TW201436687A - Production method for multilayer printed wiring board, and base material - Google Patents

Abstract

A production method for a base material used in the production of a multilayer printed wiring board includes: a step in which a resin, plate-like carrier is prepared and a step in which, either a stacked body having a mould-release-agent layer stacked upon a metal foil therein is stacked upon at least one main surface of the plate-like carrier, or the mould-release-agent layer is stacked upon the metal foil which has already been stacked upon the at least one main surface of the plate-like carrier, so that the mould-release-agent layer is stacked upon the main surface of the plate-like carrier, with the metal foil located therebetween.

Description

Method for manufacturing multilayer printed wiring substrate and base substrate

The present invention relates to a method of manufacturing a multilayer printed wiring board and a base substrate.

Regarding the multilayer printed wiring board, various developments have been made since the past. For example, Patent Document 1 discloses a configuration in which a prepreg is used as a carrier of a copper foil, and a copper foil is laminated on the prepreg.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-272589

The multilayer printed wiring board usually includes a buildup layer in which one or more wiring layers and one or more insulating layers are laminated on a resin base substrate. However, if the resin substrate is thinned, there are multiple layers. The printed wiring board is bent and deformed in the manufacturing step, or warp is generated, resulting in a failure in the mounting step. In view of the above, an object of the present invention is to provide a base substrate which functions as a support when manufacturing a thin multilayer printed wiring board having a different configuration from the prior art.

The method for producing a base substrate for producing a multilayer printed wiring board of the present invention comprises the steps of: preparing a resin-made plate-shaped carrier; and laminating a laminated layer of a release agent layer on the metal foil to the plate-shaped carrier. Laminating a release agent layer on at least one main surface or on a metal foil laminated on at least one main surface of the plate-shaped carrier, and laminating the metal foil on the main surface of the plate-shaped carrier The step of releasing the layer of the agent.

The method for producing a multilayer printed wiring board according to the present invention includes the steps of: preparing a base substrate obtained by the above-described production method; and laminating one or more insulating layers and wiring on the release agent layer of the base substrate The step of layering the layers.

It is preferable that the base substrate and the buildup layer have a peel strength of 10 gf/cm or more and 200 gf/cm or less.

Preferably, the base substrate and the build-up layer have a peel strength of 10 gf/cm or more and 200 gf/cm or less after heating at 220 ° C for at least one of 3 hours, 6 hours, or 9 hours.

Preferably, the layer thickness of the metal foil is in the range of 1 to 400 μm.

Preferably, the thickness of the plate-shaped carrier is 5 μm or more and 1000 μm or less.

It is preferable that the layer thickness of the above-mentioned release agent layer is in the range of 0.001 to 10 μm.

Preferably, the metal foil is a copper foil or a copper alloy foil.

Preferably, the above plate-shaped carrier is a prepreg.

Preferably, the plate-shaped carrier has a glass transition temperature Tg of from 120 to 320 °C.

Preferably, the method further comprises the step of separating the base substrate from the buildup layer.

It is preferable to further include a step of laminating a layer on the surface of the multilayer printed wiring board obtained by the above steps.

Preferably, the buildup layer includes one or more insulating layers and one or more wiring layers.

Preferably, the wiring layer of one or more layers included in the buildup layer is a patterned or unpatterned metal foil.

It is preferable that one or more insulating layers included in the buildup layer be a thermosetting resin.

Preferably, one or more insulating layers included in the buildup layer are prepregs.

Preferably, the buildup layer comprises one or more single-sided or double-sided metal-clad laminates.

Preferably, the buildup layer is formed by at least one of a subtractive method, a full additive method, or a semi-additive method.

It is preferable to further include a step of performing a dicing treatment on the layered body in which the buildup layer is laminated on the base substrate.

Preferably, the layered body in which the buildup layer is laminated on the base substrate is formed into one or more grooves by the dicing process, and the buildup layer can be singulated by the groove.

Preferably, the method further includes the step of forming via wirings for one or more insulating layers included in the buildup layer.

Preferably, the mold release agent layer is obtained by using a decane compound represented by the following formula, a hydrolyzed product thereof, or a condensate of the hydrolyzed product, either singly or in combination.

(wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, R ³ and R ⁴ are each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. Any of these atoms of the atom).

It is preferable that the release agent layer is a compound having two or less mercapto groups in the molecule.

It is preferable that the above-mentioned release agent layer is used alone or in combination of the aluminate compound, the titanate compound, the zirconate compound, the hydrolysis product, and the condensate of the hydrolysis product represented by the following formula. (R ¹ ) _m -M-(R ² ) _n

(wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, M is any one of Al, Ti, and Zr, n is 0, 1 or 2, m is an integer of 1 or more and valence of M, and at least one of R ¹ is an alkoxy group; m+n is the valence of M, that is, 3 in the case of Al and 4 in the case of Ti and Zr.

Preferably, the release agent layer is a resin coating film composed of polyoxymethylene and any one or a plurality of resins selected from the group consisting of an epoxy resin, a melamine resin, and a fluororesin.

A multilayer printed wiring board produced by the method for producing a multilayer printed wiring board according to any of the above.

The base substrate used in the method for producing a multilayer printed wiring board of the present invention comprises: a resin-made plate-shaped carrier; a metal foil laminated on at least one main surface of the plate-shaped carrier; and a layer formed by interposing the metal foil a release agent layer on the above main surface of the above plate-shaped carrier.

Preferably, the layer thickness of the metal foil is in the range of 1 to 400 μm.

Preferably, the thickness of the plate-shaped carrier is 5 μm or more and 1000 μm or less.

It is preferable that the layer thickness of the above-mentioned release agent layer is in the range of 0.001 to 10 μm.

Preferably, the metal foil is a copper foil or a copper alloy foil.

Preferably, the plate-shaped carrier is a thermosetting resin.

Preferably, the above plate-shaped carrier is a prepreg.

Preferably, the mold release agent layer is obtained by using a decane compound represented by the following formula, a hydrolyzed product thereof, or a condensate of the hydrolyzed product, either singly or in combination.

(wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, R ³ and R ⁴ are each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. Any of these atoms of the atom).

It is preferable that the release agent layer is a compound having two or less mercapto groups in the molecule.

It is preferable that the above-mentioned release agent layer is used alone or in combination of the aluminate compound, the titanate compound, the zirconate compound, the hydrolysis product, and the condensate of the hydrolysis product represented by the following formula. (R ¹ ) _m -M-(R ² ) _n

(wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, M is any one of Al, Ti, and Zr, n is 0, 1 or 2, m is an integer of 1 or more and valence of M, and at least one of R ¹ is an alkoxy group; m+n is the valence of M, that is, 3 in the case of Al and 4 in the case of Ti and Zr.

Preferably, the release agent layer is a resin coating film composed of polyoxymethylene and any one or a plurality of resins selected from the group consisting of an epoxy resin, a melamine resin, and a fluororesin.

According to the present invention, the buildup layer can be separated from the base substrate after the step of layer buildup, and the thin multilayer printed wiring board can be efficiently produced.

10‧‧‧Prepreg

20‧‧‧metal foil

25‧‧‧Metal laminate

30‧‧‧ release agent layer

40‧‧‧Insulation

50‧‧‧Wiring layer

100‧‧‧Base substrate

110‧‧‧Addition

Fig. 1 is a schematic cross-sectional view showing a base substrate according to a first embodiment of the present invention.

Fig. 2 is a schematic flow chart showing a state in which a buildup layer is formed on a base substrate in the first embodiment of the present invention.

Fig. 3 is a flow chart schematically showing a procedure of separating a multilayer printed wiring board from a base substrate in the first embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing a base substrate according to a second embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing a state in which a prepreg and a buildup layer are laminated on both surfaces of a base substrate according to a second embodiment of the present invention.

Fig. 6 is a table showing the test results of the examples of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments are not independent, and need not be described excessively, and those skilled in the art can appropriately combine them, and can understand the synergistic effects obtained by the combination. Repeated descriptions of the embodiments are omitted in principle.

<First embodiment>

The first embodiment will be described with reference to Figs. 1 to 3 . Figure 1 is a schematic cross-sectional view of a base substrate. Fig. 2 is a schematic view showing a state in which a buildup layer is formed on a base substrate. Fig. 3 is a view schematically showing the steps of the step of separating the multilayer printed wiring board from the base substrate.

As shown in Fig. 1, the base substrate 100 is provided with a thermosetting resin having a specific thickness as a plate-shaped carrier made of a resin, that is, a prepreg 10 in this example, and laminated on the upper surface of the prepreg 10 (main surface) The metal foil 20 on the metal foil 20 and the release agent layer 30 laminated on the upper surface of the prepreg 10 are laminated with the prepreg 10, the metal foil 20, and the release agent layer 30. Laminated body. Further, it is not necessary to form the metal foil 20 on the entire surface of the upper surface of the prepreg 10, and similarly, the release agent layer 30 is not required over the entire surface of the upper surface of the metal foil 20. The planar shape of the prepreg 10, the metal foil 20, and the release agent layer 30 is not limited to a rectangular shape, and may be other shapes such as a circular shape. The laminated body of the prepreg 10 and the metal foil 20 is referred to as a metal-clad laminate 25, and when the metal foil 20 is a copper foil, it may be referred to as a copper-clad laminate. Further, as shown in Fig. 1, a metal-clad laminate provided with a metal foil on one side may be provided, and a metal foil may be provided on both sides of the front surface. The number of the resin layer or the metal layer included in the metal-clad laminate 25 is arbitrary.

The order of lamination of the constituent layers of the base substrate 100 is arbitrary. For example, the metal clad laminate 25 may be prepared first, and then laminated on the metal foil 20 of the metal clad laminate 25. Molding layer 30. Alternatively, the release agent layer 30 may be laminated with the metal foil 20 to prepare a metal foil with a release agent layer, and then the metal foil of the release agent layer may be laminated with the prepreg 10. The release agent layer 30 can also be formed by applying any coating method. It is also possible to integrally bond the layers to each other by applying heat pressing.

As shown in FIGS. 2 and 3, one or more buildup layers 110 are laminated on the release agent layer 30 of the base substrate 100. The buildup layer 110 is a laminate of the insulating layer 40 of one layer and the wiring layer 50 of one layer. In FIG. 2, the buildup layer 110 of the two layers is illustrated. The insulating layer 40 of the buildup layer 110 is preferably composed of a thermosetting resin layer, and more preferably a prepreg which is reinforced by a glass fiber, an inorganic filler or the like from a thermosetting resin. The wiring layer 50 of the build-up layer 110 is suitably a patterned or unpatterned metal layer, suitably a metal foil or a metal plating layer, and is preferably a material of a metal foil or a metal plating layer, more preferably copper. The buildup layer 110 is formed by repeatedly laminating the insulating layer 40 and the wiring layer 50 in this order. After the buildup layer 110 is laminated on the base substrate 100, the buildup layer 110 is separated from the base substrate 100, whereby the buildup layer 110 can be suitably obtained in the form of a thin multilayer printed wiring board.

The multilayer printed wiring board manufactured in this manner does not include the base substrate 100 used for the buildup of the buildup layer 110. In this sense, the multilayer printed wiring board of the present embodiment is considered to have a "thin" configuration. The term "thin type" means, for example, that the thickness of the multilayer printed wiring board is 400 μm or less, preferably 200 μm or less, and more preferably 100 μm or less. However, in the case of the function of the multilayer printed wiring board, when the number of layers of the wiring layer is extremely large (for example, 10 or more layers) or when an insulating layer or a wiring layer thicker than 100 μm is required, a multilayer printed wiring board may exist. The case where the thickness exceeds 400 μm.

In the lamination step of the buildup layer 110, the base substrate 100 itself is also heated or Physical or chemical treatment, immersed in chemical liquids as appropriate. After such a step, the separation between the build-up layer 110 and the base substrate 100, which is schematically illustrated in FIG. 3, is also ensured to be directly peelable. The release agent layer 30 is preferably left on the side of the prepreg 10, but is not necessarily limited thereto.

The constituent material or layer thickness of the insulating layer 40 and the wiring layer 50 is arbitrary, and one wiring layer 50 may be formed by laminating one or more conductive layers, and one insulating layer 40 may be formed by laminating one or more insulating layers. The wiring layer 50 is made of, for example, one or more metal foils. The insulating layer 40 is composed of one or more resin layers. It is preferable that the insulation layer 40 has high insulation, but is not necessarily limited thereto. The wiring layer 50 does not need to be patterned, and does not need to be electrically connected to other wiring layers. There is a case where it is effective to provide the floating wiring layer 50 when controlling the electrostatic capacitance or adjusting the mechanical strength of the multilayer printed wiring board or the like.

The specific structure of the buildup layer 110 is arbitrary. For example, the buildup layer 110 includes one or more insulating layers 40 and one or more wiring layers 50. For example, the wiring layer 50 including one or more layers included in the build-up layer 110 is a patterned or unpatterned metal foil. For example, the insulating layer 40 of one or more layers included in the buildup layer 110 is a prepreg. For example, the build-up layer 110 comprises a single-sided or two-sided metal-clad laminate.

The prepreg 10 which functions as a plate-shaped carrier or a support substrate of the metal foil 20 is a composite of any base material and an arbitrary filler, and is typically in a state in which a base material such as a nonwoven fabric or a woven fabric is impregnated with a filler such as a synthetic resin. The filler material is obtained by solidification from a liquid. The prepreg 10 has high insulation and has a desired mechanical strength. The resin which is a constituent material of the prepreg 10 is exemplified by a phenol resin, a polyimide resin, an epoxy resin, a natural rubber, rosin or the like. The prepreg 10 is preferably in the B-stage state, whereby sufficient strength can be ensured.

The prepreg 10 is desirably having a higher glass transition temperature Tg. The glass transition temperature Tg of the prepreg 10 is, for example, 120 to 320 ° C, preferably 170 to 240 ° C. Furthermore, glass turn The shift temperature Tg is a value measured by DSC (Differential Scanning Calorimetry).

The thickness of the prepreg 10 is not particularly limited, and is set to have a thickness of flexibility or a thickness of no flexibility. However, it is desirable to have mechanical strength and rigidity as a substrate in the base substrate 100, and therefore it is not suitable for being extremely thin. Further, when the prepreg 10 is extremely thick, heat conduction through the prepreg 10 is less likely to occur, so that uneven heat distribution occurs in the plane of the prepreg 10 during hot pressing, and it is difficult to achieve sufficient hot pressing. After that. In view of this, the thickness of the prepreg 10 is set to 50 to 900 μm, more preferably 100 to 400 μm.

The metal foil 20 is typically a copper or copper alloy foil, and a foil such as aluminum, nickel or zinc may be used. In the case of copper or copper alloy foil, an electrolytic foil or a calendered foil can be used. The hardness of the metal foil 20 can be increased by applying a copper alloy. As the copper alloy, a small amount of a high-purity copper alloy to which ruthenium or cadmium is added can be exemplified. The thickness of the metal foil 20 is typically from 1 to 400 μm, suitably from 5 to 70 μm.

The metal foil 20 may also be subjected to a surface treatment. For example, metal plating for imparting heat resistance (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating) (Co-Ni alloy plating, etc.), chromate treatment for imparting rust prevention or discoloration resistance (including one or more kinds of Zn, P, Ni, Mo, Zr, Ti, etc. in the chromate treatment liquid) In the case of alloying elements, roughening treatment for adjusting surface roughness (for example, copper plating or Cu-Ni-Co alloy plating, Cu-Ni-P alloy plating, Cu-Co alloy plating, Cu- Ni alloy plating, Cu-As alloy plating, copper alloy plating such as Cu-As-W alloy plating, etc.).

Of course, the roughening treatment performed on the metal foil 20 affects the peel strength between the metal-clad laminate 25 and the build-up layer 110. Similarly, the chromate treatment applied to the metal foil 20 also has a large effect on the peel strength. Chromate treatment is rust-proof or discoloration-resistant From the viewpoint of the nature, it is important to find that the peel strength is remarkably increased. Therefore, it is also useful as a means for adjusting the peel strength.

For example, a nickel-zinc (Ni-Zn) alloy plating treatment and a chromate (Cr-Zn chromate) treatment may be performed on the shiny surface of the copper foil or the copper alloy foil as the metal foil 20 according to the following conditions.

(nickel-zinc alloy plating)

(chromate treatment)

The metal foil 20 is laminated on the prepreg 10 by thermocompression bonding by heat pressing or the like. As a condition of hot pressing, it is preferable to perform hot pressing at a temperature of 30 to 40 kg/cm ² and a temperature higher than the glass transition temperature of the prepreg 10.

The release agent layer 30 is preferably selected from any material that is relatively strongly fixed to the metal foil 20, and that is relatively weakly fixed to the build-up layer 110, and directly to the bottommost insulating layer 40. Further, the bottommost insulating layer 40 is typically a resin layer, suitably a prepreg. In the lamination step of the buildup layer 110 shown in FIG. 2, there is a case where the base substrate 100 is heated and chemically or physically treated. From this point of view, it is desirable to have heat resistance and chemical resistance even as the release agent layer 30, and it is ensured that it does not easily deteriorate or is corroded by chemicals. The release agent layer 30 can be formed on the metal foil 20 by any method such as spin coating, dip coating, spray coating, or printing.

The upper surface of the metal foil 20 on which the release agent layer 30 is formed is a rough surface (M surface) or a glossy surface (S surface), but is preferably a glossy surface. Thereby, unevenness in roughness of the upper surface of the metal foil 20 can be suppressed, and the quality of the base substrate 100 can be stabilized. The layer thickness of the release agent layer 30 is typically 0.001 to 10 μm, preferably 0.001 to 0.1 μm.

(1) decane compound

The constituent material of the release agent layer 30 is not limited to the materials disclosed or currently available in the present invention, and for example, a decane compound represented by the following chemical formula, a hydrolyzed product thereof, and a condensate of the hydrolyzate may be used alone or in combination. .

(wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, R ³ and R ⁴ are each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. Any of these atoms of the atom)

The decane compound must have at least one alkoxy group. In the absence of an alkoxy group and only a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which one or more hydrogen atoms are substituted with a halogen atom constitutes a substituent At this time, the adhesion between the release agent layer 30 and the metal foil 20 tends to be excessively lowered. Further, the decane compound must have at least one hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or any one of the hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom. This is because the adhesion between the release agent layer 30 and the metal foil 20 tends to increase in the case where the hydrocarbon group is not present. Further, the alkoxy group of the invention of the present invention also contains an alkoxy group in which one or more hydrogen atoms are substituted with a halogen atom.

Preferably, the peel strength of the metal-clad laminate 25 and the build-up layer 110 is adjusted within a range in which the decane compound has three alkoxy groups and one of the above hydrocarbon groups (including one or more hydrogen atoms is substituted a hydrocarbon group of a halogen atom). If this is discussed by the above formula, both R ³ and R ⁴ are alkoxy groups.

The alkoxy group is not limited, and examples thereof include a methoxy group, an ethoxy group, a normal or isopropoxy group, a n-, iso- or tert-butoxy group, a n-, iso- or neopentyloxy group, a n-hexyloxy group, and a ring. a linear, branched or cyclic carbon such as hexyloxy, n-heptyloxy or n-octyloxy having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms. Oxygen. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

The alkyl group is not limited, and examples thereof include a methyl group, an ethyl group, a normal or an isopropyl group, a normal or an isobutyl group, a n-, iso- or neopentyl group, a n-hexyl group, an n-octyl group, a n-decyl group, and the like. Linear Or a branched carbon number of 1 to 20, preferably a carbon number of 1 to 10, more preferably an alkyl group having 1 to 5 carbon atoms.

The cycloalkyl group is not limited, and examples thereof include a ring having a carbon number of 3 to 10, preferably a carbon number of 5 to 7 such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group or a cyclooctyl group. alkyl.

Examples of the aryl group include a phenyl group, an alkyl group-substituted phenyl group (for example, tolyl group, xylyl group), a 1-naphthyl group or a 2-naphthyl group, and a fluorenyl group having 6 to 20 carbon atoms, preferably 6 ~14 aryl.

One or more hydrogen atoms of the hydrocarbon group may be substituted by a halogen atom, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Preferred examples of the decane compound include methyltrimethoxydecane, ethyltrimethoxydecane, n- or isopropyltrimethoxynonane, n-, iso- or tert-butyltrimethoxydecane, and Iso- or neopentyltrimethoxydecane, hexyltrimethoxydecane, octyltrimethoxydecane, decyltrimethoxydecane, phenyltrimethoxydecane;alkyl-substituted phenyltrimethoxynonane (for example, Methyl)phenyltrimethoxydecane), methyltriethoxydecane, ethyltriethoxydecane, n- or isopropyltriethoxydecane, n-, iso- or tert-butyltriethoxy Decane, pentyl triethoxy decane, hexyl triethoxy decane, octyl triethoxy decane, decyl triethoxy decane, phenyl triethoxy decane, alkyl substituted phenyl triethoxy Decane (for example, p-(methyl)phenyltriethoxydecane), (3,3,3-trifluoropropyl)trimethoxynonane, and tridecafluorooctyltriethoxydecane, methyltrichloro Decane, dimethyldichlorodecane, trimethylchlorodecane, phenyltrichlorodecane, trimethylfluorodecane, dimethyldibromodecane, diphenyldibromofluorene An alkane, a hydrolyzate of the above, a condensate of the hydrolyzed product, and the like. Among these, from the viewpoint of availability, propyltrimethoxydecane, methyltriethoxydecane, hexyltrimethoxydecane, phenyltriethoxydecane, decyltrimethoxy is preferred. Base decane.

(2) Compounds having two or less sulfhydryl groups in the molecule

A compound having two or less mercapto groups in the molecule may be used in the release agent layer 30 instead of the above-described decane compound. Examples of the compound include a mercaptan, a dithiol, a sulfuric acid or a salt thereof, a dithiocarboxylic acid or a salt thereof, a sulfuric acid or a salt thereof, and a disulfuric acid or a salt thereof. At least one of them.

A thiol group having a fluorenyl group in the molecule, for example, represented by R-SH. Here, R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group.

The dithiol type has two indenyl groups in the molecule, and is represented, for example, by R(SH) ₂ . R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group. Further, the two fluorenyl groups may be bonded to the same carbon, respectively, or may be bonded to each other with different carbon or nitrogen.

The hydroxy group of the thiocarboxylic acid-based organic carboxylic acid is substituted with a fluorenyl group, and is represented, for example, by R-CO-SH. R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group. Further, the sulfuric acid can also be used in the form of a salt. Further, a compound having two thiocarboxylic acid groups can also be used.

The two oxygen atoms in the carboxyl group of the dithiocarboxylic acid-based organic carboxylic acid are substituted with a sulfur atom, and are represented, for example, by R-(CS)-SH. R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group. Further, the dithiocarboxylic acid can also be used in the form of a salt. Further, a compound having two dithiocarboxylic acid groups can also be used.

The hydroxyl group of the sulfuric acid-based organic sulfonic acid is substituted with a mercapto group, and is represented, for example, by R(SO ₂ )-SH. R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group. Further, sulfuric acid may also be used in the form of a salt.

The two hydroxyl groups of the disulfonic acid-based organic disulfonic acid are each substituted with a mercapto group, and are represented, for example, by R-((SO ₂ )-SH) ₂ . R represents an aliphatic or aromatic hydrocarbon group or a heterocyclic group which may contain a hydroxyl group or an amine group. Further, the two sulfonic acid groups may be bonded to the same carbon, respectively, or may be bonded to each other. Further, disulfuric acid can also be used in the form of a salt.

Here, examples of the preferred aliphatic hydrocarbon group as R include an alkyl group and a cycloalkyl group, and the hydrocarbon group may include either or both of a hydroxyl group and an amine group.

Further, the alkyl group is not limited, and examples thereof include a methyl group, an ethyl group, a normal or an isopropyl group, a normal, an iso- or a tributyl group, a normal, an iso- or neopentyl group, a n-hexyl group, an n-octyl group, and a fluorenyl group. The linear or branched carbon number of the radical is preferably from 1 to 20, preferably from 1 to 10, more preferably from 1 to 5 carbon atoms.

Further, the cycloalkyl group is not limited, and examples thereof include a carbon number of 3 to 10, preferably a carbon number of 5 to 7 such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group or a cyclooctyl group. Cycloalkyl.

Further, preferred examples of the aromatic hydrocarbon group of R include a phenyl group, a phenyl group substituted with an alkyl group (for example, a tolyl group, a xylyl group), a 1-naphthyl group, a 2-naphthyl group, and a fluorenyl group. ~20, preferably 6 to 14 aryl groups, which may also comprise either or both of a hydroxyl group and an amine group.

Further, preferred examples of the heterocyclic group of R include imidazole, triazole, tetrazole, benzimidazole, benzotriazole, thiazole, benzothiazole, and may also contain any one of a hydroxyl group and an amine group or Both.

Preferred examples of the compound having two or less mercapto groups in the molecule include 3-mercapto-1,2-propanediol, 2-mercaptoethanol, 1,2-ethanedithiol, and 6-mercapto-1-hexa Alcohol, 1-octyl mercaptan, 1-dodecanethiol, 10-hydroxy-1-dodecanethiol, 10-carboxy-1-dodecanethiol, 10-amino-1-dodecane Mercaptan, sodium 1-dodecyl mercaptan sulfonate, thiophenol, thiobenzoic acid, 4-amino-thiophenol, p-toluenethiol, 2,4-dimethylbenzenethiol, 3- Mercapto-1,2,4 triazole, 2-mercapto-benzothiazole. Among these, from the viewpoint of water solubility and waste treatment, 3-mercapto-1,2-propanediol is preferred.

(3) Metal alkoxide

An aluminate compound, a titanate compound, a zirconate compound, or a hydrolyzed product thereof, or a condensate of the hydrolyzed product (hereinafter, a structure of the following formula) is used alone or in combination (hereinafter, The metal alkoxide is only referred to as a metal alkoxide. The insulating layer 40 is laminated on the metal-clad laminate 25, and the adhesion can be appropriately reduced, and the peel strength can be adjusted within the range as described below.

(R ¹ ) _m -M-(R ² ) _n

In the formula, R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. A hydrocarbon group, M is any one of Al, Ti, and Zr, n is 0, 1 or 2, m is an integer of 1 or more and valence of M, and at least one of R ¹ is an alkoxy group. Furthermore, m+n is the valence of M, that is, 3 in the case of Al and 4 in the case of Ti and Zr.

The metal alkoxide must have at least one alkoxy group. In the absence of an alkoxy group and only a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which one or more hydrogen atoms are substituted with a halogen atom constitutes a substituent At this time, the adhesion between the surface of the metal foil 20 having the metal-clad laminate 25 and the insulating layer 40 tends to be excessively lowered. Further, the metal alkoxide must have any hydrocarbon group selected from the group consisting of 0 to 2 selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms substituted with a halogen atom. The reason for this is that when three or more of the hydrocarbon groups are present, the adhesion between the surface of the metal foil 20 having the metal-clad laminate 25 and the insulating layer 40 tends to be excessively lowered. Further, the alkoxy group of the invention of the present invention also contains an alkoxy group in which one or more hydrogen atoms are substituted with a halogen atom. Preferably, the peeling strength of the metal-clad laminate 25 and the build-up layer 110 is adjusted within the following range, on the basis of which the metal alkoxide The compound has two or more alkoxy groups, one or two of the above hydrocarbon groups (hydrocarbon groups containing one or more hydrogen atoms substituted with a halogen atom).

Further, the alkyl group is not limited, and examples thereof include a methyl group, an ethyl group, a normal or an isopropyl group, a normal, an iso- or a tributyl group, a normal, an iso- or neopentyl group, a n-hexyl group, an n-octyl group, and a fluorenyl group. The linear or branched carbon number of the radical is preferably from 1 to 20, preferably from 1 to 10, more preferably from 1 to 5 carbon atoms.

Further, the cycloalkyl group is not limited, and examples thereof include a carbon number of 3 to 10, preferably a carbon number of 5 to 7 such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group or a cyclooctyl group. Cycloalkyl.

Further, examples of the preferred aromatic hydrocarbon group for R ² include a phenyl group, a phenyl group substituted with an alkyl group (for example, a tolyl group, a xylyl group), a 1-naphthyl group, a 2-naphthyl group, and a fluorenyl group. 6 to 20, preferably 6 to 14 aryl groups, which may also comprise either or both of a hydroxyl group and an amine group.

One or more hydrogen atoms of the hydrocarbon group may be substituted by a halogen atom, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred aluminate compounds include trimethoxy aluminum, methyl dimethoxy aluminum, ethyl dimethoxy aluminum, n- or isopropyl dimethoxy aluminum, ortho, x or Tributyldimethoxyaluminum, n-, iso- or neopentyldimethoxyaluminum, hexyldimethoxyaluminum, octyldimethoxyaluminum, decyldimethoxyaluminum, phenyldimethoxy Aluminium-substituted phenyldimethoxyaluminum (for example, p-(methyl)phenyldimethoxyaluminum), dimethylmethoxyaluminum, triethoxyaluminum, methyldiethoxyaluminum , ethyldiethoxyaluminum, n- or isopropyldiethoxyaluminum, n-, iso- or tert-butyldiethoxyaluminum, pentyldiethoxyaluminum, hexyldiethoxyaluminum, octyl Alkyl ethoxylated aluminum, decyldiethoxyaluminum, phenyldiethoxyaluminum, alkyl substituted phenyldiethoxyaluminum (for example, p-(methyl)phenyldiethoxyaluminum), Methyl ethoxylated aluminum, aluminum triisopropoxide, aluminum aluminum diisopropoxide, aluminum aluminum diisopropoxide, normal or isopropyl diethoxy aluminum, positive, different or third Aluminium diisopropoxide, Aluminum pentyl diisopropoxide, aluminum hexyl diisopropoxide, aluminum octyl diisopropoxide, aluminum decyl diisopropoxide, aluminum phenyl diisopropoxide, alkyl substituted phenyl Aluminum isopropoxide (for example, p-(methyl)phenyl diisopropoxy aluminum), dimethyl isopropoxide aluminum, (3,3,3-trifluoropropyl)dimethoxy aluminum, and Tridecafluorooctyldiethoxyaluminum, methylaluminum dichloride, dimethylaluminum chloride, phenylaluminum dichloride, dimethylaluminum fluoride, dimethylaluminum bromide, brominated diphenyl Base aluminum, hydrolyzed products, and condensates of the hydrolyzed products, and the like. Among these, from the viewpoint of availability, trimethoxy aluminum, triethoxy aluminum, and aluminum triisopropoxide are preferred.

As a preferable example of the titanate compound, titanium tetramethoxy, titanium trimethoxytitanium, ethyl trimethoxy titanium, n- or isopropyl trimethoxy titanium, ortho, x or tributyl Titanium trimethoxy, n-, iso- or neopentyltrimethoxytitanium, hexyltrimethoxytitanium, octyltrimethoxytitanium, decyltrimethoxytitanium, phenyltrimethoxytitanium; alkyl substituted phenyl Trimethoxytitanium (for example, p-(meth)phenyltrimethoxytitanium), dimethyldimethoxytitanium, tetraethoxytitanium, methyltriethoxytitanium, ethyltriethoxytitanium, Ortho- or isopropyl triethoxytitanium, n-, iso- or tert-butyltriethoxytitanium, pentyltriethoxytitanium, hexyltriethoxytitanium, octyltriethoxytitanium, fluorenyl Triethoxytitanium, phenyltriethoxytitanium, alkyl substituted phenyltriethoxytitanium (for example, p-(meth)phenyltriethoxytitanium), dimethyldiethoxytitanium, tetra Titanium isopropoxide, titanium methyl triisopropoxide, titanium triisopropoxide, titanium or n-butyl triethoxyoxide, n-, iso- or tert-butyl triisopropoxide titanium, Pentyl triisopropoxy titanium, hexyl triisopropoxy , octyl triisopropoxy titanium, decyl triisopropoxy titanium, phenyl triisopropoxy titanium, alkyl substituted phenyl triisopropoxy titanium (for example, p-(methyl)phenyl triiso Titanium propoxide), titanium dimethyl diisopropoxide, titanium (3,3,3-trifluoropropyl)trimethoxy, and tridecafluorooctyltriethoxytitanium, methyl trichloride Titanium, dimethyl titanium dichloride, trimethyl titanium chloride, phenyl titanium trichloride, dimethyl titanium difluoride, dimethyl titanium dibromide, diphenyl dibromide a base titanium, hydrolyzed products, and condensates of the hydrolyzed products, and the like. Among these, from the viewpoint of availability, tetramethoxytitanium, tetraethoxytitanium, and tetraisopropoxytitanium are preferable.

As a preferable example of the zirconate compound, tetramethoxy zirconium, methyltrimethoxyzirconium, ethyltrimethoxyzirconium, n- or isopropyltrimethoxyzirconium, ortho, iso- or tert-butyl can be mentioned. Trimethyl zirconium, n-, iso- or neopentyltrimethoxy zirconium, hexyltrimethoxy zirconium, octyltrimethoxyzirconium, decyltrimethoxyzirconium, phenyltrimethoxyzirconium; alkyl substituted phenyl Trimethoxy zirconium (for example, p-(methyl)phenyltrimethoxyzirconium), dimethyldimethoxyzirconium, tetraethoxyzirconium, methyltriethoxyzirconium, ethyltriethoxyzirconium, N- or isopropyltriethoxy zirconium, n-, iso- or tert-butyltriethoxy zirconium, pentyltriethoxyzirconium, hexyltriethoxyzirconium, octyltriethoxyzirconium, fluorenyl Triethoxy zirconium, phenyltriethoxy zirconium, alkyl substituted phenyl triethoxy zirconium (for example, p-(methyl)phenyltriethoxy zirconium), dimethyldiethoxyzirconium, tetra Zirconium isopropoxide, zirconium methyl triisopropoxide, zirconium ethyl triisopropoxide, zirconium n- or isopropyl triisopropoxide, n-, iso- or tert-butyl triisopropoxy zirconium , pentyl triisopropoxy zirconium, hexyl triisopropyloxide Zirconium, octyltriisopropoxyzirconium, fluorenyltriisopropoxyzirconium, phenyltriisopropoxyzirconium, alkyl-substituted phenyltriisopropoxyzirconium (for example, p-(methyl)phenyltriphenyl) Zirconium isopropoxide), zirconium dimethyl diisopropoxide, zirconium (3,3,3-trifluoropropyl)trimethoxy, and trifluorooctyltriethoxyzirconium, trichloride Zirconium, dimethyl zirconium dichloride, trimethyl zirconium chloride, phenyl zirconium trichloride, dimethyl zirconium difluoride, zirconium dibromide dichloride, zirconium dibromide dibromide, And the like, a hydrolyzate, a condensate of the hydrolyzate, and the like. Among these, from the viewpoint of availability, tetramethoxyzirconium, tetraethoxyzirconium, and tetraisopropoxyzirconium are preferable.

It can be manufactured by adhering the insulating layer 40 to the base substrate 100 by hot pressing. For example, the metal alkoxide in the above-mentioned molecule can be applied by coating the bonding surface of the metal foil 20, and the insulating layer 40 made of resin in the B-stage of the base substrate 100 is thermally laminated thereon. Manufacturing.

The metal alkoxide can be used in the form of an aqueous solution. In order to improve the solubility in water, an alcohol such as methanol or ethanol may be added. The addition of alcohol is especially effective when a metal alkoxide having a higher hydrophobicity is used.

The higher concentration of the metal alkoxide in the aqueous solution tends to lower the peel strength between the metal-clad laminate 25 and the build-up layer 110, and the peel strength can be adjusted by adjusting the metal alkoxide concentration. The concentration of the metal alkoxide in the aqueous solution is 0.001 to 1.0 mol/L, and typically 0.005 to 0.2 mol/L.

The pH of the aqueous solution of the metal alkoxide is not particularly limited, and the acidic side can also be used as the pH of the alkaline side. For example, it can be used at a pH in the range of 3.0 to 10.0. From the viewpoint of not particularly adjusting the pH, it is preferably set to a pH in the range of 5.0 to 9.0 in the vicinity of neutrality, and more preferably in the range of 7.0 to 9.0.

(4) a release agent layer composed of a resin coating film

The insulating layer 40 and the base layer may be applied by using a resin coating film composed of polyoxymethylene and any one or a plurality of resins selected from the group consisting of an epoxy resin, a melamine resin, and a fluororesin as a release agent layer. The material 100 is bonded, and the adhesion can be appropriately reduced, and the peel strength can be adjusted within the range as described below.

The adjustment of the peel strength for achieving such adhesion is carried out by using a resin composed of polyoxymethylene and any one or a plurality of resins selected from the group consisting of epoxy resins, melamine resins, and fluororesins. The film is carried out. The reason for this is that the resin coating film is subjected to a baking treatment under the specific conditions described below, and is used for bonding between the metal-clad laminate 25 and the insulating layer 40 by hot pressing, whereby the adhesion can be appropriately reduced. , adjust the peel strength in the following Inside.

Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, brominated epoxy resin, amine epoxy resin, and flexible epoxy resin. , hydrogenated bisphenol A type epoxy resin, phenoxy resin, brominated phenoxy resin, and the like.

Examples of the melamine-based resin include a methyl etherified melamine resin, a butylated urea melamine resin, a butylated melamine resin, a methylated melamine resin, and a butanol-modified melamine resin. Further, the melamine resin may be a mixed resin of the above resin, a butylated urea resin, a butylated benzoguanamine resin or the like.

Further, it is preferred that the epoxy resin has a number average molecular weight of from 2,000 to 3,000, and the melamine resin has a number average molecular weight of from 500 to 1,000. By having such a number average molecular weight, coating of the resin can be performed and it becomes easy to adjust the adhesive strength of the resin coating film within a specific range.

Further, examples of the fluororesin include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and polyvinyl fluoride.

Examples of the polyoxymethane include methylphenyl polyoxyalkylene, methyl hydrogen polyoxyalkylene oxide, dimethyl polyoxyalkylene oxide, modified dimethyl polyoxyalkylene oxide, and the like. Here, the modification includes, for example, epoxy modification, alkyl modification, amine modification, carboxyl modification, alcohol modification, fluorine modification, alkyl aralkyl polyether modification, and epoxy. Polyether modification, polyether modification, alkyl higher alcohol ester modification, polyester modification, decyloxyalkyl modification, haloalkyl methoxyalkyl modification, haloalkyl modification, amino diol Modification, thiol modification, modification of hydroxyl-containing polyester, etc.

When the film thickness is too small, the resin coating film is too thin to be formed, and the productivity is liable to be lowered. Moreover, even if the film thickness exceeds a fixed size, no resin coating film is found. The peelability is further improved, and the manufacturing cost of the resin coating film is easily increased. From this point of view, the film thickness of the resin coating film is preferably from 0.1 to 10 μm, more preferably from 0.5 to 5 μm. Further, the film thickness of the resin coating film is achieved by applying a resin coating material at a specific coating amount by the following procedure.

In the resin coating film, polyfluorene oxygen functions as a release agent for the resin coating film. Therefore, when the total amount of the epoxy resin or the melamine resin is more than that of the polyoxygenated oxygen, the peeling strength of the resin coating film between the metal-clad laminate 25 and the insulating layer 40 is increased, so that the resin coating film is peeled off. The situation is reduced, and it becomes impossible to easily peel off by manual operation. On the other hand, when the total amount of the epoxy resin or the melamine resin is too small, the peel strength is reduced, so that it may be peeled off during transportation or during processing. In view of the above, it is preferably contained in an amount of 10 to 1500 parts by mass, more preferably 20 to 800 parts by weight, based on 100 parts by mass of the polyoxymethylene oxide, based on the total of the epoxy resin and the melamine resin. The quantity is included.

Further, similarly to the polyfluorene oxide, the fluororesin has a function as a release agent and an effect of improving the heat resistance of the resin coating film. When the fluororesin is excessively polyaminated, the peeling strength is reduced, so that it is peeled off during transportation or processing, and the temperature required in the following baking step is increased, which is uneconomical. From this point of view, the fluororesin is preferably 0 to 50 parts by mass, more preferably 0 to 40 parts by mass, per 100 parts by mass of the polyfluorene oxide.

The resin coating film contains polyfluorene oxide, an epoxy resin and/or a melamine resin, and optionally a fluororesin, and further contains SiO ₂ , MgO, Al ₂ O ₃ , BaSO _{4 ,} and Mg(OH) _{2 .} One or more kinds of surface roughening particles. When the resin coating film contains surface roughening particles, the surface of the resin coating film becomes irregularities. By the unevenness, the surface of the metal foil 20 coated with the resin coating film becomes unevenness and becomes a matte surface. The content of the surface roughening particles is not particularly limited as long as the resin coating film is roughened, and is preferably 1 to 10 parts by mass based on 100 parts by mass of the polyfluorene oxide.

The particle diameter of the surface roughened particles is preferably 15 nm to 4 μm. Here, the particle diameter means an average particle diameter (an average value of the maximum particle diameter and the minimum particle diameter) measured according to a scanning electron microscope (SEM) photograph or the like. When the particle diameter of the surface roughened particles is in the above range, the amount of unevenness on the surface of the resin coating film can be easily adjusted, and as a result, the amount of unevenness on the surface of the metal foil 20 can be easily adjusted. Specifically, the amount of unevenness on the surface of the metal foil 20 is about 4.0 μm in terms of the maximum height roughness Ry of the JIS standard.

Here, a method of manufacturing the base substrate 100 will be described. The base substrate 100 is obtained by a step of laminating the metal foil 20 on at least one surface of the prepreg 10 by thermocompression bonding or the like, and a step of laminating the release agent layer 30 on the metal foil 20. The step of forming the release agent layer 30 on the metal foil 20 includes a coating step and a baking step as follows.

(coating step)

The coating step is applied to the metal foil 20 of the metal-clad laminate 25 by applying polyfluorene as a main component, an epoxy resin as a curing agent, a melamine resin, and, if necessary, a fluororesin as a release agent. The resin coating material is formed to form a resin coating film. The resin coating is obtained by dissolving an epoxy resin, a melamine resin, a fluororesin, and polyoxymethylene in an organic solvent such as an alcohol. In addition, the amount (addition amount) in the resin coating material is preferably from 10 to 1,500 parts by mass based on 100 parts by mass of the polyoxymethylene oxide, and the total of the epoxy resin and the melamine resin. Further, the fluororesin is preferably 0 to 50 parts by mass based on 100 parts by mass of the polyfluorene oxide.

The coating method in the coating step is not particularly limited as long as the resin coating film can be formed, and a gravure coating method, a bar coating method, a roll coating method, a curtain coating method, and static electricity can be used. The method of the coater or the like is preferably a gravure coating method in terms of uniformity of the resin coating film and ease of handling. Further, the coating amount is preferably such that the resin coating film 3 has a film thickness of 0.5 to 5 μm, and the resin amount is preferably 1.0 to 2.0 g/m ² .

The gravure coating method is a method of forming a resin coating film on the surface of the metal foil 20 by transferring a resin coating filled in a concave portion (microcell) provided on the surface of the roller to the metal-clad laminate 25. Specifically, the lower portion of the lower surface of the microcapsule is placed in the resin coating, and the resin coating is taken up by the rotation of the lower roller. In addition, the metal-clad laminate 25 is supplied between the lower roller and the upper roller disposed on the upper side of the lower roller, and the lower roller and the upper roller are rotated while the object to be coated is pressed against the lower roller by the upper roller. Thereby, the metal clad laminate 25 is conveyed and the resin paint drawn into the microcapsules is transferred (coated) to the surface of the metal foil 20 of the metal clad laminate 25.

Further, by disposing the doctor blade on the feeding side of the metal-clad laminate 25 so as to be in contact with the surface of the lower roll, the excess resin coating taken on the surface of the roll other than the micelle is removed, thereby coating the metal-clad laminate. The surface of 25 is coated with a specific amount of resin coating. Further, when the size (size and depth) of the micelle is large or the viscosity of the resin coating material is high, the resin coating film formed on one surface of the metal-clad laminate 25 is less likely to be smooth. Therefore, a smoothing roller can be disposed on the delivery side of the metal-clad laminate 25 to maintain the smoothness of the resin coating film.

In the case where the metal foil is provided on both the front and back sides of the metal-clad laminate 25, the resin coating film may be formed separately on the surfaces of the metal foils on both surfaces of the metal-clad laminate 25. In this case, a resin coating film is formed on one surface of the metal-clad laminate, and the metal-clad laminate is turned over, and the metal-clad laminate is again supplied between the lower roller and the upper roller, and the lower roller is used in the same manner as described above. The resin coating in the microcapsules is transferred (coated) to the back of the metallized laminate.

(baking step)

The baking step is performed at 125 to 320 ° C (baking temperature) to the resin formed by the coating step. The coating film is subjected to a baking treatment step of 0.5 to 60 seconds (baking time). In this manner, the resin coating film formed by the resin coating material having a specific blending amount is subjected to a baking treatment under specific conditions, whereby the peeling strength between the metal-clad laminate 25 and the insulating layer 40 imparted by the resin coating film is controlled to be specific. Within the scope. In the present invention, the baking temperature is the limit temperature of the object to be coated. Further, as a heating means used for the baking treatment, a conventionally known device is used.

When the baking is insufficient, for example, when the baking temperature is less than 125 ° C or the baking time is less than 0.5 second, the resin coating film is insufficiently cured, and the peeling strength exceeds 200 gf/cm, and the peeling property is lowered. In the case where the baking is excessive, for example, when the baking temperature exceeds 320 ° C, the resin coating film is deteriorated, and the peeling strength exceeds 200 gf/cm, and workability at the time of peeling is deteriorated. Or there is a case where the object to be coated is deteriorated due to high temperature. Moreover, when the baking time exceeds 60 seconds, productivity is deteriorated.

In the method for producing the base substrate 100, the resin coating material in the coating step may be a polyfluorene oxide as a main component, an epoxy resin as a curing agent, a melamine resin, a fluororesin as a release agent, and a selection. It is composed of one or more kinds of surface roughened particles of SiO ₂ , MgO, Al ₂ O ₃ , BaSO ₄ and Mg(OH) ₂ .

Specifically, the resin coating material is obtained by adding a surface roughening particle to the polyfluorene-added resin solution. By adding such surface roughening particles by the resin coating material, the surface of the resin coating film becomes irregularities, and the metal foil 20 becomes uneven by the unevenness, and becomes a matte surface. Further, in order to obtain the metal foil 20 having such a matte surface, the amount (addition amount) of the surface roughening particles in the resin coating material is preferably from 1 to 10 parts by mass based on 100 parts by mass of the polyoxymethylene. Further, the particle diameter of the surface roughened particles is more preferably 15 nm to 4 μm.

The manufacturing method of the present embodiment is as described above, but the present embodiment is implemented. In the case of the form, other steps may be included between or before the above steps. For example, a cleaning step of cleaning the surface of the metal foil 20 may be performed before the coating step.

As described in the first paragraph of the present invention, the insulating layer 40 composed of a resin layer laminated on the base substrate 100 may be the same as the prepreg 10 which functions as a carrier of the metal foil 20 in the base substrate 100. Or may be of different composition. If the mechanical strength of the insulating layer 40 is lower than the mechanical strength of the prepreg 10 of the base substrate 100, the thickness of the insulating layer 40 may be made thinner than the thickness of the prepreg 10.

In the step of laminating the buildup layer 110, it is preferable to sufficiently fix the insulating layer 40 on the base substrate 100, and on the other hand, to ensure the easy peelability of the insulating layer 40 and the base substrate 100 after the lamination step of the buildup layer 110, From this point of view, it is desirable to set the peel strength between the insulating layer 40 and the base substrate 100. Further, the adjustment of the peel strength can be adjusted by setting the material or thickness of the release agent layer 30, and can be adjusted by the surface treatment of the metal foil 20 or the insulating layer 40.

Before the step of laminating the buildup layer 110, the peel strength between the metallized laminate 25 and the buildup layer 110 is typically 10 gf/cm or more, preferably 30 gf/cm or more, more preferably 50 gf/cm or more, and typically 200 gf/cm. Hereinafter, it is preferably 150 gf/cm or less, more preferably 80 gf/cm or less. By setting the peeling strength between the metal-clad laminate 25 and the build-up layer 110 in this manner, the positional deviation of the insulating layer 40 on the base substrate 100 can be suppressed, and the base substrate 100 can be secured after the lamination step of the build-up layer 110. Appropriate stripping properties with the buildup layer 110.

The peeling strength between the metal-clad laminate 25 and the build-up layer 110 is desirably not greatly changed after the step of laminating the build-up layer 110. Thereby, the peeling property between the base substrate 100 and the buildup layer 110 after the step of laminating the buildup layer 110 can be avoided.

For example, the peel strength between the metal-clad laminate 25 and the build-up layer 110 after heating at least one of 3 hours, 6 hours, or 9 hours at 220 ° C is typically 10 gf / cm or more, preferably 30 gf / cm or more, more preferably It is 50 gf/cm or more, typically 200 gf/cm or less, preferably 150 gf/cm or less, more preferably 80 gf/cm or less.

For the peel strength after heating at 220 ° C, it is preferable to use two or more of the peel strength after 3 hours and 6 hours, or 6 hours and 9 hours, depending on the number of layers. When the above range is satisfied, it is preferred that all of the peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above range.

In the present invention, the peel strength is measured in accordance with the 90-degree peel strength measuring method specified in JIS C 6481.

In the case of the conventional CCL (Copper-clad Laminate), it is expected that the peeling strength of the resin and the copper foil is high. Therefore, for example, the rough surface (M surface) of the electrolytic copper foil is set to the surface of the resin and is rough. Surface treatment such as chemical treatment, whereby the adhesion obtained by chemical and physical anchoring effects can be improved. Further, in order to increase the adhesion to the copper foil on the resin side, various kinds of binders and the like are added. As described above, in the present embodiment, it is preferable that the base substrate 100 and the insulating layer 40 are finally peeled off unlike the CCL. Therefore, the peel strength is not high.

In order to adjust the peeling strength between the metal-clad laminate 25 and the build-up layer 110 to the above preferred range, the surface roughness of the upper surface of the metal foil 20 is based on the metal foil 20 measured in accordance with JIS B 0601 (2001). When the ten-point average roughness (Rz jis) of the surface is expressed, it is preferably 3.5 μm or less, and more preferably 3.0 μm or less. However, since infinitely reducing the surface roughness becomes a cause of an increase in cost due to a large amount of time, it is preferably 0.1 μm or more, and more preferably 0.3 μm or more. If using electrolytic copper foil as gold In the case of the foil 20, if it is adjusted to such a surface roughness, either of a glossy surface (S surface) and a rough surface (M surface) may be used, but the gloss surface may be easily adjusted to the above surface roughness.

According to the embodiment, the surface of each of the metal foil 20 and the insulating layer 40 is not subjected to a roughening treatment or the like for improving the peeling strength. According to the embodiment, the adhesive for increasing the adhesion to the base substrate 100 is not added to the insulating layer 40.

A method of manufacturing a multilayer printed wiring board will be described with reference to FIGS. 2 and 3. First, the base substrate 100 shown in Fig. 1 is prepared. The method for producing the base substrate 100 itself is as described above. Typically, the metal foil 20 is thermocompression-bonded to the prepreg 10 by thermal pressing to laminate the film, and then the metal foil 20 is formed by any method. Film release agent layer 30. The metal foil 20 is laminated on the entire surface of the upper surface of the prepreg 10, but is not necessarily limited thereto. The release agent layer 30 is laminated on the entire surface of the metal foil 20 over the entire surface, but is not necessarily limited thereto.

Then, the buildup layer 110 is laminated on the base substrate 100, whereby the buildup layer 110 is laminated on the metal clad laminate 25 with the release agent layer 30 interposed therebetween. A metal foil may also be used for the wiring layer 50 in the build-up layer 110. Alternatively, the wiring layer 50 may be formed by at least one of a subtractive method, a full additive method, or a semi-additive method.

The subtractive method refers to a method of forming a conductor pattern by selectively removing unnecessary portions of a metal substrate on an arbitrary substrate, for example, a metal-clad laminate or a wiring substrate (including a printed wiring board or a printed circuit board) by etching or the like. . The full addition method uses a method of electroless plating and/or electrolytic plating to form a wiring layer 50 of a patterned conductor layer. The semi-additive method is obtained by, for example, forming a conductor pattern by using an electroless metal deposition, electrolytic plating, etching, or both on a seed layer composed of a metal foil, and etching and removing the seed layer which is not required, thereby obtaining The method of conductor pattern.

The constituent layer of the buildup layer 110 may include one or more resins, a single-sided or double-sided wiring substrate, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a metal foil, or a base substrate 100.

The method further includes the steps of: a single-sided or two-sided wiring substrate, a single-sided or two-sided metal-clad laminate, a metal foil of a metal foil with a carrier, a prepreg 10 or a metal foil 20 of the base substrate 100, or a resin opening Conductive plating of the side and bottom surfaces of the hole. Further, the method further includes the following steps of forming the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal constituting the metal foil with the carrier; At least one of the foils forms a wire.

Further, the method further includes the steps of laminating a resin on the patterned wiring layer 50 and further laminating the base substrate 100 from the side of the metal foil 20. A resin may be laminated on the patterned wiring layer 50, and the metal foil may be adhered to the resin. Further, the method may further include the step of laminating a resin on the surface on which the wiring is formed, and adhering the metal foil with the metal foil to the both sides of the resin laminate. In addition, the "surface on which the wiring is formed" means a portion in which wiring is formed on the surface which is present at any time during the layering process, and the layered substrate includes the final product including the intermediate portion.

In addition, the "metal foil with a carrier" is a metal foil laminated with a release agent layer on a carrier made of a resin that functions as a support substrate. The metal foil of the carrier may be formed by using the same material as the release agent layer 30 disclosed in the present invention. The metal foil with a carrier is preferably a copper foil with a carrier.

It is also possible to cut the layered body in which the buildup layer 110 is laminated on the base substrate 100. The depth of cut does not need to be completely singulated to the layered body of the object to be cut, or may be The extent to which it reaches the base substrate 100. When the laminated body of the cut object is not completely singulated, the groove that reaches or does not reach the base substrate 100 is set. The machine used for cutting is not limited to the type of cutting blade used, and any method such as welding wire or laser can be used.

Preferably, the base substrate 100 and the buildup layer 110 are separated and separated after the cutting step. In the case where the base substrate 100 is not singulated by dicing, a plurality of singulated layered layers 110 can be obtained from the shared base substrate 100 in the form of each multilayer printed wiring substrate.

The insulating layer 40 and the wiring layer 50 in the build-up layer 110 may also be laminated by thermocompression bonding. The thermocompression bonding may be carried out layer by layer, or may be carried out one by one in a certain degree, or may be performed together at the last time.

The number or stacking order of the insulating layer 40 and the wiring layer 50 included in the buildup layer 110 is arbitrary. The number of laminated units formed by the combination of the insulating layer 40 and the wiring layer 50 is typically one or more, and may be two or more, three or more, or four or more. It is difficult to maintain the accuracy of the interlayer position of the multilayer printed wiring board due to an increase in the number of laminated units. In the present embodiment, the multilayer printed wiring board can be stably fixed to the base substrate 100, and the buildup layer 110 can be stably laminated on the insulating layer 40.

The wiring layer 50 is not limited to a metal foil or a patterned metal foil, and is preferably a copper foil or a patterned copper foil, or a metal plating layer formed by plating. Further, the wiring layer 50 can be formed by applying a usual semiconductor process technology. The wiring layer 50 is not particularly limited, and is typically represented by CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) by applying photolithography. The physical wiring layer formed by vapor deposition or the like is patterned. It is not necessary to pattern the wiring layer 50, and the wiring layer 50 may be a physical wiring layer. Can also be applied by lift off technology Patterned.

The insulating layer 40 is not limited to a resin layer or a resin layer provided with via wiring (interlayer wiring), and typically a thermosetting resin or a photosensitive resin can be exemplified. Further, the insulating layer 40 may be a prepreg reinforced by glass fibers or an inorganic filler. The constituent resin of the insulating layer 40 is preferably selected from materials having the same or similar characteristics as the prepreg 10. It is also possible to form a film by using any type of coating device typified by a die coater. The wiring layer 50 can also be formed by using a conventional semiconductor process technology instead of or in combination with it. The insulating layer 40 is not particularly limited, and is formed by forming a film insulating material by vapor deposition such as CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition), and embedding conductive via holes as needed. It is used to ensure electrical connection between the upper and lower wiring layers 50. The method of incorporating the conductive vias into the insulating layer 40 is arbitrary. A method of forming a mask layer having an opening on the insulating layer 40 deposited on the wiring layer 50, performing an etching treatment through the mask layer, and removing the insulating layer in a range corresponding to the opening of the mask layer can be exemplified. The layer 40 is thereafter filled with a conductive material in a range in which the insulating layer 40 is removed. This technology is the basic technology of semiconductor process technology, and those skilled in the art will of course understand.

The wiring layer 50 is made of, for example, a conductive material such as copper, aluminum, or polysilicon. The insulating layer 40 is made of an insulating material such as cerium oxide. The via holes incorporated in the insulating layer 40 are made of a conductive material such as copper, aluminum or polysilicon.

Then, as shown schematically in FIG. 3, the buildup layer 110 is separated from the base substrate 100. In this manner, the buildup layer 110 can be efficiently manufactured by using a multilayer printed wiring board.

In order to further multilayer the multilayer printed wiring board, another buildup layer may be laminated on the insulating layer 40 which is in close contact with the multilayer printed wiring board of the base substrate 100. Further, of course, the surface of the insulating layer 40 of the multilayer printed wiring board which is in close contact with the base substrate 100 may be For the mounting surface of the other mounting substrate, a bump or pin for mounting may be provided. Similarly, the surface of the base substrate 100 exposed by the separation of the build-up layer 110 and the base substrate 100 may be a mounting surface of any other element.

In order to ensure electrical connection between the wiring layers 50 in the build-up layer 110 or the wiring layer 50 in the build-up layer 110 and the external wiring, via wiring (interlayer wiring) may be formed on the build-up layer 110, which may be performed on the base layer. The process of forming the buildup layer 110 on the material 100 may be performed, or may be performed after the buildup of the buildup layer 110 having a specific number of layers on the base substrate 100. The via wiring may be formed in a state in which the buildup layer 110 is laminated on the base substrate 100, or the via wiring may be formed after the prepreg 10 of the base substrate 100 is peeled off from the buildup layer 110. For example, in the state in which the lower wiring layer 50, the intermediate insulating layer 40, and the upper wiring layer 50 are formed on the base substrate 100, a through hole penetrating the upper wiring layer 50 and the intermediate insulating layer 40 to reach the lower wiring layer 50 is formed. The hole is provided with a conductive material by deposition or the like, thereby ensuring electrical conduction between the lower wiring layer 50 and the upper wiring layer 50. The through hole can be formed by any method such as mechanical cutting or laser processing. The number of layers of the insulating layer 40 through which the through holes pass is arbitrary, and may be two or more layers. Electrolytic plating may also be applied to the filling of the conductive material in the through holes.

Hereinafter, the form of further illustration will be described. On the base substrate 100, the required number of prepregs and then the metal foil are laminated one by one or more in sequence, and the laminate is sandwiched between a set of flat plates and placed in a hot press at a specific temperature and The thermocompression bonding is performed under pressure, whereby a buildup layer can be formed on the base substrate. As the flat plate, for example, a stainless steel flat plate can be used. The flat plate is not limited, and for example, a thick plate of about 1 to 10 mm can be used. As described above, the build-up layer may form the insulating layer and the metal layer layer by layer, or may be formed at one time.

The step of half-etching the entire surface of the metal foil constituting the wiring layer 50 as needed may be included to adjust the thickness. Performing laser addition at a specific position of the metal foil constituting the wiring layer 50 Forming a through hole through the metal foil and the resin, and performing desmear treatment for removing the dross in the through hole, and then performing electroless plating on the bottom surface, the side surface of the through hole, and the entire surface or part of the metal foil to form an interlayer The connection can be carried out by electroplating if necessary. It is also possible to form a plating resist in advance on each of the portions of the metal foil which are not required to be electrolessly plated or electrolytically plated. Further, when the adhesion between the electroless plating, the electrolytic plating, the plating resist, and the metal foil is insufficient, the surface of the metal foil may be chemically roughened in advance. In the case of using a plating resist, the plating resist is removed after plating. Then, an unnecessary portion of the metal foil, the electroless plating portion, and the electrolytic plating portion is removed by etching, thereby forming a circuit. In this way, a build-up substrate can be fabricated. It is also possible to repeat the steps of laminating the resin from the copper foil to the circuit to form a plurality of layers of the build-up substrate.

The release agent layer 30 side of the other base substrate 100 may be laminated on the uppermost layer of the buildup layer 110.

It is preferable to use the insulating layer 40 as the build-up layer 110, and it is preferable to use a prepreg containing a thermosetting resin.

The insulating layer 40 is preferably a resin layer such as a prepreg or a photosensitive resin. In the case where a prepreg is used as the insulating layer 40, a through hole may be provided to the prepreg by laser processing. After the laser processing, it is preferred to carry out the desmear treatment for removing the dross in the through hole. Further, when a photosensitive resin is used as the resin, the resin of the forming portion can be removed from the through hole by photolithography. Then, the bottom surface of the through hole, the side surface, and the entire surface or part of the resin are subjected to electroless plating to form an interlayer connection, and further electrolytic plating is performed as needed. It is also possible to form a plating resist in advance on the portion of the resin that does not require electroless plating or electrolytic plating before performing each plating. Further, when the adhesion between the electroless plating, the electrolytic plating, and the plating resist and the resin is insufficient, the surface of the resin may be chemically roughened in advance. In the case of using a plating resist, the plating resistance is removed after plating. Agent. Then, unnecessary portions of the electroless plating portion or the electrolytic plating portion are removed by etching, whereby an electric circuit is formed.

<Second embodiment>

The second embodiment will be described with reference to Figs. 4 and 5 . 4 is a schematic cross-sectional view of a base substrate. Fig. 5 is a schematic cross-sectional view showing a state in which a buildup layer is formed on both surfaces of a base substrate. In the present embodiment, as shown in FIG. 4, a metal foil 20 and a release agent layer 30 are sequentially laminated on the lower surface (main surface) of the prepreg 10 as the base substrate 100. That is, in the case of such a case, the same effects as those of the first embodiment can be obtained. In the case of the present configuration, as shown schematically in FIG. 5, the layer 110 can be added to the two layers of the base substrate 100, and the utilization efficiency of the base substrate 100 can be effectively improved, and the multilayer printed wiring can be improved. Manufacturing efficiency of the substrate.

Further, the material or thickness of each of the metal foils 20 attached to both sides of the prepreg 10 may be the same or different. In this respect, the material or thickness of the release agent layer 30 disposed on the upper layer and the lower layer of the prepreg 10 is also the same. The composition or stacking order of the respective buildup layers 110 formed on the upper layer and the lower layer of the base substrate 100 is also the same.

In the following, the embodiments of the present invention are shown in conjunction with the comparative examples, which are provided to better understand the present invention and its advantages, and are not intended to limit the invention.

<Experimental Example 1>

A plurality of electrolytic copper foils (thickness: 12 μm) were prepared, and the gloss (S) surface of each of the electrolytic copper foils was subjected to nickel-zinc (Ni-Zn) alloy plating treatment and chromate (Cr-Zn chromic acid) according to the following conditions. In the salt treatment, the ten-point average roughness of the S surface (Rz jis: measured in accordance with JIS B 0601 (2001)) was set to 1.5 μm.

(nickel-zinc alloy plating)

(chromate treatment)

Regarding the treatment of the S surface by the release agent, the aqueous solution of the release agent was applied by a spray coater and then the surface of the copper foil was dried in air at 100 °C. With respect to the use conditions of the release agent, the type of the release agent, the dissolution time of the release agent in water until the coating, the concentration of the release agent in the aqueous solution, and the concentration of the alcohol in the aqueous solution are shown in the table of FIG. The pH of the aqueous solution.

The surface of the untreated release agent side of the copper foil with the release agent layer obtained in this manner is attached to the surface of the prepreg (FR-4 Prepreg, manufactured by Nanya Plastics Co., Ltd.) used as a plate-shaped carrier. Thereby, a base substrate of a laminate of a prepreg, a copper foil, and a release agent layer was obtained.

On the side of the substrate substrate treated with the release agent, it will be insulated by hot pressing. A layer of a prepreg (manufactured by Nanya Plastics Co., Ltd., FR-4 Prepreg, thickness: 62 μm) is laminated with a copper foil (JX Nippon Mining & Metals Co., Ltd., JTC (product name), thickness 12 μm) as a wiring layer. Floor. It is assumed that the thermal history of the layered body composed of the base substrate and the buildup layer thus obtained is further subjected to a heat treatment such as formation of a build-up layer, and the conditions described in the table shown in FIG. 6 are performed. Heat treatment at 220 ° C for 3 hours). The peel strength at the interface between the obtained laminate and the base substrate in the laminate after heat treatment and the insulating layer of the buildup layer was measured. The results are shown in the table of Fig. 6.

<Experimental Example 2~11>

A laminate composed of a base substrate and a build-up layer was produced by the same procedure as in Experimental Example 1 using a copper foil, a resin (prepreg), and a release agent shown in the table of Fig. 6 . Each laminate was subjected to the same evaluation as in Experimental Example 1. The results are shown in the table of Fig. 6. Moreover, in the formation of the S surface of the release resin coating film in the test example 11, the composition for the resin coating film having the composition shown in the table of Fig. 6 was applied by gravure coating, and then a doctor blade was used. The thickness is adjusted to 2 to 4 μm. Further, the applied resin coating film was heated at 150 ° C for 30 seconds to carry out baking treatment. Further, a bisphenol A type epoxy resin is used as the epoxy resin shown in the table of Fig. 6, a methyl etherified melamine resin is used as the melamine resin, and a polytetrafluoroethylene is used as the fluororesin, and dimethyl polyfluorene is used. Oxyalkane is used as the dimethyl polyfluorene resin.

Further, the type of the release treatment surface of the copper foil, the surface treatment conditions and the surface roughness Rz jis, the use conditions of the release agent, the type of the prepreg, and the laminate conditions of the copper foil and the prepreg are as follows. As shown in the table of Figure 6.

The surface treatment conditions of the rough (M) surface of the copper foil on the opposite side to the bonding surface of the plate-shaped carrier, the specifics of the roughening treatment, the chromate treatment, and the epoxy decane (treatment) The conditions are as follows. The rough surface of the roughening treatment and the epoxy decane treatment had a surface roughness Rz jis of 3.7 μm.

(epoxy decane treatment)

Treatment liquid: 3-glycidoxypropyltrimethoxydecane 0.9% by volume aqueous solution

pH 5.0~9.0

Stirring at room temperature for 12 hours

Treatment method: After the treatment liquid was applied using a spray coater, the treated surface was dried in air at 100 ° C for 5 minutes.

(roughening treatment)

(chromate treatment)

As shown in the table of Fig. 6, good results were obtained in Examples 1 to 11. Better results were obtained in Examples 1-8 and 10. Particularly good results were obtained in Examples 1, 2, 5-7. In the evaluation of the peeling workability, the release layer which is the resin layer is not broken and the buildup layer 110 can be peeled off from the base substrate 100 as "G". When the release agent layer was not broken and the buildup layer 110 was peeled off from the base substrate 100, the peeling operation was performed at a rate of four or more times out of ten times, and the peeling operation was indicated as "-". The case where the release agent layer is broken or the buildup layer 110 cannot be peeled off from the base substrate 100 is represented as "N".

(Embodiment 12)

FR-4 Prepreg (manufactured by Nanya Plastics Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12 μm (product name)) were sequentially laminated on both sides of the base substrate similar to Examples 1 to 11, A four-layer copper clad laminate was produced by hot pressing at a pressure of 3 MPa under specific heating conditions.

Then, using a laser processing machine, a hole having a diameter of 100 μm which penetrated the copper foil on the surface of the above-mentioned four-layer copper clad laminate and the insulating layer (hardened prepreg) thereunder was opened. Then, the surface of the copper foil on the copper foil of the carrier exposed at the bottom of the hole and the side surface of the hole and the copper foil on the surface of the four-layer copper-clad laminate are plated with copper by electroless copper plating or copper plating. Thereby, an electrical connection is formed between the copper foil on the copper foil with the carrier and the copper foil on the surface of the four-layer copper clad laminate. Then, a part of the copper foil on the surface of the four-layer copper clad laminate was etched using an iron chloride-based etching liquid to form an electric circuit. In this way, four layers of build-up substrates were obtained.

Then, in the four-layer build-up substrate, the base substrate was separated from the build-up layer, thereby obtaining two sets of two-layer build-up wiring boards. Peeling can also be carried out well.

According to the above disclosure, those skilled in the art can perform various embodiments on various embodiments. change. The order of lamination of the insulating layer 40 and the wiring layer 50 in the build-up layer 110 may be reversed. It is preferable that the wiring layer 50 is located at the uppermost layer of the buildup layer 110, whereby the electrical connection between the multilayer printed wiring board and the outside can be easily ensured. The main surface of the plate-shaped carrier is typically the upper or lower surface of the flat carrier.

10‧‧‧Prepreg

20‧‧‧metal foil

25‧‧‧Metal laminate

30‧‧‧ release agent layer

100‧‧‧Base substrate

Claims (37)

A method for producing a base substrate for manufacturing a multilayer printed wiring board, comprising: a step of preparing a resin-made plate-shaped carrier; and a laminated volume layer in which a release agent layer is laminated on the metal foil to the plate-shaped carrier Laminating agent layer is laminated on at least one main surface or on a metal foil laminated on at least one main surface of the plate-shaped carrier, and the metal foil is laminated on the main surface of the plate-shaped carrier The step of the above release agent layer. A method for producing a multilayer printed wiring board, comprising: a step of preparing a base substrate obtained by the production method of claim 1; and laminating one or more layers on the release agent layer of the base substrate The step of forming a layer comprising a combination of an insulating layer and a wiring layer. The method for producing a multilayer printed wiring board according to the second aspect of the invention, wherein the base substrate and the buildup layer have a peel strength of 10 gf/cm or more and 200 gf/cm or less. The method for producing a multilayer printed wiring board according to claim 2, wherein the peeling strength of the base substrate and the build-up layer after heating at 220 ° C for at least one of 3 hours, 6 hours, or 9 hours is 10 gf / cm or more and 200 gf / cm or less. The method for producing a multilayer printed wiring board according to claim 2, wherein the metal foil has a layer thickness of 1 to 400 μm. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, wherein the thickness of the plate-shaped carrier is 5 μm or more and 1000 μm or less. A method of manufacturing a multilayer printed wiring board according to claim 2 or 3, wherein the above The layer thickness of the release agent layer is in the range of 0.001 to 10 μm. The method for producing a multilayer printed wiring board according to claim 2, wherein the metal foil is a copper foil or a copper alloy foil. The method for producing a multilayer printed wiring board according to claim 2, wherein the plate-shaped carrier is a prepreg. The method for producing a multilayer printed wiring board according to claim 2, wherein the plate-shaped carrier has a glass transition temperature Tg of 120 to 320 °C. The method for producing a multilayer printed wiring board according to claim 2 or 3, further comprising the step of separating the base substrate from the buildup layer. The method for producing a multilayer printed wiring board according to claim 11, further comprising the step of layer-forming the layer on the surface of the multilayer printed wiring board obtained by the step of claim 11 of the patent application. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, wherein the build-up layer comprises one or more insulating layers and one or more wiring layers. The method of manufacturing a multilayer printed wiring board according to claim 13, wherein the wiring layer of the one or more layers included in the buildup layer is a patterned or unpatterned metal foil. The method for producing a multilayer printed wiring board according to claim 13, wherein the one or more insulating layers included in the buildup layer are thermosetting resins. The method for producing a multilayer printed wiring board according to claim 13, wherein the one or more insulating layers included in the buildup layer are prepregs. The method for producing a multilayer printed wiring board according to claim 2, wherein the build-up layer comprises one or more single-sided or double-sided metal-clad laminates. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, wherein the build-up layer is formed by at least one of a subtractive method, a full additive method, or a semi-additive method. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, further comprising the step of performing a dicing process on the laminated body in which the buildup layer is laminated on the base substrate. The method for producing a multilayer printed wiring board according to claim 19, wherein the laminate is formed by laminating one or more grooves on the base substrate. The buildup layer is singulated by the groove. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, further comprising the step of forming a via wiring for one or more insulating layers included in the buildup layer. The method for producing a multilayer printed wiring board according to claim 2, wherein the mold release layer is used alone or in combination of a decane compound represented by the following formula, a hydrolyzate thereof, and a condensate of the hydrolyzate. Multiple species, (wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, R ³ and R ⁴ are each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. Any of these atoms of the atom). The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, wherein the mold release layer is a compound having two or less sulfhydryl groups in the molecule. The method for producing a multilayer printed wiring board according to the second or third aspect of the invention, wherein the mold release layer is an aluminate compound, a titanate compound, a zirconate compound, or the like represented by the following formula: The hydrolyzate and the condensate of the hydrolyzate are used singly or in combination of a plurality of (R ¹ ) _m -M-(R ² ) _n (wherein R ¹ is an alkoxy group or a halogen atom, and R ² is selected a hydrocarbon group in a group consisting of a free alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms substituted with any one of the halogen atoms, and M is any one of Al, Ti, and Zr, n 0, 1 or 2, m is an integer of 1 or more and valence of M or less, and at least one of R ¹ is an alkoxy group; further, m + n is a valence of M, that is, in the case of Al 3. In the case of Ti and Zr, it is 4). The method for producing a multilayer printed wiring board according to claim 2, wherein the release agent layer is one or more selected from the group consisting of polyoxymethylene and an epoxy resin, a melamine resin, and a fluororesin. A resin coating film composed of a resin. A multilayer printed wiring board manufactured by the method for producing a multilayer printed wiring board according to the second or third aspect of the patent application. A base substrate for use in a method for producing a multilayer printed wiring board, comprising: a resin-made plate-shaped carrier; a metal foil laminated on at least one main surface of the plate-shaped carrier; A release agent layer laminated on the main surface of the plate-shaped carrier via the metal foil. The base substrate of claim 27, wherein the layer thickness of the metal foil is in the range of 1 to 400 μm. The base substrate of claim 27 or 28, wherein the thickness of the plate-shaped carrier is 5 μm or more and 1000 μm or less. The base substrate of claim 27 or 28, wherein the layer thickness of the release agent layer is in the range of 0.001 to 10 μm. The base substrate of claim 27 or 28, wherein the metal foil is a copper foil or a copper alloy foil. The base substrate of claim 27 or 28, wherein the plate-shaped carrier is a thermosetting resin. The base substrate of claim 27 or 28, wherein the plate-shaped carrier is a prepreg. The base substrate of claim 27 or 28, wherein the release agent layer is obtained by using a decane compound represented by the following formula, a hydrolyzate thereof, or a condensate of the hydrolyzate, alone or in combination. , (wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom; Any of the hydrocarbon groups, R ³ and R ⁴ are each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrogen atoms are substituted with a halogen atom. Any of these atoms of the atom). The base substrate of claim 27 or 28, wherein the release agent layer is formed using a compound having two or less mercapto groups in the molecule. The base substrate of claim 27 or 28, wherein the release agent layer is an aluminate compound, a titanate compound, a zirconate compound, and the like, which are represented by the following formula, The condensate of the hydrolyzate is used singly or in combination of a plurality of (R ¹ ) _m -M-(R ² ) _n (wherein R ¹ is an alkoxy group or a halogen atom, and R ² is selected from an alkyl group, a hydrocarbon group in a group consisting of a cycloalkyl group and an aryl group, or one or more hydrogen atoms substituted with any one of the halogen atoms, M is any one of Al, Ti, Zr, and n is 0, 1 Or 2, m is an integer of 1 or more and M or less, and at least one of R ¹ is an alkoxy group; further, m + n is a valence of M, that is, 3 in the case of Al, in Ti In the case of Zr, it is 4). The base substrate of claim 27 or 28, wherein the release agent layer is composed of polyfluorene oxide and any one or more selected from the group consisting of epoxy resins, melamine resins, and fluororesins. Resin coating film.