / or electrolytic plating. In the semi-additive method, for example, an electroless metal deposition and electrolytic plating, etching, or a combination of both are formed on a seed layer made of a metal foil, and then an unnecessary seed layer is etched away. This is a method for obtaining a conductor pattern.

As a constituent layer of the buildup layer 110, one or more of resin, single-sided or double-sided wiring board, single-sided or double-sided metal-clad laminate, metal foil with carrier, metal foil, or base substrate 100 may be included.

A hole is made in a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a prepreg 10 or metal foil 20 of the base substrate 100, or a resin, and conductive plating is performed on the side and bottom surfaces of the hole The process of carrying out can be further included. In addition, the process of forming wiring on at least one of the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal foil constituting the metal foil with carrier is performed once. It can further include performing the above.

It may further include a step of laminating a resin on the patterned wiring layer 50 and further laminating the base substrate 100 from the metal foil 20 side. A resin may be laminated on the patterned wiring layer 50, and a metal foil may be adhered to the resin. Moreover, the process of laminating | stacking resin on the surface in which wiring was formed, and laminating | stacking the metal foil with a carrier which made the metal foil adhere | attach both surfaces to the said resin can also be further included. The “surface on which the wiring is formed” means a portion where wiring is formed on the surface that appears every time a buildup is performed, and the buildup substrate includes both a final product and an intermediate product.

The “metal foil with carrier” is obtained by laminating a metal foil with a release agent layer on a resin carrier that functions as a support substrate. The same material as the release agent layer 30 disclosed in the present application can be used for the release agent layer that releasably bonds between the carrier and the metal foil in the metal foil with a carrier. The metal foil with a carrier is preferably a copper foil with a carrier.

A laminate obtained by laminating the buildup layer 110 on the base substrate 100 may be diced. The dicing depth does not need to be such that the laminated body to be diced is completely separated into pieces, and may not reach the base substrate 100. When the laminated body to be diced is not completely separated, a groove that reaches or does not reach the base substrate 100 is provided. The equipment used for dicing is not limited to the type utilizing a dicing blade, and any method such as wire or laser can be adopted.

After the above-described dicing step, the base substrate 100 and the buildup layer 110 may be separated and separated. When the base substrate 100 is not singulated by dicing, a plurality of individual build-up layers 110 can be obtained from the common base substrate 100 as individual multilayer printed wiring boards.

The insulating layer 40 and the wiring layer 50 in the buildup layer 110 may be laminated by thermocompression bonding. This thermocompression bonding may be performed every time one layer is stacked, may be performed after being laminated to some extent, or may be performed all at once at the end.

The number of the insulating layers 40 and the wiring layers 50 included in the buildup layer 110 and the stacking order are arbitrary. The number of stacked units composed of a set of the insulating layer 40 and the wiring layer 50 is typically 1 or more, and may be 2 or more, 3 or more, 4 or more. The increase in the number of laminated units makes it difficult to maintain the accuracy of the interlayer position of the multilayer printed wiring board. In the present embodiment, the multilayer printed wiring board is stably fixed on the base substrate 100, and the buildup layer 110 can be stably laminated on the insulating layer 40.

The wiring layer 50 is not limited to a metal foil or a patterned metal foil, and is preferably a copper foil or a patterned copper foil, but may be a metal plating layer formed by plating. Further, the wiring layer 50 may be formed by utilizing a normal semiconductor process technology. The wiring layer 50 is not intended to be particularly limited, but typically, a solid wiring layer formed by vapor deposition typified by CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) is utilized by using photolithography technology. Is formed by patterning. The wiring layer 50 is not necessarily patterned, and the wiring layer 50 may be a solid wiring layer. Patterning may be performed using lift-off technology.

The insulating layer 40 is a resin layer provided with a resin layer or via wiring (interlayer wiring), but is not limited thereto, and can typically be exemplified by a thermosetting resin or a photosensitive resin. The insulating layer 40 may be a prepreg reinforced with glass fiber or an inorganic filler. The constituent resin of the insulating layer 40 may be selected from materials having the same or similar characteristics as the prepreg 10. You may form into a film using the application | coating apparatuses of the arbitrary types represented by the die coder. Instead of this, or in combination with this, the wiring layer 50 may be formed by utilizing a normal semiconductor process technology. The insulating layer 40 is not particularly limited, but typically, an insulating material is formed by vapor deposition represented by CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), and the like. Accordingly, conductive vias are embedded to ensure electrical connection between the upper and lower wiring layers 50. The method for incorporating the conductive via into the insulating layer 40 is arbitrary. A mask layer having an opening is formed on the insulating layer 40 deposited on the wiring layer 50. Etching is performed through the mask layer to remove the insulating layer 40 in a range corresponding to the opening of the mask layer. A method of filling the conductive material in a range where 40 is removed can be exemplified. Such technology is the basis of semiconductor process technology and is obvious to those skilled in the art.

The wiring layer 50 is made of a conductive material such as copper, aluminum, or polysilicon. The insulating layer 40 is made of an insulating material such as silicon dioxide. The via incorporated in the insulating layer 40 is made of a conductive material such as copper, aluminum, or polysilicon.

Next, as schematically shown in FIG. 3, the buildup layer 110 and the base substrate 100 are separated. In this way, the buildup layer 110 can be efficiently manufactured as a multilayer printed wiring board.

In order to achieve further multilayering of the multilayer printed wiring board, another buildup layer may be laminated on the insulating layer 40 of the multilayer printed wiring board that has been in close contact with the base substrate 100. Of course, the surface of the insulating layer 40 of the multilayer printed wiring board that has been in close contact with the base substrate 100 may be used as a mounting surface on another mounting board, and mounting bumps or pins may be mounted. it can. Similarly, the surface of the base substrate 100 exposed by the separation of the buildup layer 110 and the base substrate 100 may be used as a mounting surface for other arbitrary elements.

Via wiring (interlayer wiring) may be formed in the buildup layer 110 in order to ensure electrical continuity between the wiring layers 50 in the buildup layer 110 or between the wiring layer 50 in the buildup layer 110 and external wiring. The process may be performed in the process of forming the buildup layer 110 on the base substrate 100, or may be performed after the buildup layers 110 having a predetermined number of layers are stacked on the base substrate 100. Via wiring may be formed in a state where the buildup layer 110 is laminated on the base substrate 100, or via wiring may be formed after the plate-like carrier of the base substrate 100 is peeled from the buildup layer 110. . For example, in the state where the lower wiring layer 50, the intermediate insulating layer 40, and the upper wiring layer 50 are formed on the base substrate 100, a via hole that penetrates the upper wiring layer 50 and the intermediate insulating layer 40 and reaches the lower wiring layer 50 is formed. Then, a conductive material is provided in the via hole by deposition or the like, thereby ensuring electrical conduction between the lower wiring layer 50 and the upper wiring layer 50. The via hole can be formed by any method such as mechanical cutting or laser processing. The number of insulating layers 40 through which the via hole passes is arbitrary, and may be two or more. Electrolytic plating may be used to fill the via hole with the conductive material.

Hereinafter, further exemplary embodiments will be described. On the above-mentioned base substrate 100, a desired number of prepregs and then a metal foil are repeatedly laminated one or more times in order, and the laminate is sandwiched between a set of flat plate plates and set in a hot press machine. A build-up layer can be formed on the base substrate by thermocompression molding at a temperature and pressure. As the flat plate, for example, a stainless plate can be used. Although the plate is not limited, for example, a thick plate of about 1 to 10 mm can be used. As described above, the build-up layer may be formed by one insulating layer and one metal layer, or may be formed at a time.

If necessary, a step of adjusting the thickness by half-etching the entire surface of the metal foil constituting the wiring layer 50 may be included. Laser processing is performed at a predetermined position of the metal foil constituting the wiring layer 50 to form a via hole penetrating the metal foil and the resin, and after applying a desmear process for removing smear in the via hole, the bottom of the via hole, the side surface and the metal Electroless plating may be performed on the entire surface or a part of the foil to form an interlayer connection, and further electrolytic plating may be performed as necessary. A plating resist may be formed in advance on each portion of the metal foil where electroless plating or electrolytic plating is unnecessary before performing each plating. In addition, when the electroless plating, the electrolytic plating, or the adhesion between the plating resist and the metal foil is insufficient, the surface of the metal foil may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, a circuit is formed by removing unnecessary portions of the metal foil and the electroless plating portion and the electrolytic plating portion by etching. In this way, a build-up substrate can be manufactured. The process from the lamination of the resin and the copper foil to the circuit formation may be repeated a plurality of times to form a multilayer build-up substrate.

The release agent layer 30 side of another base substrate 100 may be laminated on the top layer of the buildup layer 110.

Preferably, a prepreg containing a thermosetting resin may be used as the insulating layer 40 of the buildup layer 110.

Preferably, the insulating layer 40 is a resin layer, for example, a prepreg or a photosensitive resin. When a prepreg is used as the insulating layer 40, a via hole may be provided in the prepreg by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed. When a photosensitive resin is used as the resin, the resin in the via hole forming portion can be removed by a photolithography method. Next, electroless plating is performed on the bottom and side surfaces of the via hole, the entire surface or a part of the resin to form an interlayer connection, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, a circuit is formed by removing unnecessary portions of the electroless plating portion or the electrolytic plating portion by etching.

Second Embodiment
The second embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic cross-sectional view of the base substrate. FIG. 5 is a schematic cross-sectional view showing a state in which build-up layers are laminated on both surfaces of a base substrate. In the present embodiment, as shown in FIG. 4, a base substrate 100 is used in which a metal foil 20 and a release agent layer 30 are sequentially laminated on the lower surface (main surface) of the prepreg 10. Even in such a case, the same effect as the first embodiment can be obtained. In the case of this configuration, as schematically shown in FIG. 5, the buildup layers 110 can be laminated on both surfaces of the base substrate 100, and the utilization efficiency of the base substrate 100 can be effectively increased. The production efficiency of the printed wiring board can be increased.

In addition, the material and thickness of each metal foil 20 stuck on both surfaces of the prepreg 10 may be the same or different. This also applies to the material and thickness of the release agent layer 30 disposed in the upper layer and the lower layer of the prepreg 10. The same applies to the configuration and the number of stacked layers of each buildup layer 110 formed in the upper layer and the lower layer of the base substrate 100.

EXAMPLES Examples of the present invention will be described below together with comparative examples, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

<Experimental example 1>
A plurality of electrolytic copper foils (thickness 12 μm) were prepared, and nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn) were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions. Chromate) treatment was performed, and the 10-point average roughness (Rz jis: measured according to JIS B 0601 (2001)) of the S surface was set to 1.5 μm.

(Nickel-zinc alloy plating)
Ni concentration 17g / L (added as NiSO ₄ )
Zn concentration 4g / L (added as ZnSO ₄ )
pH 3.1
Liquid temperature 40 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

(Chromate treatment)
Cr concentration 1.4g / L (added as CrO ₃ or K ₂ CrO ₇ )
Zn concentration 0.01 to 1.0 g / L (added as ZnSO ₄ )
Na ₂ SO ₄ concentration 10 g / L
pH 4.8
Liquid temperature 55 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

For the treatment of the mold release agent on the S surface, an aqueous solution of the mold release agent was applied using a spray coater, and then the copper foil surface was dried in air at 100 ° C. Regarding the use conditions of the release agent, the type of release agent, the stirring time from when the release agent is dissolved in water to before application, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, the pH of the aqueous solution Is shown in the table of FIG.

The surface of the copper foil with a release agent layer obtained in this way, the side where the release agent is not treated, and the upper surface of the prepreg (manufactured by Nanya Plastic Co., Ltd., FR-4 prepreg) used as a plate carrier are bonded together Thereby, the base substrate which is a laminated body of a prepreg, copper foil, and a mold release agent layer was obtained.

On the side of the base substrate where the release agent is treated, a prepreg (manufactured by Nanya Plastic Co., FR-4 prepreg, thickness 62 μm) as an insulating layer and a copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd.) , JTC (product name), thickness 12 μm) was laminated by hot pressing to form a build-up layer. Assuming that a heat history is applied to the laminate comprising the base substrate and the buildup layer thus obtained during further heat treatment such as buildup layer formation, the conditions described in the table shown in FIG. 6 (here Then, heat treatment was performed at 220 ° C. for 3 hours. The peel strength at the interface between the base substrate and the insulating layer of the buildup layer in the obtained laminate and the laminate after further heat treatment was measured. Each result is shown in the table of FIG.

<Experimental Examples 2 to 11>
Using the copper foil, resin (prepreg), and release agent shown in the table of FIG. 6, a laminate composed of a base substrate and a buildup layer was produced in the same procedure as in Experimental Example 1. Each was evaluated in the same way as in Experimental Example 1. The results are shown in the table of FIG. In addition, the formation of the release material resin coating on the S surface in Experimental Example 11 was performed using a doctor blade after applying a resin coating composition having the composition shown in the table of FIG. 6 by the gravure coating method. The thickness was adjusted to 2-4 μm. Moreover, the applied resin coating film was baked by heating at 150 ° C. for 30 seconds. In addition, bisphenol A type epoxy resin is used as the epoxy resin shown in the table of FIG. 6, methyl ether melamine resin is used as the melamine resin, polytetrafluoroethylene is used as the fluororesin, and dimethyl silicone resin is used. Used dimethylpolysiloxane.

The types of copper foil release agent treated surfaces, surface treatment conditions and surface roughness Rz jis, release agent usage conditions, prepreg types, and copper foil and prepreg lamination conditions are shown in the table of FIG. It is as shown in.

Specific conditions for the roughening treatment, chromate treatment, and epoxysilane (treatment) in the surface treatment conditions of the copper foil mat (M) on the opposite side, which becomes the bonding surface with the plate-like carrier, are as follows. The surface roughness Rz jis of the matte surface after the roughening treatment and the epoxysilane treatment was 3.7 μm.

(Epoxysilane treatment)
Treatment liquid: 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0
Stirred at room temperature for 12 hours Treatment method: After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.

(Roughening treatment)
Cu concentration 20 g / L (added as CuSO ₄ )
H ₂ SO ₄ concentration 50 ~ 100g / L
As concentration 0.01-2.0 g / L (added as arsenite)
Liquid temperature 40 ℃
Current density 40-100A / dm ²
Plating time 0.1-30 seconds

(Chromate treatment)
Cr concentration 1.5 g / L (added as K ₂ Cr ₂ O ₇₎
Zn concentration 0.5g / L (added as zinc sulfate)
pH 3.2 to 4.3 (adjusted using sulfuric acid and potassium hydroxide)
Liquid temperature 40 ℃
Current density 1-5A / dm ²
Plating time 0.1-5 seconds

As shown in the table of FIG. 6, good results were obtained in Examples 1 to 11. In Examples 1 to 8 and 10, better results could be obtained. In Examples 1, 2, and 5 to 7, particularly good results could be obtained. In the evaluation of the peeling workability, “G” indicates that the release agent layer which is a resin layer was not destroyed and the buildup layer 110 could be peeled from the base substrate 100. Although the release agent layer was not destroyed and the buildup layer 110 could be peeled off from the base substrate 100, “−” indicates that the peeling occurred without peeling operation at a probability of 4 times or more out of 10 times. . A case where the release agent layer was destroyed or the buildup layer 110 could not be peeled from the base substrate 100 was indicated by “N”.

Example 12
FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals, JTC 12 μm (product name)) are sequentially stacked on both sides of the same base substrate as in Examples 1 to 11. Hot pressing was performed under a predetermined heating condition at a pressure of 3 MPa to prepare a four-layer copper-clad laminate.

Next, a 100 μm diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine. Subsequently, electroless copper plating on the copper foil surface on the copper foil with carrier exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate, and copper plating by electrolytic copper plating The electrical connection was formed between the copper foil on the copper foil with a carrier and the copper foil on the surface of the four-layer copper-clad laminate. Next, a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer buildup substrate was obtained.

Subsequently, in the four-layer buildup board, two sets of two-layer buildup wiring boards were obtained by separating the base substrate from the buildup layer. Peeling was also good.

Based on the above teaching, those skilled in the art can make various modifications to the embodiments. The stacking order of the insulating layer 40 and the wiring layer 50 in the buildup layer 110 may be reversed. Preferably, the wiring layer 50 is positioned at the uppermost layer of the buildup layer 110, thereby easily ensuring the electrical connection between the multilayer printed wiring board and the outside. The main surface of the plate carrier is typically the upper surface or the lower surface of the flat carrier.

10: Prepreg 20: Metal foil 25: Metal-clad laminate 30: Release agent layer 40: Insulating layer 50: Wiring layer

100: Base substrate 110: Build-up layer

Claims (37)

1. A step of preparing a plate carrier made of resin;
   A laminate in which a release agent layer is laminated on a metal foil is laminated on at least one main surface of the plate-like carrier, or on a metal foil previously laminated on at least one main surface of the plate-like carrier. Laminating a release agent layer, and laminating the release agent layer on the main surface of the plate carrier via the metal foil;
   A method for producing a base substrate for producing a multilayer printed wiring board, comprising:
2. Preparing a base substrate obtained by the manufacturing method according to claim 1;
   Laminating one or more buildup layers including a combination of an insulating layer and a wiring layer on the release agent layer of the base substrate;
   A method for manufacturing a multilayer printed wiring board including:
3. The manufacturing method of the multilayer printed wiring board of Claim 2 whose peeling strength of the said base base material and the said buildup layer is 10 gf / cm or more and 200 gf / cm or less.
4. The peel strength between the base substrate and the build-up layer after heating at 220 ° C for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the multilayer printed wiring board as described in 2 ..
5. The method for producing a multilayer printed wiring board according to any one of claims 2 to 4, wherein the layer thickness of the metal foil is in the range of 1 to 400 µm.
6. The method for producing a multilayer printed wiring board according to any one of claims 2 to 5, wherein the thickness of the plate-like carrier is 5 µm or more and 1000 µm or less.
7. The method for producing a multilayer printed circuit board according to any one of claims 2 to 6, wherein the layer thickness of the release agent layer is in the range of 0.001 to 10 µm.
8. The method for producing a multilayer printed wiring board according to any one of claims 2 to 7, wherein the metal foil is a copper foil or a copper alloy foil.
9. The method for producing a multilayer printed wiring board according to any one of claims 2 to 8, wherein the plate-like carrier is a prepreg.
10. The method for producing a multilayer printed wiring board according to any one of claims 2 to 9, wherein the plate-like carrier has a glass transition temperature Tg of 120 to 320 ° C.
11. The manufacturing method of the multilayer printed wiring board as described in any one of Claim 2 thru | or 10 which further includes the process of isolate | separating the said base base material and the said buildup layer.
12. The method for producing a multilayer printed wiring board according to claim 11, further comprising a step of laminating a buildup layer on the surface of the multilayer printed wiring board obtained by the process according to claim 11.
13. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 12, wherein the build-up layer includes one or more insulating layers and one or more wiring layers.
14. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 13, wherein the one or more wiring layers included in the build-up layer are patterned or unpatterned metal foil.
15. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 14, wherein the one or more insulating layers included in the buildup layer are thermosetting resins.
16. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 15, wherein the one or more insulating layers included in the build-up layer are prepregs.
17. The method for producing a multilayer printed wiring board according to any one of claims 2 to 16, wherein the build-up layer includes one or more single-sided or double-sided metal-clad laminates.
18. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 17, wherein the build-up layer is formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
19. The method for producing a multilayer printed wiring board according to any one of claims 2 to 18, further comprising a step of performing a dicing process on the laminate in which the buildup layer is laminated on the base substrate.
20. The dicing process forms one or more grooves in the laminate in which the build-up layer is laminated on the base substrate, and the build-up layer can be separated into pieces by the grooves. The manufacturing method of the multilayer printed wiring board as described.
21. The method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 20, further comprising a step of forming a via wiring for one or more insulating layers included in the build-up layer.
22. The release agent layer has the following formula:
    

    

    Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
    The manufacturing method of the multilayer printed wiring board as described in any one of Claims 2 thru | or 21 which uses the silane compound shown to these, its hydrolysis product, and the condensate of this hydrolysis product individually or in combination of two or more. .
23. The method for producing a multilayer printed wiring board according to any one of claims 2 to 21, wherein the release agent layer is formed using a compound having two or less mercapto groups in a molecule.
24. The release agent layer has the following formula:
    

    

    Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R ¹ is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
    The aluminate compound, the titanate compound, the zirconate compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in any one of claims 2 to 21 are used. Manufacturing method for multilayer printed wiring boards.
25. The any one of Claims 2 thru | or 21 in which the said mold release agent layer is a resin coating film comprised with silicone and any one or several resin selected from an epoxy resin, a melamine resin, and a fluororesin. A method for producing a multilayer printed wiring board according to claim 1.
26. A multilayer printed wiring board manufactured by the method for manufacturing a multilayer printed wiring board according to any one of claims 2 to 25.
27. A base substrate used in a method for producing a multilayer printed wiring board,
    A resin plate carrier;
    A metal foil laminated on at least one main surface of the plate carrier;
    And a release agent layer laminated on the main surface of the plate carrier via the metal foil.
28. The base substrate according to claim 27, wherein the thickness of the metal foil is in the range of 1 to 400 µm.
29. The base substrate according to claim 27 or 28, wherein the thickness of the plate-like carrier is 5 µm or more and 1000 µm or less.
30. The base substrate according to any one of claims 27 to 29, wherein a layer thickness of the release agent layer is in a range of 0.001 to 10 µm.
31. The base substrate according to any one of claims 27 to 30, wherein the metal foil is a copper foil or a copper alloy foil.
32. The base substrate according to any one of claims 27 to 31, wherein the plate-like carrier is a thermosetting resin.
33. The base substrate according to any one of claims 27 to 32, wherein the plate-like carrier is a prepreg.
34. The release agent layer has the following formula:
    

    

    Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
    The base substrate according to any one of claims 27 to 33, wherein the silane compound, a hydrolysis product thereof, and a condensate of the hydrolysis product are used singly or in combination.
35. The base substrate according to any one of claims 27 to 33, wherein the release agent layer is formed using a compound having two or less mercapto groups in the molecule.
36. The release agent layer has the following formula:
    

    

    Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by: M is any one of Al, Ti, Zr, n is 0 or 1 or 2, m is an integer from 1 to M valence, At least one of R ¹ is an alkoxy group, where m + n is the valence of M, that is, 3 for Al and 4 for Ti and Zr)
    The aluminate compound, the titanate compound, the zirconate compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in any one of claims 27 to 33 are used. Base substrate.
37. 34. Any one of claims 27 to 33, wherein the release agent layer is a resin coating film composed of silicone and any one or a plurality of resins selected from an epoxy resin, a melamine resin, and a fluororesin. A base substrate according to claim 1.

Images