WO2013183604A1 - Method for producing multilayer printed wiring board - Google Patents
Method for producing multilayer printed wiring board Download PDFInfo
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- WO2013183604A1 WO2013183604A1 PCT/JP2013/065405 JP2013065405W WO2013183604A1 WO 2013183604 A1 WO2013183604 A1 WO 2013183604A1 JP 2013065405 W JP2013065405 W JP 2013065405W WO 2013183604 A1 WO2013183604 A1 WO 2013183604A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
- B32B2307/5825—Tear resistant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
Definitions
- the present invention relates to a method for manufacturing a multilayer printed wiring board. Moreover, this invention relates to the multilayer laminated board utilized when manufacturing a multilayer printed wiring board.
- a printed wiring board uses, as a basic constituent material, a dielectric material called “prepreg” obtained by impregnating a base material such as a synthetic resin plate, a glass plate, a glass nonwoven fabric, and paper with a synthetic resin. . Further, a sheet such as copper or copper alloy foil having electrical conductivity is bonded to the side facing the prepreg.
- the laminated body thus assembled is generally called a CCL (CopperoppClad Laminate) material.
- the copper foil surface in contact with the prepreg is usually subjected to a rust preventive treatment for preventing oxidation after being subjected to a roughening treatment in order to increase the bonding strength.
- a foil made of aluminum, nickel, zinc or the like may be used instead of the copper or copper alloy foil. Their thickness is about 5 to 200 ⁇ m. This commonly used CCL (Copper Clad Laminate) material is shown in FIG.
- Example 1 of the document a copper foil is bonded to the front and back of the prepreg to form a copper foil with a carrier.
- a desired number of prepregs and then a two-layer printed circuit board called an inner layer core A material assembly unit of a set of four-layer substrates is completed by sequentially stacking a prepreg and a copper foil with a carrier.
- a plate-like carrier made of a prepreg and a metal foil with a carrier made of a metal foil mechanically and detachably adhered to at least one surface of the carrier are plated or metal foil thickness.
- the circuit is formed on the substrate, and after a predetermined number of layers are further stacked, the metal foil with a plate carrier is peeled from the interface between the prepreg and the metal foil, and the peeled surface is further etched to expose the circuit. Yes.
- the manufacturing method of the multilayer printed wiring board described in Patent Document 1 is a metal foil in which a synthetic resin plate-like carrier and at least one surface of the carrier can be easily and manually peeled, that is, mechanically peelable. This is a completely different method from the conventional method for producing a multilayer printed wiring board using a CCL material in that a metal foil with a carrier is used.
- the metal foil with a carrier By using the metal foil with a carrier, the copper foil is supported over the entire surface by the synthetic resin, so that generation of wrinkles on the copper foil during lamination can be prevented.
- the metal foil with carrier since the metal foil with carrier is in close contact with the synthetic resin without a gap, when the surface of the metal foil is plated or etched, it can be poured into a chemical solution for plating or etching. .
- the linear expansion coefficient of the synthetic resin is at the same level as the copper foil that is a constituent material of the substrate and the prepreg after polymerization, the circuit is not misaligned, resulting in fewer defective products, It has the outstanding effect that a yield can be improved.
- the metal foil with a carrier described in Patent Document 1 provides various advantages in manufacturing a multilayer printed wiring board
- the manufacture of the multilayer printed wiring board described in Patent Document 1 The method is limited, and it is considered that there are other methods for producing a multilayer printed wiring board using the metal foil with a carrier.
- this invention makes it one subject to provide the manufacturing method of the new multilayer printed wiring board using the metal foil with a carrier with which the plate-shaped carrier made from a synthetic resin and metal foil are closely_contact
- Another object of the present invention is to provide a multilayer laminate that can be used in the method for producing a multilayer printed wiring board according to the present invention.
- the present invention provides the following method for producing a multilayer printed wiring board.
- step 2 a resin is laminated on both surfaces of the carrier-attached metal foil, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin-made plate carrier and one side of the carrier Or the build-up substrate according to any one of (1) to (3), including a metal foil with a carrier made of a metal foil that is releasably adhered to both surfaces, or a metal foil that is repeatedly laminated one or more times. Production method.
- a single-sided or double-sided wiring board a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin
- substrate which further includes the process of drilling a hole in and carrying out conductive plating to the side surface and bottom face of the said hole.
- a metal foil constituting the single-sided or double-sided wiring board a metal foil constituting a single-sided or double-sided metal-clad laminate, and a metal with a carrier
- substrate which further includes performing the process of forming wiring in at least 1 of the metal foil which comprises foil once or more.
- the method further includes a step of laminating a resin on the surface on which the wiring is formed, and laminating a metal foil with a carrier in which the metal foil is adhered to both surfaces of the resin.
- the plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- a metal foil with a carrier comprising a resinous plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier, and The buildup wiring board provided with the buildup layer which has the insulating layer and the wiring pattern laminated
- the buildup wiring board according to any one of (23).
- the plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- a printed circuit board manufacturing method including a step of manufacturing a build-up board by the manufacturing method according to any one of (1) to (13).
- a method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of (15) to (17).
- step 2 laminating a resin on both sides of the metal foil with carrier, and then laminating the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil repeatedly one or more times.
- the plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the present invention makes it possible to efficiently produce a coreless multilayer printed wiring board having excellent quality stability.
- CCL An example of the configuration of CCL is shown.
- the structural example of the metal foil with a carrier which concerns on this invention is shown.
- the assembly example of the multilayer CCL using the copper foil with a carrier which concerns on this invention (The form which copper foil joined on both surfaces of the resin board) is shown.
- a metal foil with a carrier comprising a resin plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier.
- a metal foil with a carrier used suitably for this invention is shown in FIG. 2 and FIG.
- the metal foil 11 with a carrier in which the metal foil 11a is detachably attached to both surfaces of a resin plate carrier 11c is shown at the beginning of FIG.
- the plate-like carrier 11c and the metal foil 11a are bonded together using a silane compound 11b described later.
- this metal foil with carrier has a structure in which the metal foil and the resin are finally separated and can be easily peeled manually. In this respect, since the CCL is not peeled off, the structure and function are completely different.
- the peel strength between the metal foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more. Therefore, it is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and still more preferably 80 gf / cm or less.
- the metal after assuming at least one of heating for 3 hours, 6 hours or 9 hours at 220 ° C., assuming heating conditions in the production process of the multilayer printed wiring board.
- the peel strength between the foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more, but 200 gf / cm or less. It is preferably 150 gf / cm or less, more preferably 80 gf / cm or less.
- the peel strength after heating at 220 ° C. was described above in both 3 hours and 6 hours, or both 6 hours and 9 hours from the viewpoint of being able to cope with various lamination numbers. It is preferable to satisfy the range, and it is further preferable that all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above-described range.
- the peel strength is measured in accordance with a 90 degree peel strength measuring method defined in JIS C6481.
- the resin that serves as the plate-like carrier is not particularly limited, and phenol resin, polyimide resin, epoxy resin, natural rubber, pine resin, and the like can be used, but a thermosetting resin is preferable.
- a prepreg can also be used. The prepreg before being bonded to the metal foil is preferably in a B-stage state.
- the linear expansion coefficient of the prepreg (C stage) is 12 to 18 ( ⁇ 10 ⁇ 6 / ° C.), 16.5 ( ⁇ 10 ⁇ 6 / ° C.) of the copper foil as the constituent material of the substrate, or 17 of the SUS press plate .3 ( ⁇ 10 ⁇ 6 / ° C.) is advantageous in that it is difficult to cause circuit misalignment due to a phenomenon (scaling change) in which the substrate size before and after pressing differs from that at the time of design. Furthermore, as a synergistic effect of these merits, it becomes possible to produce a multilayer ultra-thin coreless substrate.
- the prepreg used here may be the same as or different from the prepreg constituting the circuit board.
- the plate-like carrier preferably has a high glass transition temperature Tg from the viewpoint of maintaining the peel strength after heating in an optimum range, for example, a glass transition temperature Tg of 120 to 320 ° C., preferably 170 to 240 ° C. .
- the glass transition temperature Tg is a value measured by DSC (differential scanning calorimetry).
- the thermal expansion coefficient of the resin is within + 10% and ⁇ 30% of the thermal expansion coefficient of the metal foil. As a result, it is possible to effectively prevent circuit misalignment due to the difference in thermal expansion between the metal foil and the resin, thereby reducing the occurrence of defective products and improving the yield.
- the thickness of the plate-like carrier is not particularly limited and may be rigid or flexible. However, if it is too thick, it will adversely affect the heat distribution during hot pressing, while if it is too thin, it will bend and will not flow through the printed wiring board manufacturing process. Therefore, it is usually 5 ⁇ m or more and 1000 ⁇ m or less, preferably 50 ⁇ m or more and 900 ⁇ m or less, and more preferably 100 ⁇ m or more and 400 ⁇ m or less.
- the metal foil copper or copper alloy foil is a typical one, but foil of aluminum, nickel, zinc or the like can also be used. In the case of copper or copper alloy foil, electrolytic foil or rolled foil can be used.
- the metal foil generally has a thickness of 1 ⁇ m or more, preferably 5 ⁇ m or more, and 400 ⁇ m or less, preferably 120 ⁇ m or less, considering use as a wiring of a printed circuit board.
- metal foils having the same thickness may be used, or metal foils having different thicknesses may be used.
- the metal foil used may be subjected to various surface treatments.
- metal plating for the purpose of imparting heat resistance Ni plating, Ni—Zn alloy plating, Cu—Ni alloy plating, Cu—Zn alloy plating, Zn plating, Cu—Ni—Zn alloy plating, Co—Ni alloy plating, etc.
- Chromate treatment including the case where one or more alloy elements such as Zn, P, Ni, Mo, Zr and Ti are contained in the chromate treatment solution
- Chromate treatment for imparting rust prevention and discoloration resistance, surface roughness (For example, copper electrodeposition grains, Cu—Ni—Co alloy plating, Cu—Ni—P alloy plating, Cu—Co alloy plating, Cu—Ni alloy plating, Cu—Co alloy plating, And copper alloy plating such as Cu—As alloy plating and Cu—As—W alloy plating).
- the roughening treatment not only affects the peel strength between the metal foil and the plate carrier, but also the chromate treatment has a great influence.
- Chromate treatment is important from the viewpoint of rust prevention and discoloration resistance, but since it tends to significantly increase the peel strength, it is also meaningful as a means for adjusting the peel strength.
- the matte surface (M surface) of the electrolytic copper foil is used as an adhesive surface with the resin, and surface treatment such as roughening treatment is performed.
- the adhesive strength is improved by the chemical and physical anchoring effects.
- various binders are added to increase the adhesive strength with the metal foil.
- the surface roughness of the bonded surface is JIS B 0601: in order to adjust the peel strength between the metal foil and the plate-like carrier to the preferred range described above.
- the ten-point average roughness (Rz jis) of the metal foil surface measured according to 2001 it is preferably 3.5 ⁇ m or less, more preferably 3.0 ⁇ m or less.
- Rz jis ten-point average roughness
- the metal foil When electrolytic copper foil is used as the metal foil, it is possible to use either a glossy surface (shiny surface, S surface) or a rough surface (matte surface, M surface) by adjusting to such a surface roughness. However, it is easier to adjust the surface roughness by using the S-plane. On the other hand, it is preferable that the ten-point average roughness (Rz jis) of the surface of the metal foil not contacting the carrier is 0.4 ⁇ m or more and 10.0 ⁇ m or less.
- the surface treatment for improving the peel strength such as roughening treatment is not performed on the bonding surface of the metal foil with the resin.
- the binder for improving the adhesive force with metal foil is not added in resin.
- the peel strength is adjusted by using a silane compound represented by the following formula, or a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a silane compound) alone or in combination. Also good. This is because by sticking the plate-like carrier and the metal foil together using the silane compound, the adhesiveness is appropriately lowered and the peel strength can be easily adjusted to the above-described range.
- R 1 is an alkoxy group or a halogen atom
- R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms
- Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.
- the silane compound must have at least one alkoxy group.
- a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom
- a substituent is comprised only by group, there exists a tendency for the adhesiveness of a plate-shaped carrier and metal foil surface to fall too much.
- the silane compound is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom.
- the alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms.
- the silane compound has three alkoxy groups and the hydrocarbon group (a hydrocarbon group in which one or more hydrogen atoms are substituted with a halogen atom). It is preferable to have one).
- both R 3 and R 4 are alkoxy groups.
- Alkoxy groups include, but are not limited to, methoxy, ethoxy, n- or iso-propoxy, n-, iso- or tert-butoxy, n-, iso- or neo-pentoxy, n-hexoxy Group, cyclohexyloxy group, n-heptoxy group, n-octoxy group and the like, straight chain, branched or cyclic carbon number of 1-20, preferably carbon number of 1-10, more preferably carbon number of 1- 5 alkoxy groups.
- the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- alkyl group examples include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, and n-hexyl.
- cycloalkyl group examples include, but are not limited to, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and the like, which have 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms.
- An alkyl group is mentioned.
- the aryl group includes a phenyl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, etc., having 6 to 20, preferably 6 to 14 carbon atoms.
- an alkyl group eg, tolyl group,
- one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.
- Examples of preferred silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo-pentyl.
- propyltrimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane, and decyltrimethoxysilane are preferable from the viewpoint of availability.
- the metal foil with carrier can be manufactured by bringing a plate-like carrier and metal foil into close contact with each other by hot pressing. For example, after applying the silane compound to the bonding surface of the metal foil and / or the plate-like carrier as necessary, the B-stage resin plate-like carrier is hot to the bonding surface of the metal foil. It can be manufactured by press lamination.
- the silane compound can be used in the form of an aqueous solution.
- Alcohols such as methanol and ethanol can be added in order to increase the solubility in water.
- the addition of alcohol is particularly effective when a highly hydrophobic silane compound is used.
- the stirring time after the silane compound is dissolved in water can be, for example, 1 to 100 hours, and typically 1 to 30 hours. Of course, there is a method of using without stirring.
- the concentration of the silane compound in the aqueous solution of the silane compound can be 0.01 to 10.0% by volume, and typically 0.1 to 5.0% by volume.
- the pH of the aqueous solution of the silane compound is not particularly limited and can be used on either the acidic side or the alkaline side.
- it can be used at a pH in the range of 3.0 to 10.0.
- the pH is preferably in the range of 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0. .
- a prepreg when used as a plate-like carrier, it is preferable to perform hot pressing at a pressure of 30 to 40 kg / cm 2 and a temperature higher than the glass transition temperature of the prepreg.
- step 2 When manufacturing a buildup substrate, in step 2, buildup layers are formed on both surfaces of the metal foil with a carrier in the following procedure to obtain a buildup substrate. That is, a resin is laminated on each of the metal foil sides on both sides of the metal foil with a carrier described above, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin plate carrier and the carrier A metal foil with a carrier made of a metal foil that is releasably adhered to one side or both sides, or a metal foil is laminated one or more times, for example, 1 to 10 times.
- the metal foil with a carrier composed of a resin-made plate carrier and a metal foil that is peelably adhered to one or both surfaces of the carrier is the metal foil with a carrier described above.
- this also includes a metal carrier that is adhered to only one side of a plate-like carrier.
- At least one build-up wiring layer is laminated on each of the metal foil sides on both sides of the metal foil with a carrier described above.
- the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
- the subtractive method is a method of forming a conductor pattern by selectively removing unnecessary portions of metal foil on a metal-clad laminate or a wiring board (including a printed wiring board and a printed circuit board) by etching or the like. Point to.
- the full additive method is a method of forming a conductor pattern by electroless plating and / or electrolytic plating without using a metal foil for the conductor layer.
- the semi-additive method is an electroless method on a seed layer made of metal foil, for example. In this method, a conductor pattern is formed by using metal deposition and electrolytic plating, etching, or a combination thereof, and then an unnecessary seed layer is removed by etching.
- a hole is made in a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin laminated by the above-described procedure.
- the step of forming wiring on at least one of the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal foil constituting the metal foil with carrier is performed once. It can further include performing the above.
- it may further include a step of laminating a resin on the surface on which the wiring is formed, and laminating the above-described metal foil with a carrier in which the metal foil is adhered to both surfaces of the resin.
- At least one buildup layer 16 having an insulating layer 17 and a wiring pattern 18 is laminated on both sides of the metal foil with carrier 11.
- the build-up layers 16 having an arbitrary number of layers can be formed.
- the electrical connection between the metal foil 11a and the buildup layer 16 can be ensured by appropriately providing a via hole (not shown) penetrating the insulating layer 17 up and down.
- Such a build-up layer 16 may be formed by a known subtractive method, full additive method, and semi-additive method.
- FIG. 3 schematically shows an example of the multilayer laminate after the buildup layer 16 is formed in this manner.
- the buildup layer 16 is formed as follows. First, the resin sheet and metal foil which become the insulating layer 17 are affixed on both surfaces of the metal foil 11 with a carrier.
- This resin sheet is formed of a modified epoxy resin sheet, a polyphenylene ether resin sheet, a polyimide resin sheet, a cyanoester resin sheet, or the like.
- the thickness can generally be 20 to 80 ⁇ m.
- An inorganic filler may be dispersed in this resin sheet.
- As the metal foil a copper foil having a thickness of 1 to 400 ⁇ m, preferably 1 to 70 ⁇ m can be used.
- a through hole or a non-through via hole is formed on the surface of the attached metal foil with a UV laser, a carbon dioxide laser, a YAG laser, an excimer laser, or the like.
- electroless copper plating is performed, a resist is formed on the electroless copper plating layer, exposed and developed, and then the electroless copper plating is applied to the non-resist forming portion, and then the resist is peeled off.
- the wiring pattern 18 is formed by etching the existing electroless copper plating.
- the conductor layer inside the through hole becomes a via hole. By repeating this procedure, the build-up layer can be multi-layered.
- a step of adjusting the thickness by half-etching the entire surface of the metal foil may be included.
- laser processing is performed at a predetermined position of the laminated metal foil to form a via hole penetrating the metal foil and the resin, and after applying a desmear process for removing smear in the via hole, the bottom of the via hole, the side surface and the metal foil
- Electroless plating is performed on the entire surface or a part of the substrate to form an interlayer connection, and further electrolytic plating is performed as necessary.
- a plating resist may be formed in advance on each portion of the metal foil where electroless plating or electrolytic plating is unnecessary before performing each plating.
- the surface of the metal foil may be chemically roughened in advance.
- the plating resist is removed after plating.
- a circuit is formed by removing unnecessary portions of the metal foil and the electroless plating portion and the electrolytic plating portion by etching. Thereby, a build-up layer is formed.
- the steps from the lamination of the resin and the copper foil to the circuit formation may be repeated a plurality of times to form a multilayer build-up substrate.
- one metal foil of the above-mentioned metal foil with a carrier in which the metal foil is adhered to both surfaces may be contacted and laminated.
- a resin as an insulating layer such as a prepreg or a photosensitive resin is applied to the exposed surface of a metal foil of a laminate obtained by laminating a metal foil, such as a copper foil, on both sides of the plate carrier. Laminate. Thereafter, a via hole is formed at a predetermined position of the resin.
- the via hole can be formed by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed.
- the resin in the via hole forming portion can be removed by a photolithography method.
- electroless plating is performed on the bottom and side surfaces of the via holes, the entire surface or a part of the resin to form interlayer connections, and further electrolytic plating is performed as necessary.
- a plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance.
- the plating resist is removed after plating. Next, an unnecessary portion of the electroless plating portion or the electrolytic plating portion is removed by etching to form a circuit. Thereby, a build-up layer is formed.
- the steps from resin lamination to circuit formation may be repeated a plurality of times to form a multilayered build-up substrate. Further, on the outermost surface of the build-up substrate, after the resin is once laminated, one metal foil of the above-described metal foil with a carrier having the metal foil adhered to both surfaces may be brought into contact with each other and laminated.
- each layer can be laminated
- This thermocompression bonding may be performed every time one layer is stacked, may be performed after being laminated to some extent, or may be performed collectively at the end.
- step 2 a resin layer and a metal foil layer are laminated on both surfaces of the metal foil with a carrier in the following procedure to obtain a multilayer metal-clad laminate. That is, a resin is laminated on the metal foil side of both surfaces of the metal foil with a carrier described above, and then the resin or the metal foil is laminated one or more times, for example 1 to 10 times.
- a resin is laminated on both sides of the metal foil with a carrier described above, and then the resin, a single-sided or double-sided metal-clad laminate, or a metal foil with a carrier, or a metal foil is once or more, for example, 1 to 10 times Laminate repeatedly.
- Steps 3 and 4 The build-up substrate obtained in step 2 is further subjected to step 3 (peeling) and step 4 (etching) as necessary to obtain a build-up wiring board.
- step 3 the plate-like carrier 11c of the metal foil with carrier 11 and the metal foils 11a on both sides are separated and separated to obtain a build-up wiring board or a multilayer metal-clad laminate having a metal foil on the outermost surface.
- This process can be performed before or after the build-up layer 16 is completed when manufacturing the build-up wiring board, but is usually performed after forming the wiring pattern 18 on the surface layer of the multilayer laminated board. It is preferable in terms of work efficiency.
- a solder resist can be applied to the surface layer as necessary, but this may be performed at any stage before and after peeling.
- step 4 after separating and separating the plate-like carrier 11c and the metal foil 11a of the metal foil with carrier 11, a part of the surface of the metal foil 11a exposed by the peeling is etched to appropriately perform wiring formation, It is good also as a buildup wiring board. Moreover, when the wiring pattern of the peeling surface of the metal foil 11a is unnecessary in the configuration of the multilayer printed wiring board, the entire surface of the metal foil 11a can be removed by etching. Or when manufacturing a multilayer metal-clad laminate, the multilayer metal-clad laminate from which at least one part or all metal foil was removed from the outermost surface is obtained.
- the printed circuit board is completed by further mounting electronic components on the build-up board obtained in step 2 or the build-up wiring board obtained through step 3 or step 4.
- the coreless multilayer printed wiring board can be manufactured in large quantities with stable quality. This is advantageous in terms of manufacturing.
- the wiring pattern is formed once on the peeling surface of the metal foil, so that it is not necessary to perform the etching process on the metal foil multiple times. The number of processes can be reduced.
- Example 1 A plurality of electrolytic copper foils (thickness 12 ⁇ m) were prepared, and nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn) were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions. (Chromate) treatment, the ten-point average roughness (measured in accordance with JIS B 0601: 2001) of the bonded surface (here, S surface) is 1.5 ⁇ m, and the resin is Mitsubishi Gas Chemical Co., Ltd. A company-prepared prepreg (BT resin) was bonded to the S surface of the electrolytic copper foil and hot-pressed at 190 ° C. for 100 minutes to prepare a copper foil with a carrier.
- BT resin company-prepared prepreg
- Nickel-zinc alloy plating Ni concentration 17g / L (added as NiSO 4 ) Zn concentration 4g / L (added as ZnSO 4 ) pH 3.1 Liquid temperature 40 °C Current density 0.1-10A / dm 2 Plating time 0.1 to 10 seconds
- an aqueous solution of a silane compound is applied to the S surface using a spray coater, and then the copper foil surface is dried in air at 100 ° C., and then bonded to a prepreg. went.
- Table 1 shows the type of silane compound, the stirring time from when the silane compound is dissolved in water to before application, the concentration of the silane compound in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution. Show.
- some of the copper foil with carrier has a heat history during further heat treatment such as hot pressing when a build-up layer is provided on the copper foil with carrier and subsequent circuit formation. Assuming this, heat treatment was performed under the conditions shown in Table 1 (here, 220 ° C. for 3 hours).
- the types of copper foil bonding surfaces, surface treatment conditions and surface roughness Rz jis, silane compound usage conditions, prepreg types, and copper foil and prepreg lamination conditions are as shown in Table 1. is there.
- Treatment liquid 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0 Stirred at room temperature for 12 hours
- Treatment method After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.
- Example 19 to 20> A copper foil with a carrier shown in Table 3 was prepared in the same procedure as in Experimental Example 1 using a silane compound as a copper foil and a resin (prepreg). Further, heat treatment was performed under the conditions shown in Table 3. Evaluation similar to Experimental example 1 was performed about the copper foil with a carrier obtained in this way. The results are shown in Tables 3 and 4.
- the S surface was used as the bonding surface of the copper foil, and the surface was chromated under the above-described conditions.
- the surface roughness Rz cis of the copper foil, the type of prepreg, the use conditions of the silane compound for the surface treatment of the prepreg, and the lamination conditions of the copper foil and the prepreg are as shown in Table 3.
- a 100 ⁇ m diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine.
- electroless copper plating on the copper foil surface on the copper foil with carrier exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate, and copper plating by electrolytic copper plating The electrical connection was formed between the copper foil on the copper foil with a carrier and the copper foil on the surface of the four-layer copper-clad laminate.
- a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer buildup substrate was obtained.
- the two-layer build-up wiring boards were obtained by peeling off and separating the plate-like carrier of the copper foil with carrier and the copper foil.
- the copper foil that was in close contact with the plate-like carrier on the two sets of two-layer build-up wiring boards was etched to form a wiring to obtain two sets of two-layer build-up wiring boards.
- the resin was destroyed at the time of build-up during the peeling operation of the copper foil in the carrier-attached copper foil, or the resin remained on the copper foil surface without being peeled off.
- the resin was peeled off without being destroyed during the copper foil peeling operation in the carrier-added copper foil during build-up, but the copper foil was removed without peeling operation. Sometimes peeled off.
Abstract
Description
(1)樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔を準備する工程1と、
前記キャリア付金属箔の両側に絶縁層及び配線パターンを有するビルドアップ層を少なくとも一層ずつ積層する工程2と
を含むビルドアップ基板の製造方法。
(2)前記工程2において、前記キャリア付金属箔の両面に、ビルドアップ配線層を一層以上形成する工程を含む(1)に記載のビルドアップ基板の製造方法。
(3)前記ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一つを用いて形成される(2)に記載のビルドアップ基板の製造方法。
(4)前記工程2において、前記キャリア付金属箔の両面に樹脂を積層し、次いで樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、または樹脂製の板状キャリアと該キャリアの片面または両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含む(1)~(3)のいずれかに記載のビルドアップ基板の製造方法。
(5)(4)に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、キャリア付金属箔の金属箔、キャリア付金属箔の板状キャリア、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。
(6)(4)または(5)に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、及びキャリア付金属箔を構成する金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。
(7)配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させたキャリア付金属箔を積層する工程を更に含む(2)~(6)のいずれかに記載のビルドアップ基板の製造方法。
(8)樹脂製の板状キャリアが熱硬化性樹脂を含む、(1)~(7)のいずれかに記載のビルドアップ基板の製造方法。
(9)樹脂製の板状キャリアがプリプレグである(1)~(8)のいずれかに記載のビルドアップ基板の製造方法。
(10)キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(1)~(9)のいずれかに記載のビルドアップ基板の製造方法。
(11)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(1)~(10)のいずれかに記載のビルドアップ基板の製造方法。
(12)キャリア付き金属箔を構成する板状キャリアと金属箔は次式: In one aspect, the present invention provides the following method for producing a multilayer printed wiring board.
(1)
And a step 2 of laminating at least one buildup layer having an insulating layer and a wiring pattern on both sides of the metal foil with a carrier.
(2) The method for manufacturing a buildup substrate according to (1), including a step of forming one or more buildup wiring layers on both surfaces of the metal foil with a carrier in the step 2.
(3) The buildup wiring layer manufacturing method according to (2), wherein the buildup wiring layer is formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
(4) In the step 2, a resin is laminated on both surfaces of the carrier-attached metal foil, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin-made plate carrier and one side of the carrier Or the build-up substrate according to any one of (1) to (3), including a metal foil with a carrier made of a metal foil that is releasably adhered to both surfaces, or a metal foil that is repeatedly laminated one or more times. Production method.
(5) In the method for manufacturing a build-up board according to (4), a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin The manufacturing method of the buildup board | substrate which further includes the process of drilling a hole in and carrying out conductive plating to the side surface and bottom face of the said hole.
(6) In the method for manufacturing a buildup substrate according to (4) or (5), a metal foil constituting the single-sided or double-sided wiring board, a metal foil constituting a single-sided or double-sided metal-clad laminate, and a metal with a carrier The manufacturing method of the buildup board | substrate which further includes performing the process of forming wiring in at least 1 of the metal foil which comprises foil once or more.
(7) The method further includes a step of laminating a resin on the surface on which the wiring is formed, and laminating a metal foil with a carrier in which the metal foil is adhered to both surfaces of the resin. (2) to (6) The manufacturing method of the build-up board | substrate of description.
(8) The method for manufacturing a build-up board according to any one of (1) to (7), wherein the resin-made plate-like carrier contains a thermosetting resin.
(9) The method for producing a build-up board according to any one of (1) to (8), wherein the resin-made plate-like carrier is a prepreg.
(10) The method for manufacturing a build-up substrate according to any one of (1) to (9), wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less.
(11) The peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (1) to (10) The manufacturing method of the buildup board | substrate in any one of.
(12) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる(1)~(11)のいずれかに記載のビルドアップ基板の製造方法。
(13)キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である(1)~(12)のいずれかに記載のビルドアップ基板の製造方法。
(14)(1)~(13)のいずれかに記載の製造方法により製造したビルドアップ基板。
(15)(1)~(13)のいずれかに記載の製造方法において、更に、前記キャリア付き金属箔から両面の金属箔を剥離して分離する工程3を含む、ビルドアップ配線板の製造方法。
(16)更に、前記工程3にて露出した金属箔の全面をエッチングにより除去するか、表面の一部をエッチングして配線パターンを形成する工程4を含む(15)に記載のビルドアップ配線板の製造方法。
(17)前記工程4では、剥離によって露出した金属箔の表面の一部をエッチングして配線パターンを形成する(16)に記載のビルドアップ配線板の製造方法。
(18)樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付き金属箔、並びに、
前記キャリア付き金属箔の両側に少なくとも一層ずつ積層された、絶縁層及び配線パターンを有するビルドアップ層
を備えたビルドアップ配線板。
(19)(15)~(17)のいずれかに記載の製造方法により製造した、ビルドアップ配線板。
(20)コアレス多層プリント配線板の製造用である(18)または(19)に記載のビルドアップ配線板。
(21)樹脂製の板状キャリアが熱硬化性樹脂を含む、(18)~(20)のいずれかに記載のビルドアップ配線板。
(22)樹脂製の板状キャリアがプリプレグである(18)~(21)のいずれかに記載のビルドアップ配線板。
(23)キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(18)~(22)のいずれかに記載のビルドアップ配線板。
(24)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(18)~(23)のいずれかに記載のビルドアップ配線板。
(25)キャリア付き金属箔を構成する板状キャリアと金属箔は次式: Wherein R 1 is an alkoxy group or a halogen atom, and R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The build-up substrate according to any one of (1) to (11), wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product are bonded together using one or a combination of two or more. Method.
(13) The method for producing a build-up board according to any one of (1) to (12), wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
(14) A build-up substrate manufactured by the manufacturing method according to any one of (1) to (13).
(15) The method for manufacturing a build-up wiring board according to any one of (1) to (13), further comprising a step 3 of separating and separating the metal foils on both sides from the metal foil with a carrier. .
(16) The buildup wiring board according to (15), further including a step 4 of forming a wiring pattern by etching the entire surface of the metal foil exposed in the step 3 or etching a part of the surface. Manufacturing method.
(17) In the step 4, the build-up wiring board manufacturing method according to (16), wherein a part of the surface of the metal foil exposed by peeling is etched to form a wiring pattern.
(18) a metal foil with a carrier comprising a resinous plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier, and
The buildup wiring board provided with the buildup layer which has the insulating layer and the wiring pattern laminated | stacked at least one layer on both sides of the metal foil with a carrier.
(19) A build-up wiring board manufactured by the manufacturing method according to any one of (15) to (17).
(20) The build-up wiring board according to (18) or (19), which is used for manufacturing a coreless multilayer printed wiring board.
(21) The build-up wiring board according to any one of (18) to (20), wherein the resin-made plate-like carrier contains a thermosetting resin.
(22) The build-up wiring board according to any one of (18) to (21), wherein the resin plate carrier is a prepreg.
(23) The build-up wiring board according to any one of (18) to (22), wherein the peel strength between the plate-like carrier constituting the metal foil with a carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less.
(24) The peel strength between the metal foil and the plate carrier after heating at 220 ° C. for at least one of 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (18) to (23) The buildup wiring board according to any one of (23).
(25) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる(18)~(24)のいずれかに記載のビルドアップ配線板。
(26)キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である(18)~(25)のいずれか一項に記載のビルドアップ配線板。
(27)(1)~(13)のいずれかに記載の製造方法によりビルドアップ基板を製造する工程を含むプリント回路板の製造方法。
(28)(15)~(17)のいずれかに記載の製造方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。
(29)樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付き金属箔を準備する工程1と、
前記キャリア付き金属箔の両側に、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層する工程2と
を含む多層金属張積層板の製造方法。
(30)前記工程2において、前記キャリア付金属箔の両側に樹脂を積層し、次いで樹脂、片面あるいは両面金属張積層板、またはキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含む、(29)に記載の多層金属張積層板の製造方法。
(31)樹脂製の板状キャリアが熱硬化性樹脂を含む、(29)または(30)に記載の多層金属張積層板の製造方法。
(32)樹脂製の板状キャリアがプリプレグである(29)~(31)のいずれかに記載の多層金属張積層板の製造方法。
(33)キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である(29)~(32)のいずれかに記載の多層金属張積層板の製造方法。
(34)220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である(29)~(33)のいずれかに記載の多層金属張積層板の製造方法。
(35)キャリア付き金属箔を構成する板状キャリアと金属箔は次式: Wherein R 1 is an alkoxy group or a halogen atom, and R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The build-up wiring board according to any one of (18) to (24), wherein the silane compound, a hydrolysis product thereof, and a condensate of the hydrolysis product are bonded together using one or a combination thereof.
(26) The build-up wiring board according to any one of (18) to (25), wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
(27) A printed circuit board manufacturing method including a step of manufacturing a build-up board by the manufacturing method according to any one of (1) to (13).
(28) A method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of (15) to (17).
(29)
Step 2 of laminating a resin on both sides of the metal foil with a carrier, and then laminating the resin or the metal foil one or more times.
(30) In step 2, laminating a resin on both sides of the metal foil with carrier, and then laminating the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil repeatedly one or more times. The manufacturing method of the multilayer metal-clad laminate as described in (29) containing this.
(31) The method for producing a multilayer metal-clad laminate according to (29) or (30), wherein the resin-made plate-like carrier contains a thermosetting resin.
(32) The method for producing a multilayer metal-clad laminate according to any one of (29) to (31), wherein the resin-made plate carrier is a prepreg.
(33) Production of a multilayer metal-clad laminate according to any one of (29) to (32), wherein the peel strength between the plate-like carrier constituting the metal foil with carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less. Method.
(34) The peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is not less than 10 gf / cm and not more than 200 gf / cm. (33) The manufacturing method of the multilayer metal clad laminated board in any one of.
(35) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる(29)~(34)のいずれかに記載の多層金属張積層板の製造方法。
(36)キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である(29)~(35)のいずれかに記載の多層金属張積層板の製造方法。
(37)(29)~(36)のいずれかに記載の多層金属張積層板の製造方法において、前記キャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。
(38)(37)に記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。
(39)(29)~(38)のいずれかに記載の製造方法により得られる多層金属張積層板。 Wherein R 1 is an alkoxy group or a halogen atom, and R 2 is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R 3 and R 4 are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
A multilayer metal-clad laminate according to any one of (29) to (34), wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are bonded together using one or a combination of two or more thereof Manufacturing method.
(36) The method for producing a multilayer metal-clad laminate according to any one of (29) to (35), wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
(37) The method for producing a multilayer metal-clad laminate according to any one of (29) to (36), further comprising a step of peeling and separating the plate-like carrier and metal foil of the metal foil with carrier. A method for producing a metal-clad laminate.
(38) The method for producing a multilayer metal-clad laminate comprising the step of removing a part or all of the separated and separated metal foil by etching in the production method according to (37).
(39) A multilayer metal-clad laminate obtained by the production method according to any one of (29) to (38).
樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔を準備する工程1と、
前記キャリア付金属箔の両側に絶縁層及び配線パターンを有するビルドアップ層を少なくとも一層ずつ積層する工程2と、
を含む。 In one embodiment of a method for producing a multilayer printed wiring board according to the present invention,
Step 2 of laminating at least one buildup layer having an insulating layer and a wiring pattern on both sides of the metal foil with carrier,
including.
工程1では、樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔を準備する。本発明に好適に使用されるキャリア付金属箔の一構成例を図2および図3に示す。特に、図3の最初のところには、樹脂製の板状キャリア11cの両面に、金属箔11aを剥離可能に密着させたキャリア付き金属箔11が示されている。板状キャリア11cと金属箔11aとは、後述するシラン化合物11bを用いて貼り合わせられている。 <
In
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子およびヨウ素原子が挙げられる。 Alkoxy groups include, but are not limited to, methoxy, ethoxy, n- or iso-propoxy, n-, iso- or tert-butoxy, n-, iso- or neo-pentoxy, n-hexoxy Group, cyclohexyloxy group, n-heptoxy group, n-octoxy group and the like, straight chain, branched or cyclic carbon number of 1-20, preferably carbon number of 1-10, more preferably carbon number of 1- 5 alkoxy groups.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
ビルドアップ基板を製造する場合、工程2では、以下のような手順でキャリア付金属箔の両面にビルドアップ層を形成して、ビルドアップ基板を得る。
すなわち、上述したキャリア付金属箔の両側の金属箔側のそれぞれに樹脂を積層し、次いで樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、または樹脂製の板状キャリアと該キャリアの片面または両面に剥離可能に密着させた金属箔とからなるキャリア付き金属箔、または金属箔を1回以上、例えば1~10回繰り返して積層する。なお、樹脂製の板状キャリアと該キャリアの片面または両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔は、上述したキャリア付金属箔において、金属箔を板状キャリアの両面に密着させたキャリア付金属箔に加えて、板状キャリアの片面のみに金属箔を密着させたものも含む意味である。 <Step 2>
When manufacturing a buildup substrate, in step 2, buildup layers are formed on both surfaces of the metal foil with a carrier in the following procedure to obtain a buildup substrate.
That is, a resin is laminated on each of the metal foil sides on both sides of the metal foil with a carrier described above, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin plate carrier and the carrier A metal foil with a carrier made of a metal foil that is releasably adhered to one side or both sides, or a metal foil is laminated one or more times, for example, 1 to 10 times. In addition, the metal foil with a carrier composed of a resin-made plate carrier and a metal foil that is peelably adhered to one or both surfaces of the carrier is the metal foil with a carrier described above. In addition to the closely attached metal foil with a carrier, this also includes a metal carrier that is adhered to only one side of a plate-like carrier.
さらに、このビルドアップ基板の最表面には、一旦樹脂を積層した後に、両面に金属箔を密着させた上述のキャリア付金属箔の一方の金属箔を接触させて積層してもよい。 As another method, a resin as an insulating layer such as a prepreg or a photosensitive resin is applied to the exposed surface of a metal foil of a laminate obtained by laminating a metal foil, such as a copper foil, on both sides of the plate carrier. Laminate. Thereafter, a via hole is formed at a predetermined position of the resin. For example, when a prepreg is used as the resin, the via hole can be formed by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed. When a photosensitive resin is used as the resin, the resin in the via hole forming portion can be removed by a photolithography method. Next, electroless plating is performed on the bottom and side surfaces of the via holes, the entire surface or a part of the resin to form interlayer connections, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, an unnecessary portion of the electroless plating portion or the electrolytic plating portion is removed by etching to form a circuit. Thereby, a build-up layer is formed. The steps from resin lamination to circuit formation may be repeated a plurality of times to form a multilayered build-up substrate.
Further, on the outermost surface of the build-up substrate, after the resin is once laminated, one metal foil of the above-described metal foil with a carrier having the metal foil adhered to both surfaces may be brought into contact with each other and laminated.
すなわち、上述したキャリア付金属箔の両面の金属箔側に対して、樹脂を積層し、次いで樹脂又は金属箔を1回以上、例えば1~10回繰り返して積層する。 When a multilayer metal-clad laminate is manufactured, in step 2, a resin layer and a metal foil layer are laminated on both surfaces of the metal foil with a carrier in the following procedure to obtain a multilayer metal-clad laminate.
That is, a resin is laminated on the metal foil side of both surfaces of the metal foil with a carrier described above, and then the resin or the metal foil is laminated one or more times, for example 1 to 10 times.
工程2により得られたビルドアップ基板に対して、更に工程3(剥離)および必要に応じて工程4(エッチング)を行って、ビルドアップ配線板を得る。
工程3では、キャリア付金属箔11の板状キャリア11cと両面の金属箔11aとを剥離して分離し、ビルドアップ配線板または最表面が金属箔の多層金属張積層板が得られる。当該工程は、ビルドアップ配線板を製造するに際しては、ビルドアップ層16が完成する前後の何れに行うこともできるが、通常は多層積層板の表層における配線パターン18を形成した後に行うのが、作業効率の上で好ましい。また、ビルドアップ配線板および多層金属張積層板のいずれにおいても表層には必要に応じてソルダーレジストを塗工することもできるが、これも剥離前後の何れの段階で実施しても良い。 <Steps 3 and 4>
The build-up substrate obtained in step 2 is further subjected to step 3 (peeling) and step 4 (etching) as necessary to obtain a build-up wiring board.
In step 3, the plate-
<実験例1>
複数の電解銅箔(厚さ12μm)を準備し、それぞれの電解銅箔のシャイニー(S)面に対して、下記の条件によるニッケル-亜鉛(Ni-Zn)合金めっき処理およびクロメート(Cr-Znクロメート)処理を施し、貼り合わせ面(ここではS面)の十点平均粗さ(Rz jis:JIS B 0601:2001に準拠して測定)を1.5μmとした後、樹脂として三菱ガス化学株式会社製のプリプレグ(BTレジン)を当該電解銅箔のS面と貼り合わせ、190℃で100分ホットプレス加工を行って、キャリア付銅箔を作製した。 (Metal foil with carrier)
<Experimental example 1>
A plurality of electrolytic copper foils (thickness 12 μm) were prepared, and nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn) were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions. (Chromate) treatment, the ten-point average roughness (measured in accordance with JIS B 0601: 2001) of the bonded surface (here, S surface) is 1.5 μm, and the resin is Mitsubishi Gas Chemical Co., Ltd. A company-prepared prepreg (BT resin) was bonded to the S surface of the electrolytic copper foil and hot-pressed at 190 ° C. for 100 minutes to prepare a copper foil with a carrier.
Ni濃度 17g/L(NiSO4として添加)
Zn濃度 4g/L(ZnSO4として添加)
pH 3.1
液温 40℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒 (Nickel-zinc alloy plating)
Ni concentration 17g / L (added as NiSO 4 )
Zn concentration 4g / L (added as ZnSO 4 )
pH 3.1
Liquid temperature 40 ℃
Current density 0.1-10A / dm 2
Plating time 0.1 to 10 seconds
Cr濃度 1.4g/L(CrO3またはK2CrO7として添加)
Zn濃度 0.01~1.0g/L(ZnSO4として添加)
Na2SO4濃度 10g/L
pH 4.8
液温 55℃
電流密度 0.1~10A/dm2
めっき時間 0.1~10秒 (Chromate treatment)
Cr concentration 1.4g / L (added as CrO 3 or K 2 CrO 7 )
Zn concentration 0.01 to 1.0 g / L (added as ZnSO 4 )
Na 2 SO 4 concentration 10 g / L
pH 4.8
Liquid temperature 55 ℃
Current density 0.1-10A / dm 2
Plating time 0.1 to 10 seconds
表1に示す銅箔、樹脂(プリプレグ)および一部はシラン化合物を用いて、実験例1と同様の手順で、キャリア付銅箔を作製した。いくつかの実験例では更に表1に示した条件の熱処理を行った。それぞれについて実験例1と同様の評価を行った。結果を表1、2に示す。 <Experimental Examples 2 to 18>
Copper foil with a carrier shown in Table 1 was prepared in the same procedure as in Experimental Example 1 using a silane compound as a copper foil and a resin (prepreg). In some experimental examples, heat treatment under the conditions shown in Table 1 was further performed. Each was evaluated in the same way as in Experimental Example 1. The results are shown in Tables 1 and 2.
処理液:3-グリシドキシプロピルトリメトキシシラン 0.9体積%水溶液
pH5.0~9.0
12時間常温で攪拌したもの
処理方法:スプレーコーターを用いて処理液を塗布後、100℃の空気中で5分間処理面を乾燥させる。 (Epoxysilane treatment)
Treatment liquid: 3-glycidoxypropyltrimethoxysilane 0.9 volume% aqueous solution pH 5.0 to 9.0
Stirred at room temperature for 12 hours Treatment method: After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.
Cu濃度 20g/L(CuSO4として添加)
H2SO4濃度 50~100g/L
As濃度 0.01~2.0g/L(亜ヒ酸として添加)
液温 40℃
電流密度 40~100A/dm2
めっき時間 0.1~30秒 (Roughening treatment)
Cu concentration 20 g / L (added as CuSO 4 )
H 2 SO 4 concentration 50 ~ 100g / L
As concentration 0.01-2.0 g / L (added as arsenite)
Liquid temperature 40 ℃
Current density 40-100A / dm 2
Plating time 0.1-30 seconds
表3に示す銅箔、樹脂(プリプレグ)および一部はシラン化合物を用いて、実験例1と同様の手順で、キャリア付銅箔を作製した。更に表3に示した条件の熱処理を行った。こうして得られたキャリア付銅箔について実験例1と同様の評価を行った。結果を表3、4に示す。 <Experimental Examples 19 to 20>
A copper foil with a carrier shown in Table 3 was prepared in the same procedure as in Experimental Example 1 using a silane compound as a copper foil and a resin (prepreg). Further, heat treatment was performed under the conditions shown in Table 3. Evaluation similar to Experimental example 1 was performed about the copper foil with a carrier obtained in this way. The results are shown in Tables 3 and 4.
このようにして作製したキャリア付銅箔の両側に、FR-4プリプレグ(南亜プラスティック社製)、銅箔(JX日鉱日石金属(株)製、JTC12μm(製品名))を順に重ね、3MPaの圧力で各表に示した加熱条件にてホットプレスを行い、4層銅張積層板を作製した。 (Build-up wiring board)
FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12 μm (product name)) are sequentially stacked on both sides of the copper foil with a carrier thus produced. A four-layer copper clad laminate was produced by hot pressing under the heating conditions shown in each table under the pressure of.
また、「N」と評価された条件については、ビルドアップに際してキャリア付銅箔における銅箔の剥離操作のときに樹脂が破壊されたか、あるいは剥がれず銅箔表面に樹脂が残った。
また、「-」と評価された条件については、ビルドアップに際してキャリア付銅箔における銅箔の剥離操作のときに樹脂が破壊されることなく剥がれたが、中には剥離操作なしで銅箔が剥がれることがあった。 In each experimental example, a plurality of four-layer build-up substrates were prepared, and for each, the degree of adhesion between the prepreg and the copper foil constituting the copper foil with carrier in the build-up substrate manufacturing process was confirmed visually. In the build-up wiring board using the copper foil with a carrier produced under the conditions where the peel strength and the peel strength after heating are evaluated as “S” and “G” in Table 3, the resin of the copper foil with the carrier at the time of build-up The (plate-like carrier) could be peeled without being destroyed. However, with respect to the conditions evaluated as “G”, as described in Tables 1 and 3, there were some cases where the copper foil was peeled off from the plate-shaped carrier without a peeling operation during build-up.
As for the condition evaluated as “N”, the resin was destroyed at the time of build-up during the peeling operation of the copper foil in the carrier-attached copper foil, or the resin remained on the copper foil surface without being peeled off.
As for the conditions evaluated as “-”, the resin was peeled off without being destroyed during the copper foil peeling operation in the carrier-added copper foil during build-up, but the copper foil was removed without peeling operation. Sometimes peeled off.
11a 金属箔
11b シラン化合物
11c 板状キャリア
16 ビルドアップ層
17 絶縁層
18 配線パターン
Claims (39)
- 樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔を準備する工程1と、
前記キャリア付金属箔の両側に絶縁層及び配線パターンを有するビルドアップ層を少なくとも一層ずつ積層する工程2と
を含むビルドアップ基板の製造方法。 Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier;
And a step 2 of laminating at least one buildup layer having an insulating layer and a wiring pattern on both sides of the metal foil with a carrier. - 前記工程2において、前記キャリア付金属箔の両面に、ビルドアップ配線層を一層以上形成する工程を含む請求項1に記載のビルドアップ基板の製造方法。 The method for manufacturing a build-up substrate according to claim 1, wherein the step 2 includes a step of forming one or more build-up wiring layers on both surfaces of the metal foil with a carrier.
- 前記ビルドアップ配線層はサブトラクティブ法又はフルアディティブ法又はセミアディティブ法の少なくとも一つを用いて形成される請求項2に記載のビルドアップ基板の製造方法。 3. The build-up board manufacturing method according to claim 2, wherein the build-up wiring layer is formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
- 前記工程2において、前記キャリア付金属箔の両面に樹脂を積層し、次いで樹脂、片面あるいは両面配線基板、片面あるいは両面金属張積層板、または樹脂製の板状キャリアと該キャリアの片面または両面に剥離可能に密着させた金属箔とからなるキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含む請求項1~3のいずれか一項に記載のビルドアップ基板の製造方法。 In the step 2, a resin is laminated on both surfaces of the metal foil with a carrier, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resinous plate-like carrier and one or both sides of the carrier The method for producing a build-up substrate according to any one of claims 1 to 3, comprising: laminating a metal foil with a carrier composed of a metal foil closely attached in a peelable manner or a metal foil repeatedly one or more times.
- 請求項4に記載のビルドアップ基板の製造方法において、片面あるいは両面配線基板、片面あるいは両面金属張積層板、キャリア付金属箔の金属箔、キャリア付金属箔の板状キャリア、又は樹脂に穴を開け、当該穴の側面および底面に導通めっきをする工程を更に含むビルドアップ基板の製造方法。 5. The method of manufacturing a build-up board according to claim 4, wherein a hole is formed in a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin. A method for manufacturing a build-up substrate, further comprising the steps of opening and conducting conductive plating on the side surface and bottom surface of the hole.
- 請求項4または5に記載のビルドアップ基板の製造方法において、前記片面あるいは両面配線基板を構成する金属箔、片面あるいは両面金属張積層板を構成する金属箔、及びキャリア付金属箔を構成する金属箔の少なくとも一つに配線を形成する工程を1回以上行うことを更に含むビルドアップ基板の製造方法。 6. The method for manufacturing a buildup board according to claim 4 or 5, wherein the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal constituting the metal foil with carrier A method for manufacturing a build-up substrate, further comprising performing the step of forming a wiring on at least one of the foils once or more.
- 配線形成された表面の上に、樹脂を積層し、当該樹脂に両面に金属箔を密着させたキャリア付金属箔を積層する工程を更に含む請求項2~6のいずれか一項に記載のビルドアップ基板の製造方法。 The build according to any one of claims 2 to 6, further comprising a step of laminating a resin on a surface on which wiring is formed, and laminating a metal foil with a carrier in which a metal foil is adhered to both surfaces of the resin. Method for manufacturing an up board.
- 樹脂製の板状キャリアが熱硬化性樹脂を含む、請求項1~7のいずれか一項に記載のビルドアップ基板の製造方法。 The method for manufacturing a build-up board according to any one of claims 1 to 7, wherein the resin-made plate-shaped carrier contains a thermosetting resin.
- 樹脂製の板状キャリアがプリプレグである請求項1~8のいずれか一項に記載のビルドアップ基板の製造方法。 The method for manufacturing a buildup substrate according to any one of claims 1 to 8, wherein the resin-made plate carrier is a prepreg.
- キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項1~9のいずれか一項に記載のビルドアップ基板の製造方法。 The method for producing a buildup substrate according to any one of claims 1 to 9, wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項1~10のいずれか一項に記載のビルドアップ基板の製造方法。 The peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less. A method for manufacturing a build-up board according to claim 1.
- キャリア付き金属箔を構成する板状キャリアと金属箔は次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる請求項1~11のいずれか一項に記載のビルドアップ基板の製造方法。 The plate-like carrier and metal foil that make up the metal foil with the carrier have the following formula:
The production of a build-up substrate according to any one of claims 1 to 11, wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product are bonded together using one or a combination of two or more thereof. Method. - キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である請求項1~12のいずれか一項に記載のビルドアップ基板の製造方法。 The method for producing a buildup substrate according to any one of claims 1 to 12, wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
- 請求項1~13のいずれか一項に記載の製造方法により製造したビルドアップ基板。 A build-up board manufactured by the manufacturing method according to any one of claims 1 to 13.
- 請求項1~13のいずれか一項に記載の製造方法において、更に、前記キャリア付き金属箔から両面の金属箔を剥離して分離する工程3を含む、ビルドアップ配線板の製造方法。 14. The method for manufacturing a build-up wiring board according to any one of claims 1 to 13, further comprising a step 3 of separating and separating the metal foils on both sides from the metal foil with a carrier.
- 更に、前記工程3にて露出した金属箔の全面をエッチングにより除去するか、表面の一部をエッチングして配線パターンを形成する工程4を含む請求項15に記載のビルドアップ配線板の製造方法。 The method for manufacturing a build-up wiring board according to claim 15, further comprising a step 4 of forming a wiring pattern by etching the entire surface of the metal foil exposed in the step 3 or etching a part of the surface. .
- 前記工程4では、剥離によって露出した金属箔の表面の一部をエッチングして配線パターンを形成する請求項16に記載のビルドアップ配線板の製造方法。 The method for manufacturing a build-up wiring board according to claim 16, wherein in the step 4, a part of the surface of the metal foil exposed by peeling is etched to form a wiring pattern.
- 樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付き金属箔、並びに、
前記キャリア付き金属箔の両側に少なくとも一層ずつ積層された、絶縁層及び配線パターンを有するビルドアップ層
を備えたビルドアップ配線板。 A metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is releasably adhered to both surfaces of the carrier, and
The buildup wiring board provided with the buildup layer which has the insulating layer and the wiring pattern laminated | stacked at least one layer on both sides of the metal foil with a carrier. - 請求項15~17のいずれか一項に記載の製造方法により製造した、ビルドアップ配線板。 A build-up wiring board manufactured by the manufacturing method according to any one of claims 15 to 17.
- コアレス多層プリント配線板の製造用である請求項18または19に記載のビルドアップ配線板。 The build-up wiring board according to claim 18 or 19, which is used for manufacturing a coreless multilayer printed wiring board.
- 樹脂製の板状キャリアが熱硬化性樹脂を含む、請求項18~20のいずれか一項に記載のビルドアップ配線板。 The build-up wiring board according to any one of claims 18 to 20, wherein the resin-made plate-shaped carrier includes a thermosetting resin.
- 樹脂製の板状キャリアがプリプレグである請求項18~21のいずれか一項に記載のビルドアップ配線板。 The build-up wiring board according to any one of claims 18 to 21, wherein the resin-made plate carrier is a prepreg.
- キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項18~22のいずれか一項に記載のビルドアップ配線板。 The build-up wiring board according to any one of claims 18 to 22, wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項18~23のいずれか一項に記載のビルドアップ配線板。 The peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less. The build-up wiring board according to claim 1.
- キャリア付き金属箔を構成する板状キャリアと金属箔は次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる請求項18~24のいずれか一項に記載のビルドアップ配線板。 The plate-like carrier and metal foil that make up the metal foil with the carrier have the following formula:
The build-up wiring board according to any one of claims 18 to 24, wherein the silane compound, a hydrolysis product thereof, and a condensate of the hydrolysis product are bonded together using one or a combination of two or more. - キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である請求項18~25のいずれか一項に記載のビルドアップ配線板。 The build-up wiring board according to any one of claims 18 to 25, wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
- 請求項1~13のいずれか一項に記載の製造方法によりビルドアップ基板を製造する工程を含むプリント回路板の製造方法。 A method for producing a printed circuit board, comprising a step of producing a build-up board by the production method according to any one of claims 1 to 13.
- 請求項15~17のいずれか一項に記載の製造方法によりビルドアップ配線板を製造する工程を含むプリント回路板の製造方法。 A method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of claims 15 to 17.
- 樹脂製の板状キャリアと該キャリアの両面に剥離可能に密着させた金属箔とからなるキャリア付き金属箔を準備する工程1と、
前記キャリア付き金属箔の両側に、樹脂を積層し、次いで樹脂又は金属箔を1回以上繰り返して積層する工程2と
を含む多層金属張積層板の製造方法。 Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil releasably adhered to both surfaces of the carrier;
Step 2 of laminating a resin on both sides of the metal foil with a carrier, and then laminating the resin or the metal foil one or more times. - 前記工程2において、前記キャリア付金属箔の両側に樹脂を積層し、次いで樹脂、片面あるいは両面金属張積層板、またはキャリア付金属箔、または金属箔を1回以上繰り返して積層することを含む、請求項29に記載の多層金属張積層板の製造方法。 In the step 2, including laminating a resin on both sides of the metal foil with carrier, and then laminating the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil repeatedly, one or more times, A method for producing a multilayer metal-clad laminate according to claim 29.
- 樹脂製の板状キャリアが熱硬化性樹脂を含む、請求項29または30に記載の多層金属張積層板の製造方法。 The method for producing a multilayer metal-clad laminate according to claim 29 or 30, wherein the resinous plate-like carrier contains a thermosetting resin.
- 樹脂製の板状キャリアがプリプレグである請求項29~31のいずれか一項に記載の多層金属張積層板の製造方法。 The method for producing a multilayer metal-clad laminate according to any one of claims 29 to 31, wherein the resin-made plate carrier is a prepreg.
- キャリア付き金属箔を構成する板状キャリアと金属箔の剥離強度が10gf/cm以上200gf/cm以下である請求項29~32のいずれか一項に記載の多層金属張積層板の製造方法。 The method for producing a multilayer metal-clad laminate according to any one of claims 29 to 32, wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less.
- 220℃で3時間、6時間または9時間のうちの少なくとも一つの加熱後における、金属箔と板状キャリアとの剥離強度が、10gf/cm以上200gf/cm以下である請求項29~33のいずれか一項に記載の多層金属張積層板の製造方法。 The peel strength between the metal foil and the plate-like carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less. A method for producing a multilayer metal-clad laminate according to claim 1.
- キャリア付き金属箔を構成する板状キャリアと金属箔は次式:
に示すシラン化合物、その加水分解生成物、該加水分解生成物の縮合体を単独で又は複数組み合わせて用いて貼り合わせてなる請求項29~34のいずれか一項に記載の多層金属張積層板の製造方法。 The plate-like carrier and metal foil that make up the metal foil with the carrier have the following formula:
The multilayer metal-clad laminate according to any one of claims 29 to 34, wherein the silane compound, a hydrolysis product thereof, and a condensate of the hydrolysis product shown in the above are used alone or in combination. Manufacturing method. - キャリア付き金属箔を構成する金属箔が銅箔又は銅合金箔である請求項29~35のいずれか一項に記載の多層金属張積層板の製造方法。 The method for producing a multilayer metal-clad laminate according to any one of claims 29 to 35, wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
- 請求項29~36のいずれか一項に記載の多層金属張積層板の製造方法において、前記キャリア付金属箔の板状キャリアと金属箔とを剥離して分離する工程を更に含む多層金属張積層板の製造方法。 The method for producing a multilayer metal-clad laminate according to any one of claims 29 to 36, further comprising a step of peeling and separating the plate-like carrier and metal foil of the metal foil with carrier. A manufacturing method of a board.
- 請求項37に記載の製造方法において、剥離して分離した金属箔の一部または全部をエッチングにより除去する工程を含む多層金属張積層板の製造方法。 38. The method for producing a multilayer metal-clad laminate according to claim 37, comprising a step of removing a part or all of the separated and separated metal foil by etching.
- 請求項29~38のいずれか一項に記載の製造方法により得られる多層金属張積層板。 A multilayer metal-clad laminate obtained by the production method according to any one of claims 29 to 38.
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TWI606772B (en) | 2017-11-21 |
JP2017053040A (en) | 2017-03-16 |
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CN104335688A (en) | 2015-02-04 |
JPWO2013183604A1 (en) | 2016-02-01 |
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TW201415981A (en) | 2014-04-16 |
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KR20160126097A (en) | 2016-11-01 |
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