WO2014054803A1 - Production method for multilayer printed wiring board, and base material - Google Patents

Production method for multilayer printed wiring board, and base material Download PDF

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Publication number
WO2014054803A1
WO2014054803A1 PCT/JP2013/077167 JP2013077167W WO2014054803A1 WO 2014054803 A1 WO2014054803 A1 WO 2014054803A1 JP 2013077167 W JP2013077167 W JP 2013077167W WO 2014054803 A1 WO2014054803 A1 WO 2014054803A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
multilayer printed
printed wiring
wiring board
group
Prior art date
Application number
PCT/JP2013/077167
Other languages
French (fr)
Japanese (ja)
Inventor
晃正 森山
倫也 古曳
雅史 石井
Original Assignee
Jx日鉱日石金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012-222581 priority Critical
Priority to JP2012222581 priority
Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Publication of WO2014054803A1 publication Critical patent/WO2014054803A1/en

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